• Transactions of Materials Processing
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• v.31 no.6
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• pp.365-375
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• 2022

The microstructure and high-temperature plastic deformation behavior of the modified Al-0.7Mn alloy were investigated and compared with the conventional Al-0.3Mn (Al3102) alloy. α-Al (matrix) and Al₆(Mn, Fe) phases were identified in both alloys. As a result of microstructure observation, both alloys showed equiaxed grains, and Al-0.7Mn alloy showed larger grain size and higher Al₆(Mn, Fe) fraction than Al-0.3Mn alloy. High temperature compressive tests, the deformation temperatures of 410℃, 450℃, 490℃, 530℃ and strain rats of 10^-2/s, 10^-1/s, 1/s, 10/s, were conducted using Gleeble equipment. The flow stress values of Al-0.7Mn alloy were higher than that of Al-0.3Mn alloy at all strain rates and temperature conditions. Constitutive equations were presented using the flow stresses obtained from experimental results and the Zener-Hollomon parameter. In the true stress-true strain curves of the two alloys, the experimental and predicted values were in good agreement with each other. Based on the dynamic material model, eutectic deformation maps of Al-0.7Mn and Al-0.3Mn alloys were suggested, and the plastic instability region was presented. The modified Al-0.7Mn alloy showed a wider plastic instability region than that Al-0.3Mn alloy. Based on the process deformation maps, the MPE tube parts could be manufactured through the actual extrusion process using the suggested conditions.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.19 no.2
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• pp.161-176
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• 2021

In this study, the electrochemical behavior of Sm on the binary liquid Al-Ga cathode in the LiCl-KCl molten salt system is investigated. First, the co-reduction process of Sm(III)-Al(III), Sm(III)-Ga(III), and Sm(III)-Ga(III)-Al(III) on the W electrode (inert) were studied using cyclic voltammetry (CV), square-wave voltammetry (SWV) and open circuit potential (OCP) methods, respectively. It was identified that Sm(III) can be co-reduced with Al(III) or Ga(III) to form Al_zSm_y or Ga_xSm_y intermetallic compounds. Subsequently, the under-potential deposition of Sm(III) at the Al, Ga, and Al-Ga active cathode was performed to confirm the formation of Sm-based intermetallic compounds. The X-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS) analyses indicated that Ga₃Sm and Ga₆Sm intermetallic compounds were formed on the Mo grid electrode (inert) during the potentiostatic electrolysis in LiCl-KCl-SmCl₃-AlCl₃-GaCl₃ melt, while only Ga₆Sm intermetallic compound was generated on the Al-Ga alloy electrode during the galvanostatic electrolysis in LiCl-KCl-SmCl₃ melt. The electrolysis results revealed that the interaction between Sm and Ga was predominant in the Al-Ga alloy electrode, with Al only acting as an additive to lower the melting point.

• Journal of Powder Materials
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• v.26 no.4
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• pp.299-304
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• 2019

Nb-Si-B alloys with Nb-rich compositions are fabricated by spark plasma sintering for high-temperature structural applications. Three compositions are selected: 75 at% Nb (Nb0.7), 82 at% Nb (Nb1.5), and 88 at% Nb (Nb3), the atomic ratio of Si to B being 2. The microstructures of the prepared alloys are composed of Nb and $T_2$ phases. The $T_2$ phase is an intermetallic compound with a stoichiometry of $Nb_5Si_{3-x}B_x$ ($0{\leq}x{\leq}2$). In some previous studies, Nb-Si-B alloys have been prepared by spark plasma sintering (SPS) using Nb and $T_2$ powders (SPS 1). In the present work, the same alloys are prepared by the SPS process (SPS 2) using Nb powders and hypereutectic alloy powders with composition 67at%Nb-22at%Si-11at%B (Nb67). The Nb67 alloy powders comprise $T_2$ and eutectic ($T_2+Nb$) phases. The microstructures and hardness of the samples prepared in the present work have been compared with those previously reported; the samples prepared in this study exhibit finer and more uniform microstructures and higher hardness.

• Metals and materials international
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• v.24 no.6
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• pp.1213-1220
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• 2018

The effects of Cr and Fe addition on the mechanical properties of Ti-6Al-4V alloys prepared by direct energy deposition were investigated. As the Cr and Fe concentrations were increased from 0 to 2 mass%, the tensile strength increased because of the fine-grained equiaxed prior ${\beta}$ phase and martensite. An excellent combination of strength and ductility was obtained in these alloys. When the Cr and Fe concentrations were increased to 4 mass%, extremely fine-grained martensitic structures with poor ductility were obtained. In addition, Fe-added Ti-6Al-4V resulted in a partially melted Ti-6Al-4V powder because of the large difference between the melting temperatures of the Fe eutectic phase (Ti-33Fe) and the Ti-6Al-4V powder, which induced the formation of a thick liquid layer surrounding Ti-6Al-4V. The ductility of Fe-added Ti-6Al-4V was thus poorer than that of Cr-added Ti-6Al-4V.

• Journal of the Korean Ceramic Society
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• v.56 no.1
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• pp.104-110
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• 2019

The low-temperature sintering behavior of AlN was investigated through a conventional method. $CaF_2$, CuO and Cu were selected as additives based on their low melting points. When sintered at $1600^{\circ}C$ for 8 h in $N_2$ atmosphere, a sample density > 98% was obtained. The X-ray data indicated that eutectic reactions below $1200^{\circ}C$ were found. Therefore, the current systems have lower liquid formation temperatures than other systems. The liquid phase showed high dihedral angles at triple grain junctions, indicating that the liquid had poor wettability on the grain surfaces. Eventually, the liquid was likely to vaporize due to the unfavorable wetting condition. As a result, a microstructure with clean grain boundaries was obtained, resulting in higher contiguity between grains. From EDS analysis, oxygen impurity seems to be well removed in AlN lattice. Therefore, it is believed that the current systems are beneficial for reducing sintering temperature and improving oxygen removal.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.931-937
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• 2012

The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.

• Korean Journal of Metals and Materials
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• v.47 no.7
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• pp.440-446
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• 2009

Co base superalloys have been widely used for the parts of gas turbine due to their excellent strength, thermal fatigue, oxidation resistance and weldability at high temperature. In this study, directional solidifications were carried out at various solidification rates, including $0.5{\sim}300{\mu}m/s$ in the Co base superalloy FSX-414. The cellular interface were formed at a low solidification rate, $1{\mu}m/s$, and the dendritic interface was found at higher solidification rates, $5{\sim}300{\mu}m/s$. As the spacing of dendrite structure decreased, the size and spacing of eutectics decreased. Dendrite arm spacing decreased with increasing solidification rates and temperature gradient. It was interesting to find the $M_{23}C_{6}$ eutectic microstructure formed between $\gamma$ dendrites. Composition analysis showed that Cr and W were segregated severely between the dendrites, which resulted in the formation of Cr-rich $M_{23}C_{6}$ and W-rich MC carbides.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.897-905
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• 2012

Directional solidification experiments were carried out in a hypoeutectic Al-11.3Si-3.5Cu system to investigate the microstructural evolution with the solidification rate. At a fixed temperature gradient, a dendritic microstructure was observed at a constant speed of more than $25{\mu}ms^{-1}$, a cellular interface developed at $5{\mu}ms^{-1}$ and the growth rate of $0.5{\mu}ms^{-1}$ led to the stability of the planar interface. The results revealed that primary silicon phases formed among cells, even though the studied Al-Si alloy system formed the composition within a hypoeutectic silicon composition. This suggests that the liquid concentration among cells during solidification reached a higher concentration, i.e., the eutectic concentration. It is, however, interesting that primary silicon phases did not form during a dendritic growth of more than $25{\mu}ms^{-1}$. These experimental observations are explained using the theoretical models on the interface temperatures.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.605-612
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• 2009

The suitability of twin roll strip casting for Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni brazing alloy (known as HS-49D) was examined in the present work and the mechanical properties and microstructure of the strip were also investigated. The effect of annealing heat treatment on the properties was also studied. The new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analyses of the Ag-27.5%Cu-20.5%Zn-2.5%Mn-0.5%Ni strip revealed a eutectic microstructure of an Ag-rich matrix (FCC) and a Cu-rich phase (FCC) regardless of heat treatment. The results of mechanical tests showed tensile strength of 434 MPa and 80% elongation for the twin roll casted strip. Tensile results showed decreasing strengths and increasing elongation with annealing heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.