Browse > Article
http://dx.doi.org/10.4191/kcers.2019.56.1.05

Low-Temperature Sintering Behavior of Aluminum Nitride Ceramics with Added Copper Oxide or Copper  

Hwang, Jin-Geun (The Center of Biomedical Materials and Biotechnology, The Center of Green Materials Technology, Department of Materials Science and Engineering, Andong National University)
Oh, Kyung-Sik (The Center of Biomedical Materials and Biotechnology, The Center of Green Materials Technology, Department of Materials Science and Engineering, Andong National University)
Chung, Tai-Joo (The Center of Biomedical Materials and Biotechnology, The Center of Green Materials Technology, Department of Materials Science and Engineering, Andong National University)
Kim, Tae-Heui (The Center of Biomedical Materials and Biotechnology, The Center of Green Materials Technology, Department of Materials Science and Engineering, Andong National University)
Paek, Yeong-Kyeun (The Center of Biomedical Materials and Biotechnology, The Center of Green Materials Technology, Department of Materials Science and Engineering, Andong National University)
Publication Information
Abstract
The low-temperature sintering behavior of AlN was investigated through a conventional method. $CaF_2$, CuO and Cu were selected as additives based on their low melting points. When sintered at $1600^{\circ}C$ for 8 h in $N_2$ atmosphere, a sample density > 98% was obtained. The X-ray data indicated that eutectic reactions below $1200^{\circ}C$ were found. Therefore, the current systems have lower liquid formation temperatures than other systems. The liquid phase showed high dihedral angles at triple grain junctions, indicating that the liquid had poor wettability on the grain surfaces. Eventually, the liquid was likely to vaporize due to the unfavorable wetting condition. As a result, a microstructure with clean grain boundaries was obtained, resulting in higher contiguity between grains. From EDS analysis, oxygen impurity seems to be well removed in AlN lattice. Therefore, it is believed that the current systems are beneficial for reducing sintering temperature and improving oxygen removal.
Keywords
AlN; $CaF_2$; CuO; Cu; Low-temperature sintering;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 H.-J. Lee, S.-W. Kim, and S.-S. Ryu, "Sintering Behavior of Aluminum Nitride Ceramics with $MgO-CaO-Al_2O_3-SiO_2$ Glass Additive," Int. J. Refract. Met. Hard Mater., 53 46-50 (2015).   DOI
2 Y. Xiong, H. Wang, and Z. Fu, "Transient Liquid-Phase Sintering of AlN with $CaF_2$ Additive," J. Eur. Ceram. Soc., 33 [11] 2199-205 (2013).   DOI
3 A. L. Molisani, H. N. Yoshimura, and H. Goldenstein, "Sintering Mechanisms in Aluminum Nitride with Y or Ca-Containing Additive," J. Mater. Sci.: Mater. Electron., 20 [1] 1-8 (2009).
4 J. P. Holman, Heat Transfer; p. 9, McGraw-Hill, Inc., 1981.
5 M. Medraj, Y. Baik, W. T. Thomson, and R. A. L. Drew, "Understanding AlN Sintering through Computational Thermodynamics Combined with Experimental Investigation," J. Mater. Process. Technol., 161 [3] 415-22 (2005).   DOI
6 K. F. Cai, D. S. McLachian, G. Sauti, and E. Mueller, "The Effects of Annealing on Thermal and Electrical Properties of Reaction-Bonded AlN Ceramic," Solid State Sci., 7 [8] 945-49 (2005).   DOI
7 T. B. Jackson, A. V. Virkar, K. I. More, R. B. Dinwiddie Jr., and R. A. Cutler, "High-Thermal-Conductivity Aluminum Nitride Ceramic: The Effect of Thermodynamics, Kinetic, and Microstructural Factors," J. Am. Ceram. Soc., 80 [6] 1421-35 (1997).   DOI
8 J. Hong, J.-H. Lee, Y.-N. Oh, K.-J. Cho, D.-H. Riu, S.-T. Oh, and C.-Y. Hyun, "Direct Bonding of Cu/AlN Using Cu-$Cu_2O$ Eutectic Liquid," J. Korean Powder Metall. Inst., 20 [2] 114-19 (2013).   DOI
9 P. Zhang, R. Fu, Y. Tang, B. Cao, M. Fei, and Y. Yang, "Morphology of Thick Film Metallization on Aluminum Nitride Ceramics and Composition of Interface Layer," Ceram. Int., 41 [10] 13381-88 (2015).   DOI
10 Y. Liu, H. Zhou, L. Qiao, and Y. Wu, "Low-Temperature Sintering of Aluminum Nitride with $YF_3-CaF_2$ Binary Additive," J. Mater. Sci. Lett., 18 [9] 703-4 (1999).   DOI
11 H. Nakano, K. Watari, and K. Urabe, "Grain Boundary Phase in AlN Ceramics Fired under Reducing $N_2$ Atmosphere with Carbon," J. Eur. Ceram. Soc., 23 [10] 1761-68 (2003).   DOI
12 R. M. German, Sintering Theory and Practice; pp. 293-98, John Wiley & Sons, Inc., 1996.
13 R. Kobayashi, Y. Nakajima, K. Mochizuki, K. Harata, T. Koto, K. Iwai, and J. Tatami, "Densification of AlN Ceramics by Spark plasma Sintering under $1550^{\circ}C$," Adv. Powder Technol., 27 [3] 860-63 (2016).   DOI
14 T. Kusunose and T. Sekino, "Improvement in Fracture Strength in Electrically Conductive AlN Ceramics with High Thermal Conductivity," Ceram. Int., 42 [11] 13183-89 (2016).   DOI
15 J.-W. Lee, W.-J. Lee, and S.-M. Lee, "Electrical Behavior of Aluminum Nitride Ceramics Sintered with Yttrium Oxide and Titanium Oxide," J. Korean Ceram. Soc., 53 [6] 635-40 (2016).   DOI
16 H. M. Lee, K. Bharathi, and D. K. Kim, "Processing and Characterization of Aluminum Nitride Ceramics for High Thermal Conductivity," Adv. Eng. Mater., 16 [6] 655-69 (2014).   DOI
17 L. Qiao, H. Zhou, H. Xue, and S. Wang, "Effect of $Y_2O_3$ on Low Temperature Sintering and Thermal Conductivity of AlN Ceramics," J. Eur. Ceram. Soc., 23 [1] 61-7 (2003).   DOI