• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.108-113
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• 2013

This paper describes a low power asynchronous successive approximation register (SAR) type 12b analog-to-digital converter (ADC) for biomedical applications in a 0.35 ${\mu}m$ CMOS technology. The digital-to-analog converter (DAC) uses a capacitive split-arrays consisting of 6-b main array, an attenuation capacitor C and a 5-b sub array for low power consumption and small die area. Moreover, splitting the MSB capacitor into sub-capacitors and an asynchronous SAR reduce power consumption. The measurement results show that the proposed ADC achieved the SNDR of 68.32 dB, the SFDR of 79 dB, and the ENOB (effective number of bits) of 11.05 bits. The measured INL and DNL were 1.9LSB and 1.5LSB, respectively. The power consumption including all the digital circuits is 6.7 ${\mu}W$ at the sampling frequency of 100 KHz under 3.3 V supply voltage and the FoM (figure of merit) is 49 fJ/conversion-step.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.31-35
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• 2018

This paper describes a low-power, SNDR (signal-to-noise and distortion ration) enhanced SAR (successive approximation register) type 12b ADC (analog-to-digital converter) with noise shaping technique. For low power consumption and small chip size of the DAC (digital-to-analog converter), the top plate sampling technique and the dummy capacitor switching technique are used to implement 12b operation with a 10b capacitor array in DAC. Noise shaping technique is applied to improve the SNDR by reducing the errors from the mismatching of DAC capacitor arrays, the errors caused by attenuation capacitor and the errors from the comparator noise. The proposed SAR ADC is designed with a $0.18{\mu}m$ CMOS process. The simulation results show that the SNDR of the SAR ADC without the noise shaping technique is 71 dB and that of the SAR ADC with the noise shaping technique is 84 dB. We can achieve the 13 dB improvement in SNDR with this noise shaping technique. The power consumption is $73.8{\mu}W$ and the FoM (figure-of-merit) is 5.2fJ/conversion-step.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.71-80
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• 2007

This paper presents a new push-push VCO technique that extracts a second harmonic output signal from a capacitive commonnode in a negativegm oscillator topology. The generation of the $2^{nd}$ harmonics is accounted for by the nonlinear current-voltage characteristic of the emitter-base junction diode causing; 1) significant voltage clipping and 2) different rising and falling time during the switching operation of core transistors. Comparative investigations show the technique is more power efficient in the high-frequency region that a conventional push-push technique using an emitter common node. Prototype 12GHz and 17GHz MMIC VCO were realized in GaInP/GaAs HBT technology. They have shown nominal output power of -4.3dBm and -5dBm, phase noise of -108 dBc/Hz and -110.4 dBc/Hz at 1MHz offset, respectively. The phase noise results are also equivalent to a VCO figure-of-merit of -175.8 dBc/Hz and -184.3 dBc/Hz, while dissipate 25.68mW(10.7mA/2.4V) and 13.14mW(4.38mA/3.0V), respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38A no.4
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• pp.303-309
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• 2013

A low power 6-bit flash ADC that uses an input voltage range detection algorithm is described. An input voltage level detector circuit has been designed to overcome the disadvantages of the flash ADC which consume most of the dynamic power dissipation due to comparators array. In this work, four digital input voltage range detectors are employed and each input voltage range detector generates the specific clock signal only if the input voltage falls between two adjacent reference voltages applied to the detector. The specific clock signal generated by the detector is applied to turn the corresponding latched comparators on and the rest of the comparators off. This ADC consumes 68.82mW with a single power supply of 1.2V and achieves 4.9 effective number of bits for input frequency up to 1MHz at 500 MS/s. Therefore it results in 4.75pJ/step of Figure of Merit (FoM). The chip is fabricated in 0.13-um CMOS process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.301-306
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• 2015

An ultra-compact and wideband low noise amplifier (LNA) in a quad flat non-leaded (QFN) package is presented. The LNA monolithic microwave integrated circuit (MMIC) is implemented in a $0.25{\mu}m$ GaN IC technology on a Silicon Carbide (SiC) substrate provided by Triquint. A source degeneration inductor and a gate inductor are used to obtain the noise and input matching simultaneously. The resistive feedback and inductor peaking techniques are employed to achieve a wideband characteristic. The LNA chip is mounted in the $3{\times}3-mm^2$ QFN package and measured. The supply voltages for the first and second stages are 14 V and 7 V, respectively, and the total current is 70 mA. The highest gain is 13.5 dB around the mid-band, and -3 dB frequencies are observed at 0.7 and 12 GHz. Input and output return losses ($S_{11}$ and $S_{22}$) of less than -10 dB measure from 1 to 12 GHz; there is an absolute bandwidth of 11 GHz and a fractional bandwidth of 169%. Across the bandwidth, the noise figures (NFs) are between 3 and 5 dB, while the output-referred third-order intercept points (OIP3s) are between 26 and 28 dBm. The overall chip size with all bonding pads is $1.1{\times}0.9mm^2$. To the best of our knowledge, this LNA shows the best figure-of-merit (FoM) compared with other published GaN LNAs with the same gate length.

• Journal of IKEEE
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• v.22 no.4
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• pp.1012-1018
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• 2018

In this paper, CMOS SAR (Successive Approximation Register) A/D converter with 1.8V supply voltage is designed for IoT sensor processing. This paper proposes design of a 12-bit SAR A/D converter with two A / D converters in parallel to improve the sampling rate. A/D converter1 of the two A/D converters determines all the 12-bit bits, and another A/D converter2 uses the upper six bits of the other A/D converters to minimize power consumption and switching energy. Since the second A/D converter2 does not determine the upper 6 bits, the control circuits and SAR Logic are not needed and the area is minimized. In addition, the switching energy increases as the large capacitor capacity and the large voltage change in the C-DAC, and the second A/D converter does not determine the upper 6 bits, thereby reducing the switching energy. It is also possible to reduce the process variation in the C-DAC by proposed structure by the split capacitor capacity in the C-DAC equals the unit capacitor capacity. The proposed SAR A/D converter was designed using 0.18um CMOS process, and the supply voltage of 1.8V, the conversion speed of 10MS/s, and the Effective Number of Bit (ENOB) of 10.2 bits were measured. The area of core block is $600{\times}900um^2$, the total power consumption is $79.58{\mu}W$, and the FOM (Figure of Merit) is 6.716fJ / step.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.6
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• pp.454-464
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• 2023

This paper proposes a low-power 8-bit asynchronous SAR ADC with a sampling rate of 1 MS/s for sensor node applications. The ADC uses bootstrapped switches to improve linearity and applies a VCM-based CDAC switching technique to reduce the power consumption and area of the DAC. Conventional synchronous SAR ADCs that operate in synchronization with an external clock suffer from high power consumption due to the use of a clock faster than the sampling rate, which can be overcome by using an asynchronous SAR ADC structure that handles internal comparisons in an asynchronous manner. In addition, the SAR logic is designed using dynamic logic circuits to reduce the large digital power consumption that occurs in low resolution ADC designs. The proposed ADC was simulated in a 180-nm CMOS process, and at a 1.8 V supply voltage and a sampling rate of 1 MS/s, it consumed 46.06 𝜇W of power, achieved an SNDR of 49.76 dB and an ENOB of 7.9738 bits, and obtained a FoM of 183.2 fJ/conv-step. The simulated DNL and INL are +0.186/-0.157 LSB and +0.111/-0.169 LSB.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.196.1-196.1
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• 2016

TCO(Transparent Conducting Oxide) on flat glass is used in thin-film photovoltaic cell, flat-panel display. Nowadays, Corning(R) Willow Glass(R), known as flexible substrate, has attracted much attention due to its many advantages such as reliable roll-to-roll glass processing, high-quality flexible electronic devices, high temperature process. Also, it can be an alternative to flexible polymer substrates which have their poor stability and degradation of electrical and optical qualities. For application on willow glass, the flexibility, electrical, optical properties can be greatly influenced by the TCO thin film thickness due to the inherent characterization of thin film in nanoscale. It can be expected that while thick TCO layer causes poor transparency, its sheet resistance become low. Also, rarely reports were focusing on the influence of flexible properties by varying TCO thickness on flexible glass. Therefore, it is very important to optimize TCO thickness on flexible Willow glass. In this study, Ti-ZnO thin films, with different thickness varied from 0 nm to 50 nm, were deposited on the flexible willow glass by atomic layer deposition (ALD). The flexible, electrical and optical properties were investigated, respectively. Also, these properties of Ti-doped ZnO thin films were compared with un-doped ZnO thin film. Based on the results, when Ti-ZnO thin films thickness increased, resistivity decreased and then saturated; transmittance decreased. The Figure of Merit (FoM) and flexibility was the highest when Ti-ZnO thickness was 40nm. The flexible, electrical and optical properties of Ti-ZnO thin films were better than ZnO thin film at the same thickness.