• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• 한국염색가공학회지
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• 제11권6호
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• pp.7-17
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• 1999

Aminophosphazene derivatives were prepared from hexachlorocyclotriphosphazene and used for the curing agents of epoxy resins. The effect of the curing agent on the dynamic viscoelastic properties, flame proofing, and heat resistance of the cured epoxy resins were investigated and compared with those for the epoxy resins cured with aliphatic and aromatic amines. The epoxy resin cured by 1,1-diamino-3,3,5,5-tetrachlorocyclotriphosphazene showed the highest storage modulus and glass transition temperature when cured at 19$0^{\circ}C$ for 6 hours. The epoxy resins cured with phosphazene derivatives showed superior flame proofing to those with aliphatic amine and aromatic amine. Particularly it is an effective curing agent for epoxy resins to enhance the storage modulus, flame proofing and resistance to heat.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1990년도 추계학술대회 논문집
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• pp.95-97
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• 1990

This study investigated electrical characteristic of solids and liquid epoxy resins by measuring dielectric breakdown and dielectric loss when epoxy resins were exposed to a mixing cure. It was found that mixing epoxy resins were superior to dielectric breakdown and hardness and has shorter curing time compare with those of pure liquid epoxy resins.

• 한국염색가공학회지
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• 제29권1호
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• pp.25-36
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• 2017

This study worked on the synthesis of waterborne polyurethane/epoxy hybrid resins containing aminosilane compound to replace conventional phenol resins used for a coating material for loudspeaker dampers, which are not harmful to human being. Waterborne polyurethane resins were synthesized from two diisocyanate of 4,4'-diphenylethane diisocyanate and toluene diisocyanate, two polyols of polyester polyols(PEP), polycarbonatediol(PCD), including and anionic center of dimethylol butanoic acid, a chain extenders of ethylenediamine(EDA), and a neutral agent of triethylamine. Synthesized polyurethane resins and commercially available bisphenol A type waterborne epoxy resin were blended in weight ratios of 80:20 to prepare polyurethane/epoxy hybrid resins. The synthesized waterborne polyurethane/epoxy hybrid resins were reacted with aminosilane compound to improve mechanical properties. Aminosilane-treated polyurethane /epoxy hybrid resins showed better mechanical properties.

• Macromolecular Research
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• 제12권1호
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• pp.11-21
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• 2004

Toughening of epoxy resins for improvement of crack resistance has been the subject of intense research interest during the last two decades. Epoxy resins are successfully toughened by blending with a suitable liquid rubber, which initially remains miscible with epoxy and undergoes a phase separation in the course of curing that leads to the formation of a two-phase microstructure, or by directly blending preformed rubbery particle. Unlike the situation for thermoplastics, physical blending is not successful for toughening epoxy resins. Recent advances in the development of various functionalized liquid rubber-based toughening agents and core-shell particles are discussed critically in this review.

• 보존과학연구
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• 통권20호
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• pp.139-154
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• 1999

We tested to obtain the excellent Epoxy resins on the property of matter. Existing Epoxy resins is tested to regulate the viscosity, color and hardening time etc. Benzen-ring structure of Bisphenol A type (AY 103) is replaced by Hydrogenated B.P.A type. And hardener is replaced by Polyoxyalkylene Amine. So we are developed into the two resins(L-30, L-40).To know if this Epoxy resins was fitted to repairing and restoration of stone cultural properties. Three kinds of Epoxy resins (AY 103, L-30, L-40) are tested on the artificial weathering test, freezing-melting test, exposure test etc. As a result of test, L-30 is less the discoloration than that of other Epoxy resins and was superior to the excellent property of matter.

• 보존과학회지
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• 제25권1호
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• pp.77-86
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• 2009

석조문화재 보존처리제로 사용되는 에폭시수지의 물성변화를 충전제의 함량변화와 인공풍화를 통한 가속화시험으로 연구하였다. 충전제로서 탈크를 첨가한 에폭시수지(L-30) 시편에서 함수율이 감소하였고, 표면접촉각이 증가하여 수분에 대한 저항성이 높았다. 탈크의 첨가량을 일정량 증가시켰을 때 접착 성능에서는 문제가 발생되지 않았으나 에폭시수지 자체의 압축강도는 저하되었다. 탈크 함량에 따른 에폭시수지의 물성변화는 그 주변 환경요소에 각기 다른 경향을 보였다. 온 습도 변화에 의한 인공풍화시험 후 탈크가 첨가된 에폭시수지에서 순수한 에폭시수지에 비해 함수율의 변화가 적었으며, 색차변화가 작았고 표면접촉각이 커진 것으로 확인되었다. 자외선조사에 의한 인공풍화시험에서는 탈크함량이 증가할수록 에폭시의 물성이 악화되는 결과를 보였다. 이는 에폭시수지의 내구성을 향상시키기 위해서 첨가하는 충전제의 함량이 보존처리될 석조물의 주변환경에 따라 다르게 적용되어야 함을 의미한다.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• 한국염색가공학회지
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• 제13권3호
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• pp.188-196
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• 2001

1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene, 1, 1-diami-no3, 3, 5, 5-tetra-(p-bromophenoxy)cyclotriphosphazene, and 1, 1-diamino-3, 3, 5, 5-tetra-(p-chlorophenoxy) cyclotri-phosphazene(ACPP) was prepared from hexachlorocyclotriphosphazene and used for the curing agent of bisphenol A type epoxy resin and phenol novolak. The resistance to chemicals and water of the cured epoxy resins were examined by DMTA and compared with those of the epoxy rosins cured with phosphazene derivatives and 4, 4'-diaminodiphenylmethane. The effect of the curing agent on resistance to chemicals and water of the cured epoxy resins were investigated. The epoxy resins cured with 1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene and 1, 1- diamino-3, 3, 5, 5-tetra- (p-bromophenoxy)cyclotriphosphazene showed superior resistance to chemicals and water to those of 1, 1-diamino-3, 3, 5, 5-tetra- (p-chlorophenoxy)cyclotriphosphazene and 4, 4'-diaminodiphenylmethane. It is an effective curing agent for epoxy resins to enhance the resistance to chemicals, water and tome proofing.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 하계학술대회 논문집
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• pp.275-278
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• 1990

This study investigated electrical characteristics of solid and liquid epoxy rosins by measuring dielectric breakdown and dielectric loss when epoxy resins were exposed to a mixing cure, i.e., Fusion Blend Method. It was found that mixing epoxy resins were superior to dielectric breakdown and has shorter curing time compare with those of pure liquid epoxy resins.