The Life Span of LED by the Rising Glass Transitions Temperature of Epoxy

에폭시 유리전이 온도상승에 따른 LED 수명의 변화

  • Ban, Jae-Sam (School of Dentistry, Chonnam National Univ.) ;
  • Jung, Yong-Ho (Department of Mechanical Engineering, Chonnam National Univ.) ;
  • Yang, Hyun-Sam (Department of Metallurgical Engineering, Chonnam National Univ.) ;
  • Kim, Sun-Jin (Department of Fire Safty, Seoyeong Univ.)
  • 반재삼 (전남대학교 치의학과) ;
  • 정용호 (전남대학교 기계공학과) ;
  • 양현삼 (전남대학교 금속공학과) ;
  • 김선진 (서영대학교 소방행정과)
  • Received : 2011.08.17
  • Accepted : 2011.10.04
  • Published : 2012.01.01


The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.



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