• Title/Summary/Keyword: field effect transistor

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산소유량 변화에 의한 산소 과포화된 HfOx 박막의 고온 열처리에 따른 Nanomechanics 특성 연구

  • Park, Myeong-Jun;Lee, Si-Hong;Kim, Su-In;Lee, Chang-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.389-389
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    • 2013
  • HfOx (Hafnium oxide)는 ~25의 고유전상수, 5.25 eV의 비교적 높은 Band-gap을 갖는 물질로 MOSFET (metal-oxide semiconductor field-effect-transistor) 구조의 Oxide 박막을 대체 가능한 물질로 연구가 지속되고 있다. 현재까지 진행된 대다수의 연구는 증착 조건에 따른 박막의 결정학적 및 전기적 특성에 대한 주제로 진행되었고 다양한 연구 결과가 보고된바 있다. 하지만 기존의 연구 기법은 박막의 nanomechanics 특성에 대한 연구가 부족하여 이를 보완하기 위한 연구가 절실하다. 따라서 본 연구에서는 HfOx 박막 내 포함된 산소가 고온 열처리 과정에서 빠져나감으로 인한 박막의 nanomechanics 특성을 확인하고자 하였다. 시료는 rf magnetron sputter를 이용하여Si (silicon) 기판위에 Hafnium target으로 산소유량(5, 10, 15 sccm)을 달리하여 증착하였고, 이후 furnace에서 $400^{\circ}C$에서 $1,000^{\circ}C$까지 질소분위기에서 20분간 열처리를 실시하였다. 실험결과 시료의 전기적 특성을 I-V 곡선을 측정하여 확인하였고, 증착 시 산소 유량이 5 sccm에서 15 sccm으로 증가함에 따라서 누설전류 특성은 급격히 향상되었고, 열처리 온도가 증가함에 따라 감소하는 특성을 나타내었다. 또한 시료의 nanomechanics 특성을 확인하기 위하여 nano-indenter를 이용하여 시료의 표면강도(surface hardness)와 탄성계수(elastic modulus)를 확인하였다. 측정결과 5 sccm 시료의 표면강도와 탄성계수는 상온에서 열처리 온도가 증가함에 따라 각각 7.75 GPa에서 9.19 GPa로, 그리고 133.83 GPa에서 126.64 GPa로 10, 15 sccm의 박막의 비하여 상대적으로 균일한 특성을 나타내었다. 이는 증착 시 박막 내 과포화된 산소가 열처리 과정에서 빠져나감으로 인한 것이며, 또한 과포화된 정도에 따라 더 적은 열처리 에너지에 의하여 박막을 빠져나감으로 인한 것으로 판단된다. 또한 열처리 과정에서 산소가 빠져나가는 상대적인 flux의 영향으로 인하여 박막의 mechanical한 균일도의 변화가 나타났다.

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A Flexible Amorphous $Bi_5Nb_3O_{15}$ Film for the Gate Insulator of the Low-Voltage Operating Pentacene Thin-Film Transistor Fabricated at Room Temperature

  • Kim, Jin-Seong;Cho, Kyung-Hoon;Seong, Tae-Geun;Choi, Joo-Young;Nahm, Sahn
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.03a
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    • pp.17-17
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    • 2010
  • The amorphous $Bi_5Nb_3O_{15}$ film grown at room temperature under an oxygen-plasma sputtering ambient (BNRT-$O_2$ film) has a hydrophobic surface with a surface energy of $35.6\;mJm^{-2}$, which is close to that of the orthorhombic pentacene ($38\;mJm^{-2}$, resulting in the formation of a good pentacene layer without the introduction of an additional polymer layer. This film was very flexible, maintaining a high capacitance of $145\;nFcm^{-2}$ during and after 10s bending cycles with a small curvature radius of 7.5 mm. This film was optically transparent. Furthermore, the flexible, pentacene-based, organic thin-film transistors (OTFTs) fabricated on the polyethersulphone substrate at room temperature using a BNRT-$O_2$ film as a gate insulator exhibited a promising device performance with a high field effect mobility of $0.5\;cm^2V^{-1}s^{-1}$, an on/off current modulation of $10^5$ and a small subthreshold slope of $0.2\;Vdecade^{-1}$ under a low operating voltage of -5 V. This device also maintained a high carrier mobility of $0.45\;cm^2V^{-1}s^{-1}$ during the bending with a small curvature radius of 9 mm. Therefore, the BNRT-$O_2$ film is considered a promising material for the gate insulator of the flexible, pentacene-based OTFT.

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Investigation of Top-Contact Organic Field Effect Transistors by the Treatment Using the VDP Process on Dielectric

  • Kim, Young-Kwan;Hyung, Gun-Woo;Park, Il-Houng;Seo, Ji-Hoon;Seo, Ji-Hyun;Kim, Woo-Young
    • Journal of the Korean Applied Science and Technology
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    • v.24 no.1
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    • pp.54-60
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    • 2007
  • 이 논문에서는 게이트 절연막 위에 vapor deposition polymerization(VDP)방법을 사용하여 성막한 유기 점착층을 진공 열증착하여 유기 박막 트랜지스터(OTFTs)소자를 제작할 수 있음을 증명하였다. 우리가 제작한 Staggered-inverted top-contact 구조를 사용한 유기 박막 트랜지스터는 전기적 output 특성이 포화 영역안에서는 포화곡선을, triode 영역에서는 비선형적인 subthreshold를 확실히 볼 수 있음을 발견했다. $0.2{\mu}m$ 두께를 가진 게이트 절연막위에 유기 점착층을 사용한 OTFTs의 장 효과 정공의 이동도와 문턱전압, 그리고 절멸비는 각각, 약 0.4cm2/Vs, -0.8V, 106 이 측정되었다. 게이트 절연막의 점착층으로써 폴리이미드의 성막을 위해, 스핀코팅 방법 대신 VDP 방법을 도입하였다. 폴리이미드 고분자막은 2,2bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride(6FDA)와 4,4'-oxydianiline(ODA)을 고진공에서 동시에 열 증착 시킨 후, 그리고 $150^{\circ}C$에서 1시간, 다시 $200^{\circ}C$에서 1시간 열처리하여 고분자화된 막을 형성하였다. 그리고 점착층이 OTFTs의 전기적 특성에 주는 영향을 설명하기 위해 비교 연구하였다.

High-Performance Amorphous Multilayered ZnO-SnO2 Heterostructure Thin-Film Transistors: Fabrication and Characteristics

  • Lee, Su-Jae;Hwang, Chi-Sun;Pi, Jae-Eun;Yang, Jong-Heon;Byun, Chun-Won;Chu, Hye Yong;Cho, Kyoung-Ik;Cho, Sung Haeng
    • ETRI Journal
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    • v.37 no.6
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    • pp.1135-1142
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    • 2015
  • Multilayered ZnO-$SnO_2$ heterostructure thin films consisting of ZnO and $SnO_2$ layers are produced by alternating the pulsed laser ablation of ZnO and $SnO_2$ targets, and their structural and field-effect electronic transport properties are investigated as a function of the thickness of the ZnO and $SnO_2$ layers. The performance parameters of amorphous multilayered ZnO-$SnO_2$ heterostructure thin-film transistors (TFTs) are highly dependent on the thickness of the ZnO and $SnO_2$ layers. A highest electron mobility of $43cm^2/V{\cdot}s$, a low subthreshold swing of a 0.22 V/dec, a threshold voltage of 1 V, and a high drain current on-to-off ratio of $10^{10}$ are obtained for the amorphous multilayered ZnO(1.5nm)-$SnO_2$(1.5 nm) heterostructure TFTs, which is adequate for the operation of next-generation microelectronic devices. These results are presumed to be due to the unique electronic structure of amorphous multilayered ZnO-$SnO_2$ heterostructure film consisting of ZnO, $SnO_2$, and ZnO-$SnO_2$ interface layers.

Si-core/SiGe-shell channel nanowire FET for sub-10-nm logic technology in the THz regime

  • Yu, Eunseon;Son, Baegmo;Kam, Byungmin;Joh, Yong Sang;Park, Sangjoon;Lee, Won-Jun;Jung, Jongwan;Cho, Seongjae
    • ETRI Journal
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    • v.41 no.6
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    • pp.829-837
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    • 2019
  • The p-type nanowire field-effect transistor (FET) with a SiGe shell channel on a Si core is optimally designed and characterized using in-depth technology computer-aided design (TCAD) with quantum models for sub-10-nm advanced logic technology. SiGe is adopted as the material for the ultrathin shell channel owing to its two primary merits of high hole mobility and strong Si compatibility. The SiGe shell can effectively confine the hole because of the large valence-band offset (VBO) between the Si core and the SiGe channel arranged in the radial direction. The proposed device is optimized in terms of the Ge shell channel thickness, Ge fraction in the SiGe channel, and the channel length (Lg) by examining a set of primary DC and AC parameters. The cutoff frequency (fT) and maximum oscillation frequency (fmax) of the proposed device were determined to be 440.0 and 753.9 GHz when Lg is 5 nm, respectively, with an intrinsic delay time (τ) of 3.14 ps. The proposed SiGe-shell channel p-type nanowire FET has demonstrated a strong potential for low-power and high-speed applications in 10-nm-and-beyond complementary metal-oxide-semiconductor (CMOS) technology.

Design of Dual-band Power Amplifier using CRLH of Metamaterials (메타구조의 CRLH를 이용한 이중대역 전력증폭기 설계)

  • Ko, Seung-Ki;Seo, Chul-Hun
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.47 no.12
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    • pp.78-83
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    • 2010
  • In this paper, a novel dual-band power amplifier using metamaterials has been realized with one RF GaN HEMT diffusion metal-oxide-semiconductor field effect transistor. The CRLH TL can lead to metamaterial transmission line with the dual-band tuning capability. The dual-band operation of the CRLH TL is achieved by the frequency offset and the nonlinear phase slope of the CRLH TL for the matching network of the power amplifier. We have managed only the second- and third-harmonics to obtain the high efficiency with the CRLH TL in dual-band. Also, the proposed power amplifier has been realized by using the harmonic control circuit for not only the output matching network, but also the input matching network for better efficiency. Two operating frequencies are chosen at 900 MHz and 2140 MHz in this work. The measured results show that the output power of 39.83 dBm and 35.17 dBm was obtained at 900 MHz and 2140 MHz, respectively. At this point, we have obtained the power-added efficiency (PAE) and IMD of 60.2 %, -23.17dBc and 67.3 %, -25.67dBc at two operation frequencies, respectively.

The Etching Mechanism of $CeO_2$ Thin Films using Inductively Coupled Plasma (유도 결합 플라즈마를 이용한 $CeO_2$ 박막의 식각 메카니즘)

  • 오창석;김창일
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.9
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    • pp.695-699
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    • 2001
  • Cerium dioxide (CeO$_2$) was used as the intermediate layer between the ferroelectric thin film and Si substrate in a metal-ferroelectric-semiconductor field effect transistor (MFSFET), to improve the interface property by preventing the interdiffusion of the ferroelectric material and the Si substrate. In this study, CeO$_2$ thin films were etched with a CF$_4$/Ar gas combination in inductively coupled plasma (ICP). The maximum etch rate of CeO$_2$ thin films was 270$\AA$/min under CF$_4$/(CF$_4$+Ar) of 0.2, 600 W/-200V, 15 mTorr, and $25^{\circ}C$. The selectivities of CeO$_2$ to PR and SBT were 0.21, 0.25, respectively. The surface reaction in the etching of CeO$_2$ thin films was investigated with x-ray photoelectron spectroscopy (XPS). There is a chemical reaction between Ce and F. Compounds such as Ce-F$_{x}$ remains on the surface of CeO$_2$ thin films. Those products can be removed by Ar ion bombardment. The results of secondary ion mass spectrometry (SIMS) were consistent with those of XPS. Scanning electron microscopy (SEM) was used to examine etched profiles of CeO$_2$ thin films. The etch profile of over-etched CeO$_2$ films with the 0.5${\mu}{\textrm}{m}$ line was approximately 65$^{\circ}$.>.

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Numerical Analysis of a Two-Dimensional N-P-N Bipolar Transistor-BIPOLE (2차원 N-P-N 바이폴라 트랜지스터의 수치해석-BIPOLE)

  • 이종화
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.2
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    • pp.71-82
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    • 1984
  • A programme, called BIPOLE, for the numerical analysis of twotimensional n-p-n bipolar transistors was developed. It has included the SRH and Auger recolnbination processes, the mobility dependence on the impurity density and the electric field, and the band-gap narrowing effect. The finite difference equations of the fundamental semiconductor equations are formulated using Newton's method for Poisson's equation and the divergence theorem for the hole and electron continuity equations without physical restrictions. The matrix of the linearized equations is sparse, symmetric M-matrix. For the solution of the linearized equations ICCG method and Gummel's algorithm have been employed. The programme BIPOLE has been applied to various kinds of the steady-state problems of n-p-n transistors. For the examples of applications the variations of common emitter current gain, emitter and diffusion capacitances, and input and output characteristics are calculated. Three-dimensional representations of some D.C. physical quantities such as potential and charge carrier distributions were displayed. This programme will be used for the nome,rical analysis of the distortion phenom ana of two-dimensional n-p-n transistors. The BIPOLE programme is available for everyone.

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Design of Variable Gain Receiver Front-end with Wide Gain Variable Range and Low Power Consumption for 5.25 GHz (5.25 GHz에서 넓은 이득 제어 범위를 갖는 저전력 가변 이득 프론트-엔드 설계)

  • Ahn, Young-Bin;Jeong, Ji-Chai
    • Journal of IKEEE
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    • v.14 no.4
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    • pp.257-262
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    • 2010
  • We design a CMOS front-end with wide variable gain and low power consumption for 5.25 GHz band. To obtain wide variable gain range, a p-type metal-oxide-semiconductor field-effect transistor (PMOS FET) in the low noise amplifier (LNA) section is connected in parallel. For a mixer, single balanced and folded structure is employed for low power consumption. Using this structure, the bias currents of the transconductance and switching stages in the mixer can be separated without using current bleeding path. The proposed front-end has a maximum gain of 33.2 dB with a variable gain range of 17 dB. The noise figure and third-order input intercept point (IIP3) are 4.8 dB and -8.5 dBm, respectively. For this operation, the proposed front-end consumes 7.1 mW at high gain mode, and 2.6 mW at low gain mode. The simulation results are performed using Cadence RF spectre with the Taiwan Semiconductor Manufacturing Company (TSMC) $0.18\;{\mu}m$ CMOS technology.)

A Study on Evaluation of Power Management IC (전원모듈 PMIC 특성평가에 관한 연구)

  • Lho, Young Hwan
    • Journal of IKEEE
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    • v.20 no.3
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    • pp.260-264
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    • 2016
  • The MAX77846, which is compatible with MAX77826, is a sub-power management IC (PMIC) for the latest Wearable Watch and 3G/4G smart phones. The MAX77846 contains N-MOSFET (N channel Metal-Oxide Semiconductor Field-Effect Transistor), a high-efficiency regulator, and comparator, etc to power up peripherals. The MAX77846 also provides power on/off control logic for complete flexibility and an $I^2C$ (Inter Integrated Circuit) serial interface to program individual regulator output voltages. In this paper, the simplified power macro-model based on MAX77846 is designed to verify the performance of the battery voltage in terms of current and time, and simulated by using of the LTspice. In addition, it is verified how much time can the charged battery capacity for Samsung Galaxy Gear 2 be used to operate a specified function after measuring the currents flowing to carry out the main functions in real time, which will be applicable to design parameters for the advanced power module