References
- Lee, M. C. and Han, S, "Viscosity behaviors of Epoxy molding compound for the semiconductor microchip encapsulant," HwaHak KongHak, Vol. 40, No. 3, pp. 310-315, 2002.
-
Kim, W., Bae, J.-W., Kang, H.-Y., Lee, M.-J. and Choi, I.-D., "Studies on molding conditions and Physical properties of ENC(Epoxy Molding Compounds) filled with crystalline
$SiO_{2}$ for microelectronic encapsulation," J. of Korean Ind. & Eng. Chemistry, Vol. 8, No. 3, pp. 533-542, 1997. - Noh, B. I., Lee, J. B. and Jung, S. B., "Characteristic of underfill wi th various Epoxy resin," J. of the Microelectronics & Packaging Society, Vol. 13, No. 3, pp. 39-45, 2006.
- Seo, J. U., Kim, C. Y., Kim, H. S. and Noh, S. J., "A study of violet LED chips and white LED lamps," J. of the Korean Vacuum Society, Vol. 12, No. 4, pp. 235-238, 2003.
- Song, M. J, Kim, H. K, Kang, J. J. and Kim, K .H., "Finite Element Analysis of Residual Stress Evolution during Cure Process of Silicone Resin for High-power LED Encapsulant," J of KSPE, Vol. 28, No. 2, pp. 219-225, 2011.
- Lee, K. S., Yun, D. H. and Goun, Y. N., "Thermal analysis of 0.3W single-chip LED package," Proc. of KSPE Spring Conference, pp. 1117-1118, 2010.
- Lee, J. I. and Ko, B. G., "Thermal stress of semiconductor IC package," J. of Korean Soc. of Mechanical Technology, Vol. 9, No. 2, pp. 9-14, 2007.
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