• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.130.2-130.2
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• 2011

본 연구에서는 RF magnetron sputtering을 이용하여 실리콘 박막 태양전지용 ZnO:Al 전면전극을 제작하고 다양한 식각조건에 따른 ZnO:Al 박막의 표면형상 변화와 함께 전기적 및 광학적 특성 변화를 조사하였다. pin 구조를 갖는 실리콘 박막 태양전지의 효율 향상을 위해서는 입사광의 산란효과에 따른 광포획 증가가 필수적이며 이를 위하여 ZnO:Al 전면전극의 표면텍스처링 형성이 필요하다. 식각용액으로는 HCl과 HF 등을 사용하였으며 식각용액 농도 및 식각시간을 변화시켰다. 식각 후의 ZnO:Al 박막의 표면형상은 SEM(Scanning Electron Microscope)과 AFM(Atomic Force Microscope)을 이용하여 분석을 하였고, UV-visible-nIR spectrometer를 이용하여 총 투과도 및 산란 투과도를 측정하였다. 이 외에도 four-point probe 및 Hall measurement를 이용하여 전기적 특성 변화를 조사하였다. 다양한 식각조건에 따라 제조된 ZnO:Al 박막 위에 실리콘 박막 태양전지를 제작하여 전면전극의 표면형상에 따른 태양전지 성능변화를 비교 분석하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.644-647
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• 2001

Amorphous As-Ge-Se-S thin films have been studied with the aim of identifying optimum etching condition which can be used to produce holographic grating structure for use as diffractive optical elements. In this study, holographic gratings have been formed using He-Ne laser(632.8nm), and fabricated by the method of wet etching using NaOH etchant with various concentration(0.26N, 0.33N, 0.40N). The diffraction efficiency was obtained by +1st order intensity of the diffracted beam. The formed grating profiles were observed by atomic force microscope and showed that the expected grating profile could be achieved by controlling the etching time. Over-etching resulted in under-cutting of the grating lines. The highest 1st order diffraction efficiency for these gratings was about 5.05%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.57-58
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• 2006

In MIM (metal insulator metal) capacitor, Ru (ruthenium) has been suggested as new bottom electrode due to its excellent electrical performance, a low leakage of current and compatibility to the high dielectric constant materials. In this case of Ru bottom electrode, CMP (chemical mechanical planarization) process was needed m order to planarize and isolate the bottom electrode. In this study, the effect of chemical A on polishing and etching behavior was investigated as functions of chemical A concentration, abrasive particle and pressure. Chemical A was used as oxidant and etchant. The thickness of passivation layer on the treated Ru surface increased with the increase of chemical A concentration. The etch rate and removal rate of Ru were increased by the addition of chemical A. The removal rate was highest m slurry of pH 9 with the addition of 0.1 M chemical A and 2 wt% alumina at 4 psi. The maximum removal rate is about 80 nm/min.

• Korean Chemical Engineering Research
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• 제44권5호
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• pp.483-488
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• 2006

유기고분자에 대한 건식 식각공정으로 remote 플라즈마를 이용하여 유리 표면에 도포된 PMMA의 식각공정에 관한 연구로 플라즈마 출력, 반응가스, 플라즈마 발생원과의 거리에 대한 식각특성을 측정하였다. 플라즈마 발생원으로부터 멀어질수록 플라즈마에 의해 발생된 라디칼 밀도로 인해 PMMA 식각속도가 감소하였다. 플라즈마 내에서 발생된 라디칼에 의해 PMMA가 제거되며, 플라즈마 출력이 증가할수록 PMMA 표면과 반응하는 라디칼 증가로 식각속도는 선형적으로 증가하였다. 식각 기체에서 산소의 양이 증가함에 따라 식각속도 증가와 더불어 식각표면의 거칠기도 증가함을 알 수 있었다.

• 한국정보통신학회논문지
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• 제14권6호
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• pp.1465-1468
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• 2010

습식 식각은 식각용액으로서 화학용액을 사용하는 공정으로 반응물이 기판표면에서 화학반응을 일으켜 표면을 식각하는 과정이다. 습식 식각 시 수${\mu}m$의 해상도를 얻기 위해서는 그 부식액의 조성이나, 에칭시간, 부식액의 온도 등을 고려하여야 한다. 본 실험에서 사용한 금속은 Cr, Al, ITO 로 모두 DC sputter 방법을 사용해서 증착하여 사용하였다. Cr박막은 $1300{\AA}$ 정도의 두께를 사용하였고, ITO (Indium Tin Oxide) 박막은 가시광 영역에서 투명하고 (80% 이상의 transmittance), 저저항 (Sheet Resistance : $50\;{\Omega}/sq$ 이하) 인 박막을 사용하였으며, 신호선으로 주로 사용되는 Al등의 증착조건에 따른 wet etching 특성을 조사하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.151-154
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• 2004

화합물 반도체 단일 나노선의 에칭 효과를 보기 위하여 에칭 용액과 시간을 달리하면서 전류-전압 특성을 측정하였다. 측정을 위한 단일 나노선 소자는 Electron beam lithography를 이용하여 전극을 top contact 방식으로 만들었다. 에칭은 식각과정에서 현상된 상태의 패턴에서 수행하며 금속 전극과 나노선 접합 부분만을 에칭 하였다. 에칭용액은 Buffered Oxide Etchant(BOE)을 이용하였으며 에칭 시간은 수 십초에서 수 십분까지 다양하게 하였다. 전압-전류 특성 측정결과에서 에칭 용액과 에칭 시간에 따라 전류가 증가하는 것을 확인 할 수 있었다. 이러한 효과는 나노선 외곽에 비정질 산화층의 제거 효과로 인한 것으로 설명할 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.7-12
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• 2000

This paper presents the electrochemical etch-stop characteristics of single-crystal silicon in a tetramethyl ammonium hydroxide(TMAH):isopropyl alcohol(IPA):pyrazine solution. Addition of pyrazine to a TMAH:IPA etchant increases the etch-rate of (100) silicon, thus the elapsed time for etch-stop was shortened. The current-voltage (I-V) characteristics of n- and p-type silicon in a TMAH:IPA:pyrazine solution were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type silicon, respectively, were obtained and applied potential was selected between n- and p-type silicon PP. The electrochemical etch-stop is applied to the fabrication of 801 microdiaphragms having $20{\mu}m$ thickness on a 5-inch silicon wafer. The averge thicknesses of 801 microdiaphragms fabricated on the one wafer were $20.03{\mu}m$ and standard deviation was ${\pm}0.26{\mu}m$. The silicon surface of the etch-stopped microdiaphragm was extremely flat without noticeable taper or other nonuniformities. The benefits of the electrochemical etch-stop in a TMAH:IPA:pyrazine solution become apparent when reproducibility in the microdiaphragm thickness for mass production is considered. These results indicate that the electrochemical etch-stop in a TMAH:IPA:pyrazine solution provides a powerful and versatile alternative process for fabricating high-yield silicon microdiaphragms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.160-160
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• 2008

In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.

• 대한기계학회논문집A
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• 제28권7호
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• pp.999-1005
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• 2004

A new stamp fabrication technique for the soft lithography has been developed in the range of several microns by means of a nano-replication printing (nRP) process. In the nRP process, a figure or a pattern can be replicated directly from a two-tone bitmap figure with nano-scale details. A photopolymerizable resin was polymerized by the two-photon absorption which was induced by a femtosecond laser. After the polymerization of master patterns, a gold metal layer (about 30 ㎚ thickness) was deposited on the fabricated master patterns for the purpose of preventing a join between the patterns and the PDMS, then the master patterns were transferred in order to fabricate a stamp by using the PDMS (poly-dimethylsiloxane). In the transferring process, a few of gold particles, which were isolated from the master patterns, remained on the PDMS stamp. A gold selective etchant, the potassium iodine (KI) was employed to remove the needless gold particles without any damage to the PDMS stamp. Through this work, the effectiveness of the nRP process with the PDMS molding was evaluated to make the PDMS stamp with the resolution of around 200 ㎚.