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http://dx.doi.org/10.7736/KSPE.2012.29.1.109

The Life Span of LED by the Rising Glass Transitions Temperature of Epoxy  

Ban, Jae-Sam (School of Dentistry, Chonnam National Univ.)
Jung, Yong-Ho (Department of Mechanical Engineering, Chonnam National Univ.)
Yang, Hyun-Sam (Department of Metallurgical Engineering, Chonnam National Univ.)
Kim, Sun-Jin (Department of Fire Safty, Seoyeong Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.29, no.1, 2012 , pp. 109-113 More about this Journal
Abstract
The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.
Keywords
Lighting Emitting Diode; Glass Transitions Temperature; Epoxy; Failure Late; LED Chip; Failure Shape;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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