• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of the Korean Society of Safety
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• v.25 no.1
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• pp.1-8
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• 2010

The tensile and fatigue experiments were conducted with tensile-shear specimens for investigating the strength of adhesive bonded and mechanical press joints of SPCC steel sheet used in the field of the automobile industry. The optimal punch press force was evaluated 50kN for combining epoxy adhesive bonding and mechanical press joining with a diameter of 8.3mm using SPCC sheet with a thickness of 0.8mm. The combining epoxy adhesive bonding and mechanical press joining exhibits the maximum tensile force of 750N. The fatigue strengths of the combination of adhesive bond and mechanical press joint and pure adhesive joint were evaluated 370N and 320N at 106cycles, respectively. These values correspond to 22% and 20% of their maximum tensile forces, respectively. However, the fatigue strength of the combination of adhesive bond and mechanical press joining was much lower than that of pure mechanical press joining.

• Journal of the Korean Society of Safety
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• v.18 no.2
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• pp.79-85
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• 2003

In this study, the behavior characteristics of specimen strengthened with CFRP plate were analyzed according to the change of temperature. CFRP plate itself has a good resistance at the high temperature, but epoxy used as a adhesive is lost its bonding strength at the relatively low temperature. Therefore, this study carries out experiment on the beams slot-bonded with CFRP plates in order to maintain the successful bonding strength of epoxy at high temperature. It is presented that the range of glass transition temperature is 60-8$0^{\circ}C$ and RC beams slot-bonded with CFRP plate shows more increasing resistance and failure load than that of interface bonded at the high temperature.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.109-113
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• 2012

The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.

• Proceedings of the Korea Concrete Institute Conference
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• 1995.10a
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• pp.293-298
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• 1995

This study experimentally evaluate the bonding performance of repair and strengthening materials. It is very important problem to justify bonding properties between repair and strengthening materials and old concrete. Many previous research and investigation showed that bonding strength of reinforcing materials determines the strengthening effect and the durability of repair work. Therefore, menifestation of bonding properties and the improvement of bonding performance of repair and strengthening materials are very important. In order to improve the perforamnce of repair work, it needs to investigate the behavior of bonding materials, such as stress distribution along the bonding area and the long term performance of the material. The target repair methods are steel plate addition technique and repair mortar method, and the test parameters studied in this paper include epoxy thickness, bonding surface texture, and bonding area.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.111-115
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• 2005

Recently, natural fibers draw much interests in composite industry due to low cost, light weight, and environment-friendly characteristics compared with glass fibers. In this study, mechanical properties were evaluated for two extreme cases of jute fiber orientations, i.e. the unidirectional yarn composites and the felt fabric composites. Samples of jute fiber composites were fabricated by RTM process using epoxy resin, and tensile, compression, and shear tests were conducted. As can be expected, unidirectional fiber specimens in longitudinal direction showed the highest strength and modulus. Compared with glass/epoxy composites of the similar fabric architecture and fiber volume fraction, the tensile strength and modulus of jute felt/epoxy composites reached only 40% and 50% levels. However, the specific tensile strength and modulus increased to 80% and 90% of the glass/epoxy composites. The main reason for the poor mechanical properties of jute composites is associated with the weak interfacial bonding between fiber and matrix. The effect of surface treatment of jute fibers on the interfacial bonding will be examined in the future work.

• Structural Engineering and Mechanics
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• v.82 no.2
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• pp.163-172
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• 2022

Zinc-rich epoxy (ZRE) is used to overcome corrosion problems in reinforced concrete (RC) beams and coat steel rebars to protect them from humidity and chlorides. An extra coating layer of Sikadur-31 epoxy (SDE) is utilised to increase bond strength because the use of ZRE reduces the bond strength between concrete and steel rebars. However, the low melting point of SDE indicates that concrete specimens are vulnerable to fire. An experimental investigation on flexural performance of RC beams incorporating ZRE-SDE coating of steel rebars that were destroyed by fire is performed in this study. Twenty beams of five concrete mixes with different cementitious contents were tested to compare fire exposure for coated and uncoated rebars of the same beams at room temperature and determine the optimal cementitious content. Scanning electron microscopy (SEM) was also applied to investigate characteristics of fired mixture samples. Results showed that the use of SDE-ZRE at room temperature improves flexural strengths of the five mixes compared with uncoated rebars with percentages ranging from 8.5% to 12.3%. All beams with SDE-ZRE lost approximately 50% of their flexural strength due to firing. Moreover, the mix incorporating SF (silica fume) of 15% and cement content of 400 kg/m³ introduces optimum behaviour compared with other mixes. All results were supported and verified by the SEM analysis and compressive strength of cubic specimens of the same mixes.

• Journal of the Korean Wood Science and Technology
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• v.35 no.3
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• pp.36-44
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• 2007

The purpose of this study was to investigate thermal stability, reactivity, and bonding strength of existing epoxy resin mixed with the epoxidized soybean oil (ESBO) in order to use soybean oil economically. In the dry shear test, the marked strengths showed $30.5kgf/cm^2$ at the ratio of ESBO to epoxy resin 9 : 1 and $6.2kgf/cm^2$ at the ratio 8 : 2. The bonding strengths of the others, except mixing ratios 2 : 8 and 1 : 9, exceeded the requirement of Korean plywood standard of $7.0kgf/cm^2$. In the wet shear test, the result was $5.8kgf/cm^2$ at the ratio 9 : 1. There were no thickness swelling and moisture absorption in the water resistance of the film. The value of activation energy, Tg (${\Delta}E$), by DSC analysis showed between $110^{\circ}C$ and $120^{\circ}C$ through all ratios. Epoxy in the epoxy resin fully reacted with the hardener (TETA), but it is difficult to decide that epoxys in the ESBO were reacted directly with the hardener from FT-IR analysis. As the mixing ratio of ESBO increased, the thermal stabilities dropped from TGA analysis. From the comprehensive view on the results of above experiments, it could be confirmed through experiments that the ESBO in the mixed adhesive of epoxy resin/ESBO played a role as an extending agent level of epoxy adhesive, and we were able to know that in order to utilize ESBO as an adhesive, a study should be performed on the condition of hardening, inducible of the hardening reaction.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.3
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• pp.236-243
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• 2010

Fiber Bragg grating(FBG) sensor arrays can be used to monitor the mechanical behavior of the large composite structures such as wind turbine rotor blades and aircrafts. However, brittle FBG sensors, especially multiplexed FBG sensors are easily damaged when they are installed in the flexible structures. As a protection of brittle FBG sensors, epoxy packaged FBG sensors have been presented in this paper. Finite element analysis and experiments were performed to evaluate the effects of adhesives, packaging materials and the bonding layer thickness on the strain transmission. Two types of epoxy were used for packaging FBG sensors and the sensor probes were attached with various bonding layer thickness. It was observed that thin bonding layer with high elastic modulus ratio of the adhesive to packaging provided good strain transmission. However, the strain transmission was significantly decreased when elastic modulus of the adhesive was much lower than the packaged FBG sensor probe's one.