• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.5
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• pp.21-28
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• 1999

A new method of making high speed self-aligned ESD (Elevated Source/Drain) MOSFET is proposed. Different from the conventional LDD (Lightly-Doped Drain) structure, the proposed ESD structure needs only one ion implantation step for the source/drain junctions, and makes it possible to modify the depth of the recessed channel by use of dry etching process. This structure alleviates hot-carrier stress by use of removable nitride sidewall spacers. Furthermore, the inverted sidewall spacers are used as a self-aligning mask to solve the self-align problem. Simulation results show that the impact ionization rate ($I_{SUB}/I_{D}$) is reduced and DIBL (Drain Induced Barrier Lowering) characteristics are improved by proper design of the structure parameters such as channel depth and sidewall spacer width. In addition, the use of removable nitride sidewall spacers also enhances hot-carrier characteristics by reducing the peak lateral electric field in the channel.

• Journal of The Korean Society of Clinical Toxicology
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• v.3 no.1
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• pp.40-44
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• 2005

Nitrogen dioxide ($NO_2$), which produced during the process of silage, metal etching, explosives, rocket fuels, welding, and by-product of burning of fossil fuels, is one of major components of air pollutant. Accidental exposure of high level of $NO_2$ produces cough, dyspnea, pulmonary edema which may be delayed $4\~12$ hours and, in $2\~6$weeks, bronchiolitis obliterans. We experienced a case of acute pulmonary injuny induced by industrial exposure to high level of $NO_2$ during repair of $NO_2$ pipeline in a refinery. A 55-year-old man experienced nausea and severe dyspnea in 6 hours after $NO_2$ inhalation. Initial blood gas examination revealed severe hypoxemia accompanying increased alveolar-arterial O2 difference. Radiological examination showed diffuse ground glass opacities in both lung fields. Clinical symptoms and laboratory findings, including radiological study and pulmonary function test were improved with conservative treatment using inhaled oxygen and bronchodilator. and there was no evidence of bronchial fibrosis and bronchiolitis obliterance in chest high resolution computed tomography performed 6 weeks after exposure. Here, we report a case of $NO_2$ induced acute pulmonary injuny with a brief review of the relevant literature.

• Journal of Sensor Science and Technology
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• v.13 no.2
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• pp.128-132
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• 2004

Short wave infrared (SWIR) photovoltaic devices have been fabricated from metal organic vapour phase epitaxy (MOVPE) grown n- on p- HgCdTe films on GaAs substrates. The MOVPE grown films were processed into mesa type discrete devices with wet chemical etching employed for meas delineation and ZnS surface passivatlon. ZnS was thermally evaporated from effusion cell in an ultra high vacuum (UHV) chamber. The main features of the ZnS deposited from effusion cell in UHV chamber are low fixed surface charge density, and small hysteresis. It was found that a negative flat band voltage with -0.6 V has been obtained for Metal Insulator Semiconductor (MIS) capacitor which was evaporated at $910^{\circ}C$ for 90 min. Current-Voltage (I-V) and temperature dependence of the I-V characteristics were measured in the temperature range 80 - 300 K. The Zero bias dynamic resistance-area product ($R_{0}A$) was about $7500{\Omega}-cm^{2}$ at room temperature. The physical mechanisms that dominate dark current properties in the HgCdTe photodiodes are examined by the dependence of the $R_{0}A$ product upon reciprocal temperature. From theoretical considerations and known current expressions for thermal and tunnelling process, the device is shown to be diffusion limited up to 180 K and g-r limited at temperature below this.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.3 no.2
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• pp.152-165
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• 1993

This study was performed at eleven small-sized plating factories located in Seoul, Incheon, Ansan, and Taejeon from July 21 to October 6, 1992. The major objectives of this study were to evaluate worker exposure to hexavalent chromium and local exhaust ventilation (L.E.V.) systems at the chromium plating operations. The most suitable L.E.V. systems for chromium plating tanks were designed as examples for recommendation to the industry. The results are summarized as follows. The range of chromium plating operations investigated included decorative, hard, and black chromium plating on several kinds of parts. Most of plating tanks were not equipped with proper control methods against emission of hexavalent chromium mists and workers were not wearing appropriate personal protectives. The ariborne hexavalent chromium concentrations showed an approximate lognormal distribution. The geometric means of both personal and area samples were within the Korean and ACGIH standards, $50{\mu}g/m^3$. However, in comparison with the NIOSH criterion, $1{\mu}g/m^3$, the geometric means of personal samples at two factories and the geometric means of area samples at two factories exceeded it. The geometric means of personal and area samples of high exposure groups (above the NIOSH criterion) were 7 and 27 times higher than those of low exposure groups (below the NIOSH criterion), respectively. The L.E.V. systems of high exposure groups were improperly designed, and the factory with the highest exposure level had no L.E.V. systems at all on chemical etching process. Whereas at factories of low exposure groups, mist control methods such as mist suppressants, tank cover, and/or auxillary L.E.V. systems were added to L.E.V systems. The evaluation of L.E.V. systems showed that there was no chromium plating operation satisfying the ACGIH criteria for capture velocity, slot velocity, and exhaust rate simultaneously. To increase performance of L.E.V. systems, it must be designed to minimize the impact of boundary layer separation. Push-pull ventilation hood and downward plenum ventilation hood were suggested for the Korean industry.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.4
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• pp.23-28
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• 1990

This study is to investigate the magnitude, direction and distribution of residual stresses in surface ground plate according to working conditions. The specimens were made of structural carbon steel and were machined in various grinding conditions. These were divided in two groups; heat-treated materials and non-heat-treated materials. In each working condition, let the ground specimen generate displacements using deflection-etching techniques. At the same time, these displacements were precisely measured with electronic micrometer. Through the relation formula between the plane stress and strain, which was derived using these measured data, the values of residual stress are calculated, and the results are analyzed. These results are as follows : 1. According to the working conditions in this experiment, it can be seen that the distribution of residual stress generally had same trend and the maximum residual stress remained in 20~30 ((${\mu}m$) beneath the surface. 2. It is observed that compressive residual stress changes into tensile stress in 5~20 (${\mu}m$) beneath the surface. It is suggested that such phenomenon is originated from the friction effect in grinding process. 3. As the hardness increases by the heat treatment, residual stress increases. 4. As the fatigue strength increases by the compressive residual stress, it is desirable that the dowm feed and table feed reduce. 5. It can be seen that the more great the down feed and table feed increase, the more close the changing point, where the stress changed from compressive to tensile, is colse to the surface. This is due to the resultant effects of the grinding temperature and resistence are larger than the effect of the friction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.7-7
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• 2009

Lead telluride (PbTe) is a very promising thermoelectric material due to its narrow band gap (0.31 eV at 300 K), face-centered cubic structure and large average excitonic Bohr radius (46 nm) allowing for strong quantum confinement within a large range of size. In this work, we present the thermoelectric properties of individual single-crystalline PbTe nanowires grown by a vapor transport method. A combination of electron beam lithography and a lift-off process was utilized to fabricate inner micron-scaled Cr (5 nm)/Au (130 nm) electrodes of Rn (resistance of a near electrode), Rf (resistance of a far electrode) and a microheater connecting a PbTe nanowire on the grid of points. A plasma etching system was used to remove an oxide layer from the outer surface of the nanowires before the deposition of inner electrodes. The carrier concentration of the nanowire was estimated to be as high as $3.5{\times}10^{19}\;cm^{-3}$. The Seebeck coefficient of an individual PbTe nanowire with a radius of 68 nm was measured to be $S=-72{\mu}V/K$ at room temperature, which is about three times that of bulk PbTe at the same carrier concentration. Our results suggest that PbTe nanowires can be used for high-efficiency thermoelectric devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.5
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• pp.335-340
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• 2013

In this study, the plasma etching of the TaN thin film with $CH_4/BCl_3/Ar$ gas chemistries was investigated. The etch rate of the TaN thin film and the etch selectivity of TaN to $SiO_2$ was studied as a function of the process parameters, including the amount of $CH_4$. X-ray photoelectron spectroscopy (XPS) and Field-emission scanning electron microscopy (FE-SEM) was used to investigate the chemical states of the surface of the TaN thin film.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.2
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• pp.173-178
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• 2012

Currently, active research is being performed on printing of electronic devices such as RFID devices, flexible displays, solar cells, and e-paper. This technique has several advantages over existing technologies such as lithography and etching. In particular, RFID devices, flexible displays, solar cells, and e-paper require flexibility and a mass production system. Thus, attention is being focused on the roll-to-roll process. High quality should be guaranteed in the roll-to-roll printed electronics systems, and good thickness and roughness qualities must be ensured. Experimental design was applied to this problem to analyze the main effects and interaction effects of various factors. Matching technology between the nip roll characteristics and the quality of the print pattern in roll-to-roll printed electronics systems was proposed to improve the printing quality.