Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding |
Choi, Won-Jung
(Welding & Joining Technology Center, KITECH)
Yoo, Se-Hoon (Welding & Joining Technology Center, KITECH) Lee, Hyo-Soo (Welding & Joining Technology Center, KITECH) Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) Kim, Jun-Ki (Welding & Joining Technology Center, KITECH) |
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