• Journal of Advanced Navigation Technology
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• v.23 no.2
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• pp.172-178
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• 2019

This paper has designed, fabricated, and analyzed the passive devices realized using low temperature co-fired ceramic (LTCC) multi layer substrates by dividing into the shrinkage process and the non-shrinkage process. Using two types of ceramic materials with dielectric constant 7 or 40, we have fabricated the same shape of various elements in 2 different processes and compared the characteristics. For the substrate of dielctric constant 40, compared with the shrinkage process which has 17% shrink in the X and Y directions with 36% shrink in the Z direction, the non-shrinkage process has 43% shrink in the Z direction without shrink in the X and Y directions, so high dimensional accuracy and surface flatness can be obtained. The inductances and capacitances of the fabricated elements are estimated from measurement using empirical analysis equations of parameters and implemented as a design library. Depending on the substrate and the process, the inductance and capacitance depending on the turn number of winding and unit area have been measured, and empirical polynomials are proposed to predict element values.

• The Journal of Engineering Geology
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• v.17 no.1 s.50
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• pp.125-133
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• 2007

The environmental and geotechnical properties are investigated to the 8th landfill area made of only sewage sludge in Nanji-Do. To do this, the soils are sampled in this area, and leaching tests, heavy metal content tests, and so on are performed to research the environmental properties. As the result of heavy metal content tests, Pb, Zn, Cu, Ni, Cd and Cr were leached from the sewage sludge. Because the leaching concentration of Cu is more than the standard value of California state, Cu content have to bring down during the recycling of the sewage sludge. Meanwhile, a series of tests concerning specific gravity, liquid and plastic limits, compaction, permeability and shear strength is performed to research the geotechnical properties. The sewage sludge is consisted of sand, silt and clay, and is classified into non-organic silt or organic clay with 42.3% of plastic index. As the result of compaction test, it is expected that the compaction effect according to variation of water contents is low relatively because the dry unit weight is low and the curve of compaction forms flatness. Also, as the result of direct shear tests, the cohesion is $0.058kg/cm^2$, and the internal friction angle is $14^{\circ}$. Taking everything into consideration, the various problems are happening in case of recycling the sludge like the cover layer of landfill and so on because the compaction is bad, and the shear strength is low. Also, it is expected that the ground water pollution caused by leaching the heavy metal into the sludge. To do recycling the sewage sludge in this site, supplementary and treatment programs should be prepared.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.201-212
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• 2005

[ $Epoxy/BaTiO_3$ ] composite embedded capacitor films (ECFs) were newly designed fur high dielectric constant and low tolerance (less than ${\pm}15\%$) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ composite ECF is measured with MIM capacitor at 100 kHz using LCR meter. Dielectric constant of $BaTiO_3$ ECF is bigger than that of $SrTiO_3$ ECF, and it is due to difference of permittivity of $BaTiO_3\;and\;SrTiO_3$ particles. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ ECF in high frequency range $(0.5\~10GHz)$ is measured using cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. Dielectric constant is calculated by observing the frequencies of the resonant cavity modes. About both powders, calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of epoxy matrix. For $BaTiO_3$ ECF, there is the dielectric relaxation at $5\~9GHz$. It is due to changing of polarization mode of $BaTiO_3$ powder. In the case of $SrTiO_3$ ECF, there is no relaxation up to 10GHz. Alternative material for embedded capacitor fabrication is $epoxy/BaTiO_3$ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming capacitor partially in desired part. But the screen printing makes surface irregularity during mask peel-off, Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, dielectric layer with improved thickness uniformity is successfully demonstrated. Using $epoxy/BaTiO_3$ composite ECP, dielectric constant of 63 and specific capacitance of 5.1nF/cm2 were achieved.

• Korean Journal of Medicinal Crop Science
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• v.13 no.1
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• pp.21-29
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• 2005

This study was done to obtain their morphological traits to analyse genetic diversity and intraspecific relationship of 47 Polygonatum species collected from Gyeongnam province. Plant height was the highest in P. thunbergii but the shortest in P. involucratum. Growth habit and its colors were classified to 3 groups, respectively. Leaf shapes were sorted to 5 groups including lanceolate with petiole or none, petiole colors were done to 3 groups including a species having dark green leaves of purple colored margin. Flower shapes were divided as 3 groups of urceolate, tubular and gourd shapes, and its colors were white, greenish white and light green, especially light green in a species with gourd shape. Filament shapes were two types of flatness and cylinder. Peduncle color and bract attached below it showed 4 types, respectively. Fruit shapes were sorted to 3 groups. In 100-fruit weights P. ordoratum var. pluriflorum showed the greatest but P. involucratum did the least. Two species were completely resistant to leaf brightness although 7 species showed less than 7 % infection rates. Rhizome yields ranged from 4.4 g to 94.8 g per plant, showing their significant variation. In correlation analysis between 9 major characters, rhizome yield per plant was positively correlated with plant height, stalk diameter, leaf number, leaf length and width, and rhizome diameter but leaf brightness was negatively done with plant height, stalk diameter, leaf number and length, 100-seed weight, rhizome yield per plan and rhizome diameter.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.11
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• pp.695-700
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• 2018

This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.