• Title/Summary/Keyword: erosion process

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Evaluation of Effects on SWAT Simulated Hydrology and Sediment Behaviors of SWAT Watershed Delineation using SWAT ArcView GIS Extension Patch (SWAT ArcView GIS Extension Patch를 이용한 소유역 분할에 따른 수문 및 유사 거동에 미치는 영향 평가)

  • Heo, Sunggu;Kim, Namwon;Park, Younshik;Kim, Jonggun;Kim, Seong-joon;Ahn, Jaehun;Kim, Ki-sung;Lim, Kyoung Jae
    • Journal of Korean Society on Water Environment
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    • v.24 no.2
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    • pp.147-155
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    • 2008
  • Because of increased nonpoint source runoff potential at highland agricultural fields of Kangwon province, effective agricultural management practices are required to reduce the inflow of sediment and other nonpoint source pollutants into the water bodies. The watershed-scale model, Soil and Water Assessment Tool (SWAT), model has been used worldwide for developing effective watershed management. However, the SWAT model simulated sediment values are significantly affected by the number of subwatershed delineated. This result indicates that the SWAT estimated watershed characteristics from the watershed delineation process affects the soil erosion and sediment behaviors. However, most SWAT users do not spend time and efforts to analyze variations in sediment estimation due to watershed delineation with various threshold value although topography falsification affecting soil erosion process can be caused with watershed delineation processes. The SWAT model estimates the field slope length of Hydrologic Response Unit (HRU) based on average slope of subwatershed within the watershed. Thus the SWAT ArcView GIS Patch, developed by using the regression relationship between average watershed slope and field slope length, was utilized in this study to compare the simulated sediment from various watershed delineation scenarios. Four watershed delineation scenarios were made with various threshold values (700 ha, 300 ha, 100 ha, and 75 ha) and the SWAT estimated flow and sediment values were compared with and without applying the SWAT ArcView GIS Patch. With the SWAT ArcView GIS Patch applied, the simulated flow values are almost same irrespective of the number of subwatershed delineated while the simulated flow values changes to some extent without the SWAT ArcView GIS Patch applied. However when the SWAT ArcView GIS Patch applied, the simulated sediment values vary 9.7% to 29.8% with four watershed delineation scenarios, while the simulated sediment values vary 0.5% to 126.6% without SWAT ArcView GIS applied. As shown, the SWAT estimated flow and sediment values are not affected by the number of watershed delineation significant compared with the estimated flow and sediment value without applying the SWAT ArcView GIS Patch.

Review on Soil Erosion and Loss Management System of the Calgary City Government, Albert, Canada (캐나다 앨버트 주 캘거리 시의 토사관리제도에 관한 고찰)

  • Kim, Youngchul;Kim, Lee-Hyung;Hwang, Sung Woo
    • Journal of Wetlands Research
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    • v.17 no.2
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    • pp.163-175
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    • 2015
  • In this paper, soil erosion and soil loss management system (SMS) of the City of Calgary in Albert, Canada was reviewed. Regulatory basis supporting this soil management system, permit process and conditions, guidelines and principles for the SMS, and monitoring and repair duties, inspection were discussed. Permit process in the City of Calgary is handled mainly by Urban Development Division, in which special task force called CPAG (Coorporative Planning Application Group) (if necessary circulated through related subdivisions). Inspects all the permit conditions and decides permit or refusal, and LUM (Land Use and Mobility) advertises the approval, if there is no appeals, permit is released to developers. If permit is rejected, applicant can appeals Development Appeal Board, it can approve or reject. In addition to permit, the city has manual for soil management plan, which includes BMP selection, design, monitoring, maintenance, and inspection activities. Perfect SMS policy does not necessarily guarantee relieving the soil-particle related pollution problem, but in Korea, we have to recognize that construction works during development is potentially the most destructive stage of environmental pollution. The central and local governments must make preparations for the effective and tight regulations and ordinance which is appropriate for regional social-economic conditions.

Optimization of Glass Wafer Dicing Process using Sand Blast (Sand Blast를 이용한 Glass Wafer 절단 가공 최적화)

  • Seo, Won;Koo, Young-Mo;Ko, Jae-Woong;Kim, Gu-Sung
    • Journal of the Korean Ceramic Society
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    • v.46 no.1
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    • pp.30-34
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    • 2009
  • A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

Selective Electrodeposition on Titanium Surface Using Laser Beam (레이저빔을 이용한 티타늄 표면에서의 선택적 구리 전해도금)

  • Shin, Hong Shik
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.26 no.1
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    • pp.44-49
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    • 2017
  • Titanium has been used in various fields due to its good corrosion and erosion resistance, and superior mechanical properties. The process for selective electro-deposition on a titanium surface using laser beam is proposed in this paper. The process consists of laser irradiation, electro-deposition, and ultrasonic cleaning. Laser irradiation can change the surface morphology of titanium. Through laser irradiation, the surface cleaning effect and a rough surface can be achieved. The surface roughness of titanium was measured according to the laser beam conditions. The characteristics of selective electro-deposition on titanium surface according to surface roughness are investigated by various analytical methods such as SEM, and EDS.

Stress Concentration Analysis of Grain Refinement in Rheology Casting Process

  • Z., Yang;P. K., Seo;J.H., Ko;Y. S., Jung;C. G., Kang
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.668-671
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    • 2004
  • The mechanics of the dendrite fragmentation is a very important aspect of grain refinement in rheocasting. In this work, the stress field of the dendrite stirred in the semisolid slurry was simulated by Metlab 6.0 software. The result shows that stress concentration at the root of the dendrite arms is great enough to cause plastic deformation though the agitation is moderate. Accordingly, dendrite fragmentation was suggested to be caused by fractured after fatigue erosion.

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Development of 3-D Modeling for Abrasive Waterjet Drilling Process (어브레시브 워터젯에 의한 Drilling의 3차원 모델링 연구)

  • Kwak, Hyo-Sung;Kovacevic, Rodovan
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.7
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    • pp.7-14
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    • 1999
  • 어브레시브 워터젯을 이용한 Drilling시 깊이에 대한 예측은 가장 중요한 변주중의 하나다. 이 논문에서는 구멍 깊이의 예측 및 구멍 형상을 연구하기 위하여 3차원 해석 모델이 제안되었다. 해석 모델은 크게 두 가지로 구성되었다. 하나는 비선형 반복 방정식에서 생성된 입자의 운동식이며, 다른 하나는 수많은 입자에 의한 충돌시 가공능력을 규정지우는 Constitutive Equation으로 구성되었다. 이 모델은 구멍 가공이 진행됨에 따라 발생하는 감쇠 효과를 고려하였다.실험적인 고찰이 해석모델의 유용성을 검증하기 위하여 이루어졌으며, 근사한 결과를 보였다.

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Tungsten CMP in Fixed Abrasive Pad using Hydrophilic Polymer (친수성 고분자를 이용한 고정입자패드의 텅스텐 CMP)

  • 박범영;김호윤;김형재;김구연;정해도
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.7
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    • pp.22-29
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    • 2004
  • As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

A Few Suggestions For The Arbitrator To Manage The Arbitration Procedure In Favor Of The Parties -Focused on KCAB's Arbitration Procedure- (중재인의 중재절차 진행상 유의사항에 관한 연구 - 대한상사중재원의 절차를 중심으로 -)

  • Lee, Joo-Won;Shin, Koon-Jae
    • Journal of Arbitration Studies
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    • v.22 no.1
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    • pp.23-41
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    • 2012
  • Arbitration provides quicker resolution and may also limit the erosion of business relationships that is often the result of prolonged litigation. The process of arbitration typically involves four phases: 1) selection of arbitrator(s) and opening statement of positions by the parties; 2) rebuttal of opposing positions; 3) interviews, hearings, and information gathering; and 4) rendering of a decision and issuance of the arbitrator's award. A distinctive feature of arbitration is the party's ability to select the arbitrator and the process and rules that will be followed at the hearing. Once that process has been completed, the parties are in the hands of the arbitrator or tribunal. The arbitrator's duty goes on the arbitration procedure efficiently and renders arbitration award. This article discussed various ways the arbitrator leads to a shorter, less risky arbitration, which benefits the parties. We recommend the arbitrator the following comments; Before the hearing the arbitrator decides to whether an arbitration agreement is valid, and a scope of authorities of him in advance. In the hearing, the arbitrator gives both parties a sufficient opportunity to produce evidence, witnesses, and make their arguments. Lastly, the arbitrator need to be cautious in guiding the parties toward an amicable settlement.

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Development of Rapid Mask Fabrication Technology for Micro-abrasive Jet Machining (미세입자 분사가공을 위한 쾌속 마스크 제작기술의 개발)

  • Lee, Seung-Pyo;Ko, Tae-Jo;Kang, Hyun-Wook;Cho, Dong-Woo;Lee, In-Hwan
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.1
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    • pp.138-144
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    • 2008
  • Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

Actinometric Investigation of In-Situ Optical Emission Spectroscopy Data in SiO2 Plasma Etch

  • Kim, Boom-Soo;Hong, Sang-Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.3
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    • pp.139-143
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    • 2012
  • Optical emission spectroscopy (OES) is often used for real-time analysis of the plasma processes. OES has been suggested as a primary plasma process monitoring tool. It has the advantage of non-invasive in-situ monitoring capability but selecting the proper wavelengths for the analysis of OES data generally relies on empirically established methods. In this paper, we propose a practical method for the selection of OES wavelength peaks for the analysis of plasma etch process and this is done by investigating reactants and by-product gas species that reside in the plasma etch chamber. Wavelength selection criteria are based on the standard deviation and correlation coefficients. Moreover, chemical actinometry is employed for the normalization of the selected wavelengths. We also present the importance of chemical actinometry of OES data for quantitative analysis of plasma. Then, the suggested OES peak selection method is employed.. This method is used to find out the reason behind abnormal etching of PR erosion during a series of $SiO_2$ etch processes using the same recipe. From the experimental verification, we convinced that OES is not only capable for real-time detection of abnormal plasma process but it is also useful for the analysis of suspicious plasma behavior.