• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• IE interfaces
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• v.8 no.3
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• pp.259-267
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• 1995

A printed circuit board auto-insertion line consists of several processes of identical machines and produces several different types of PCBs. Each board must be processed by at most one machine in each process. So, we call it a flexible flow line. The load balancing is the one of the most important issues in the FFL which has many sequential processes. Therefore we have represented the job route selection model to balance the load of inter-process in the PCB auto-insertion line, and validated it by simulation.

• Journal of Korean Institute of Industrial Engineers
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• v.20 no.4
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• pp.5-21
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• 1994

We have described the optimal process route selection model for the PCB(printed circuit board) auto-insertion line. This PCB assembly line is known as a FFL(flexible flow line) which produces a range of products keeping the flow shop properties. Under FFL environments, we have emphasized the balancing of work-loads in order to maximize total productivity of PCB auto-insertion line. So we have developed a heuristic algorithm based on a work-order selection rule and min-max concept for the job route selection model.

• IE interfaces
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• v.11 no.3
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• pp.1-13
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• 1998

This paper addresses a scheduling scheme for Flexible Flow Shop(FFS) in the case that a factory is a sub-plant of an electronic device manufacturing plant. Under this environment, job orders for the sub-plants in the production route are generated together with job processing time bucket when the customer places orders for final product. The processing time bucket for each job is a duration from possible release date to permissible due date. A sub-plant modeled FFS should schedule these jobs orders within time bucket. Viewing a Printed Circuit Board(PCB) assembly line as a FFS, the developed scheme schedules an incoming order along with the orders already placed on the scheduled. The scheme consists of the four steps, 1)assigning operation release date and due date to each work cells in the FFS, 2)job grouping, 3)dispatching and 4)machine allocation. Since the FFS scheduling problem is NP-complete, the logics used are heuristic. Using a real case, we tested the scheme and compared it with the John's algorithm and other dispatching rules.

• Journal of Institute of Control, Robotics and Systems
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• v.2 no.4
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• pp.337-343
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• 1996

In this paper, we investigate the defect detection by making use of pre-made reference image data and classify the defects by using the artificial neural network. The approach is composed of three main parts. The first step consists of a proper generation of two reference image data by using a low level morphological technique. The second step proceeds by performing three times logical bit operations between two ready-made reference images and just captured image to be tested. This results in defects image only. In the third step, by extracting four features from each detected defect, followed by assigning them into the input nodes of an already trained artificial neural network we can obtain a defect class corresponding to the features. All of the image data are formed in a bit level for the reduction of data size as well as time saving. Experimental results show that proposed algorithms are found to be effective for flexible defect detection, robust classification, and high speed process by adopting a simple logic operation.

• ETRI Journal
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• v.33 no.1
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• pp.121-124
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• 2011

Digital harmonics, which may reduce the radio frequency sensitivity of a system, can be coupled with an antenna in a mobile handset. This letter presents a decoupling method for increasing the isolation between digital harmonics on a flexible printed circuit board (FPCB) and an antenna in terms of the ground mode current and the concept of reaction. We model the signal and ground lines in an FPCB as a loop circuit exciting a ground mode current and demonstrate a simple but efficient decoupling method for reducing the excited ground mode current.

• Korean Journal of Materials Research
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• v.24 no.11
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• pp.632-638
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• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.