• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Textile Coloration and Finishing
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• v.11 no.6
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• pp.7-17
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• 1999

Aminophosphazene derivatives were prepared from hexachlorocyclotriphosphazene and used for the curing agents of epoxy resins. The effect of the curing agent on the dynamic viscoelastic properties, flame proofing, and heat resistance of the cured epoxy resins were investigated and compared with those for the epoxy resins cured with aliphatic and aromatic amines. The epoxy resin cured by 1,1-diamino-3,3,5,5-tetrachlorocyclotriphosphazene showed the highest storage modulus and glass transition temperature when cured at 19$0^{\circ}C$ for 6 hours. The epoxy resins cured with phosphazene derivatives showed superior flame proofing to those with aliphatic amine and aromatic amine. Particularly it is an effective curing agent for epoxy resins to enhance the storage modulus, flame proofing and resistance to heat.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1990.10a
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• pp.95-97
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• 1990

This study investigated electrical characteristic of solids and liquid epoxy resins by measuring dielectric breakdown and dielectric loss when epoxy resins were exposed to a mixing cure. It was found that mixing epoxy resins were superior to dielectric breakdown and hardness and has shorter curing time compare with those of pure liquid epoxy resins.

• Textile Coloration and Finishing
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• v.29 no.1
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• pp.25-36
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• 2017

This study worked on the synthesis of waterborne polyurethane/epoxy hybrid resins containing aminosilane compound to replace conventional phenol resins used for a coating material for loudspeaker dampers, which are not harmful to human being. Waterborne polyurethane resins were synthesized from two diisocyanate of 4,4'-diphenylethane diisocyanate and toluene diisocyanate, two polyols of polyester polyols(PEP), polycarbonatediol(PCD), including and anionic center of dimethylol butanoic acid, a chain extenders of ethylenediamine(EDA), and a neutral agent of triethylamine. Synthesized polyurethane resins and commercially available bisphenol A type waterborne epoxy resin were blended in weight ratios of 80:20 to prepare polyurethane/epoxy hybrid resins. The synthesized waterborne polyurethane/epoxy hybrid resins were reacted with aminosilane compound to improve mechanical properties. Aminosilane-treated polyurethane /epoxy hybrid resins showed better mechanical properties.

• Macromolecular Research
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• v.12 no.1
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• pp.11-21
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• 2004

Toughening of epoxy resins for improvement of crack resistance has been the subject of intense research interest during the last two decades. Epoxy resins are successfully toughened by blending with a suitable liquid rubber, which initially remains miscible with epoxy and undergoes a phase separation in the course of curing that leads to the formation of a two-phase microstructure, or by directly blending preformed rubbery particle. Unlike the situation for thermoplastics, physical blending is not successful for toughening epoxy resins. Recent advances in the development of various functionalized liquid rubber-based toughening agents and core-shell particles are discussed critically in this review.

• 보존과학연구
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• s.20
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• pp.139-154
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• 1999

We tested to obtain the excellent Epoxy resins on the property of matter. Existing Epoxy resins is tested to regulate the viscosity, color and hardening time etc. Benzen-ring structure of Bisphenol A type (AY 103) is replaced by Hydrogenated B.P.A type. And hardener is replaced by Polyoxyalkylene Amine. So we are developed into the two resins(L-30, L-40).To know if this Epoxy resins was fitted to repairing and restoration of stone cultural properties. Three kinds of Epoxy resins (AY 103, L-30, L-40) are tested on the artificial weathering test, freezing-melting test, exposure test etc. As a result of test, L-30 is less the discoloration than that of other Epoxy resins and was superior to the excellent property of matter.

• Journal of Conservation Science
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• v.25 no.1
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• pp.77-86
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• 2009

The physical properties of the epoxy resins were studied with an addition of filler content and the application of artificial weathering test. When talc as a filler was added to the epoxy resin (L-30), the water resistance seemed to be increased because of the results of the reducing of water absorption rate and the increasing of contact angle. Although the adhesive strength of epoxy resins was not affected by the increasing amount of talc, its compressive strength was reduced. The physical properties of the epoxy resins had different trends according to the site environments. The artificial weathering test with the change of temperature and humidity showed that the changes of water absorption rate and colour differences of the epoxy resins containing talc were lower than the pure epoxy resin itself. However, the contact angle was higher. The artificial weathering test with ultraviolet irradiations showed the opposite result; the damage of epoxy resins was increased with the increasing of talc content. These mean the site environment of the stone monuments should be considered to determine the content of talc added to increase the durability of epoxy resin.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Textile Coloration and Finishing
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• v.13 no.3
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• pp.188-196
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• 2001

1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene, 1, 1-diami-no3, 3, 5, 5-tetra-(p-bromophenoxy)cyclotriphosphazene, and 1, 1-diamino-3, 3, 5, 5-tetra-(p-chlorophenoxy) cyclotri-phosphazene(ACPP) was prepared from hexachlorocyclotriphosphazene and used for the curing agent of bisphenol A type epoxy resin and phenol novolak. The resistance to chemicals and water of the cured epoxy resins were examined by DMTA and compared with those of the epoxy rosins cured with phosphazene derivatives and 4, 4'-diaminodiphenylmethane. The effect of the curing agent on resistance to chemicals and water of the cured epoxy resins were investigated. The epoxy resins cured with 1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene and 1, 1- diamino-3, 3, 5, 5-tetra- (p-bromophenoxy)cyclotriphosphazene showed superior resistance to chemicals and water to those of 1, 1-diamino-3, 3, 5, 5-tetra- (p-chlorophenoxy)cyclotriphosphazene and 4, 4'-diaminodiphenylmethane. It is an effective curing agent for epoxy resins to enhance the resistance to chemicals, water and tome proofing.

• Proceedings of the KIEE Conference
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• 1990.07a
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• pp.275-278
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• 1990

This study investigated electrical characteristics of solid and liquid epoxy rosins by measuring dielectric breakdown and dielectric loss when epoxy resins were exposed to a mixing cure, i.e., Fusion Blend Method. It was found that mixing epoxy resins were superior to dielectric breakdown and has shorter curing time compare with those of pure liquid epoxy resins.