• Title/Summary/Keyword: field emitter array

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Active-Matrix Field Emission Display with Amorphous Silicon Thin-Film Transistors and Mo-Tip Field Emitter Arrays

  • Song, Yoon-Ho;Hwang, Chi-Sun;Cho, Young-Rae;Kim, Bong-Chul;Ahn, Seong-Deok;Chung, Choong-Heui;Kim, Do-Hyung;Uhm, Hyun-Seok;Lee, Jin-Ho;Cho, Kyoung-Ik
    • ETRI Journal
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    • v.24 no.4
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    • pp.290-298
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    • 2002
  • We present, for the first time, a prototype active-matrix field emission display (AMFED) in which an amorphous silicon thin-film transistor (a-Si TFT) and a molybdenum-tip field emitter array (Mo-tip FEA) were monolithically integrated on a glass substrate for a novel active-matrix cathode (AMC) plate. The fabricated AMFED showed good display images with a low-voltage scan and data signals irrespective of a high voltage for field emissions. We introduced a light shield layer of metal into our AMC to reduce the photo leakage and back channel currents of the a-Si TFT. We designed the light shield to act as a focusing grid to focus emitted electron beams from the AMC onto the corresponding anode pixel. The thin film depositions in the a-Si TFTs were performed at a high temperature of above 360°C to guarantee the vacuum packaging of the AMC and anode plates. We also developed a novel wet etching process for $n^+-doped$ a-Si etching with high etch selectivity to intrinsic a-Si and used it in the fabrication of an inverted stagger TFT with a very thin active layer. The developed a-Si TFTs performed well enough to be used as control devices for AMCs. The gate bias of the a-Si TFTs well controlled the field emission currents of the AMC plates. The AMFED with these AMC plates showed low-voltage matrix addressing, good stability and reliability of field emission, and good light emissions from the anode plate with phosphors.

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Improvement of Geometrical Structure of Cr-Gate Electrode in Mo-tip Field Emitter Array (몰리브덴 팁 전계 방출 소자에 있어서 크롬 게이트 전극 구조의 개선)

  • Ju, Byeong-Kwon;Kim, Hoon;Seo, Sang-Won;Lee, Yun-Hi
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.10
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    • pp.532-535
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    • 2001
  • The sputtering condition of Cr thin film was established in order to get Cr gate electrode having a vertical wall structure for Mo-tip FEA. In case of Mo-tip FEA which had a vertically-etched Cr gate electrode, the field enhancement factor, was relatively increased and so the field emission performance in terms of turn-on voltage, emission current and trans-conductance could be improved when compared with the devices having a tapered gate wall.

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Spindt Cathode Tip Processing to Enhance Emission Stability and High-Current Performance

  • Spindt, C.A.;Schwoebel, P.R.;Holland, C.E.
    • Journal of Information Display
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    • v.2 no.3
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    • pp.44-47
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    • 2001
  • The extracted field emission current can be used to controllably heat microfabricated cold field emission cathode tips. The heating can be sufficient to smooth and recrystallize the tip surface by surface self-diffusion, and at least partially clean the surface of contaminants by thermal desorption. Self-heating not only allows for the achievement and maintenance of stable emission characteristics, but can be used to make the current-voltage characteristics of microfabricated field emitter tips nearly identical to one another. The resulting improvement in emission uniformity will allow for more reliable array operation at increased electron emission current densities.

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Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging (비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용)

  • Ju, Byeong-Kwon;Lee, Duck-Jung;Choi, Woo-Beom;Kim, Young-Cho;Lee, Nam-Yang;Oh, Myung-Hwan
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.9
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    • pp.656-661
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    • 1999
  • As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

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Enhanced Electron Emission of Carbon Nanotube Arrays Grown Using the Resist-Protection-assisted Positioning Technique

  • Ryu, Je-Hwang;Kim, Ki-Seo;Yu, Yi-Yin;Lee, Chang-Seok;Lee, Yi-Sang;Jang, Jin;Park, Kyu-Chang
    • Journal of Information Display
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    • v.9 no.4
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    • pp.30-34
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    • 2008
  • Field emitter arrays (FEAs) were developed using carbon nanotubes (CNTs) as electron emission sources. The CNTs were grown using a selective-positioning technique with a resist-protection layer. The light emission properties were studied through the electron emission of the CNTs on patterned islands, which were modulated with island diameter and spacing. The electron emission of CNT arrays with $5{\mu}m$ diameters and $10{\mu}m$ heights increased with increased spacing (from $10{\mu}m$ to $40{\mu}m$). The electron emission current of the $40-{\mu}m$-island-spacing sample showed a current density of 1.33 mA/$cm^2$ at E = 11 V/${\mu}m$, and a turn-on field of 7 V/${\mu}m$ at $1{\mu}A$ emission current. Uniform electron emission current and light emission were achieved with $40{\mu}m$ island spacing and $5{\mu}m$ island diameter.

Field Emission Characteristics of Surface-treated CNT Emitter by Ar Ion Bombardment (아르곤 이온에 의해 표면처리된 CNT 에미터의 전계방출 특성)

  • Kwon, Sang-Jik
    • 전자공학회논문지 IE
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    • v.44 no.2
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    • pp.26-31
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    • 2007
  • A surface treatment was performed after the screen printing of a carbon nanotube paste for obtaining the carbon nanotube field emission array(CNT FEA) on the soda-lime glass substrate. In this experiment, Ar ion bombardment was applied as an effective surface treatment method. After making a cathode electrode on the glass substrate, photo sensitive CNT paste was screen-printed, and then back-side was exposure by uv light. Then, the exposed CNT paste was selectively remained by development. After post-baking, the remained CNT paste was bombarded by accelerated Ar ions for removing some binders and exposing only CNTs. As results, the field emission characteristics were strongly depended on the accelerating energy. At 100 eV, the emission was highest and as the acceleration energy increases more then 100 eV, the emission decreased. This was due to the removal of CNT itself as well as binders.

Circuit Modeling and Simulation of Active Controlled Field Emitter Array for Display Application (디스플레이 응용을 위한 능동 제어형 전계 에미터 어레이의 회로 모델링 및 시뮬레이션)

  • Lee, Yun-Gyeong;Song, Yun-Ho;Yu, Hyeong-Jun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.2
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    • pp.114-121
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    • 2001
  • A circuit model for active-controlled field emitter array(ACFEA) as an electron source of active-controlled field emission display(ACFED) has been proposed. The ACFEA with hydrogenated amorphous silicon thin-film transistor(a-Si:H TFT) and Spindt-type molibdenum tips (Spindt-Mo FEA) has been fabricated monolithically on the same glass. A-Si:H TFT is used as a control device of field emitters, resulting in stabilizing emission current and lowering driving voltage. The basic model parameters extracted from the electrical characteristics of the fabricated a-Si:H TFT and Spindt-Mo FEA were implemented into the ACFEA model with a circuit simulator SPICE. The accuracy of the equivalent circuit model was verified by comparing the simulated results with the measured one through DC analysis of the ACFEA. The transient analysis of the ACFEA showed that the gate capacitance of FEA along with the drivability of TFT strongly affected the response time. With the fabricated ACFEA, we obtained a response time of 15$mutextrm{s}$, which was enough to make 4bit/color gray scale with the pulse width modulation (PWM).

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Fabrication and Characterization of Si-tip Field Emitter Array (실리콘 팁 전계 방출 소자의 제조 및 동작 특성 평가)

  • 주병권;이상조;박재석;이윤희;전동렬;오명환
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.1
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    • pp.65-73
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    • 1999
  • Si-tip FEAs were fabricated by a lift-off based process and their operating properties were evaluated. The dependence of emission current on applied gate and anode voltages, maximum emission current, hysteresis phenomena, MOSFET-type curves, current fluctuation, light emission from the emitted electrons, and failure mechanism of the device were widely discussed based on the experimental results.

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Fabrication of New Ti-silicide Field Emitter Array with Long Term Durability (Ti-실리사이드를 이용한 새로운 고내구성 전계방출소자의 제작)

  • Jang, Ji-Geun;Baek, Dong-Gi;Yun, Jin-Mo;Yun, Jin-Mo;Im, Seong-Gyu;Jang, Ho-Jeong
    • Korean Journal of Materials Research
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    • v.8 no.1
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    • pp.10-12
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    • 1998
  • Si FEA 로부터 tip의 표면을 Ti금속으로 silicidation한 새로운 2극형 Ti-실리사이드 FEA를 제작하고 이의 전계방출 특성을 Si FEA의 경우와 비교하였다. 양극과 음극간의 거리를 10$\mu\textrm{m}$로 유지하고 $10^{-8}$Torr의 고진공 상태에서 측정한 실리사이드 FEA의 turn-on전압은 약 40V로, 전계방출전류와 정상상태 전류 변동율은 150V의 바이어스 아래에서 약 3x$10^{-2}$ $\mu$A/tip와 0.1%min로 나타났다. Ti-실리사이드 FEA는 Si FEA에 비해 낮은 turn-on 전압, 높은 전계방출전류 및 고내구특성을 나타내었다.

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Circuit modeling and simulation of active controlled field emitter array for display application (디스플레이 응용을 위한 능동 제어형 전계 에미터 어레이의 회로 모델링 및 시뮬레이션)

  • Lee, Yun Gyeong;Song, Yun Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.2
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    • pp.28-28
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    • 2001
  • 능동제어형 전계방출 디스플레이의 전자공급원으로서 능동제어형 전계 에미터 어레이의 회로모델이 제안되었다. 능동제어형 전계 에미터 어레이는 전계방출을 안정화시키고 저전력구동을 위한 수소화 된 비정질 실리콘 박막 트랜지스터와 Spindt형 Mo 전계 에미터 어레이로 구성되었고 같은 유리기판 위에 제작되었다. 비정질 박막 트랜지스터와 Spindt형 Mo 전계 에미터 어레이의 전기적 특성으로부터 추출된 기본 모델 변수는 제안된 능동제어형 전계 에미터 어레이 회로모델에 입력되었고 SPICE 회로 시뮬레이터를 사용하여 특성을 분석하였다. 제작된 소자의 측정값과 DC 시뮬레이션 결과를 비교한 결과 두 값이 상당히 일치함으로써 등가회로 모델의 정확성을 확인하였다. 또한 제작된 소자의 transient 시뮬레이션 결과 전계 에미터 어레이의 게이트 커패시턴스와 TFT의 구동능력이 반응시간에 가장 크게 영향을 끼치고 있음을 확인하였다. 제작된 능동제어형 전계방출 에미터 어레이는 pulse width modulation으로 구동하는 경우 15㎲의 반응시간을 얻었고 이 값으로는 4bit/color의 계조(gray scale)표현이 가능하였다.