Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1996.07c
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- Pages.2004-2006
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- 1996
Characterization of thermally driven polysilicon micro actuator
폴리실리콘 마이크로 액츄에이터의 열구동 특성분석
- Lee, Chang-Seung (Advanced technology dept., Semiconductor div., ETRI) ;
- Lee, Jae-Youl (Dept. of materials science and engineering, KAIST) ;
- Chung, Hoi-Hwan (Advanced technology dept., Semiconductor div., ETRI) ;
- Lee, Jong-Hyun (Advanced technology dept., Semiconductor div., ETRI) ;
- Yoo, Hyung-Joun (Advanced technology dept., Semiconductor div., ETRI)
- 이창승 (한국전자통신연구소 반도체연구단 기반기술연구부) ;
- 이재열 (한국과학기술원 재료공학과) ;
- 정회환 (한국전자통신연구소 반도체연구단 기반기술연구부) ;
- 이종현 (한국전자통신연구소 반도체연구단 기반기술연구부) ;
- 유형준 (한국전자통신연구소 반도체연구단 기반기술연구부)
- Published : 1996.07.22
Abstract
A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is
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