Browse > Article
http://dx.doi.org/10.3740/MRSK.2012.22.9.454

Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding  

Choi, Won-Jung (Welding & Joining Technology Center, KITECH)
Yoo, Se-Hoon (Welding & Joining Technology Center, KITECH)
Lee, Hyo-Soo (Welding & Joining Technology Center, KITECH)
Kim, Mok-Soon (School of Materials Science & Engineering, Inha University)
Kim, Jun-Ki (Welding & Joining Technology Center, KITECH)
Publication Information
Korean Journal of Materials Research / v.22, no.9, 2012 , pp. 454-458 More about this Journal
Abstract
Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.
Keywords
flip chip bonding; epoxy adhesive; NCP(non-conductive paste); snap cure;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 I. Ogura, Electronics Application of Epoxy resin, p.23, Information Technology Association, Japan (2005) (in Japanese).
2 M. S. Kim, H. Y. Kim, S. H. Yoo, J. H. Kim and J. K. Kim, J. Kor. Welding Soc., 29(4), 54 (2011) (in Korean).   DOI
3 L. K. Teh, E. Anto, C. C. Wong, S. G. Mhaisalkar, E. H. Wong, P. S. Teo and Z. Chen, Thin Solid Films, 462-463, 446 (2004).   DOI   ScienceOn
4 P. S. Ho, G. Wang, M. Ding, J. -H. Zhao and X. Dai, Microelectron. Reliab., 44, 719 (2004).   DOI   ScienceOn
5 D. Lu and C. P. Wong, Materials for Advanced Packaging, p.719, Springer, NY, USA (2008).
6 K. E. Min, J. S. Lee, S. Yoo, M. S. Kim and J. K. Kim, Kor. J. Mater. Res., 20(12), 681 (2010) (in Korean).   DOI   ScienceOn
7 J. Rieger, Polymer Test., 20, 199 (2001).   DOI   ScienceOn
8 S. J. Lee, S. H. Yoo, C. W. Lee, J. H. Lee and J. K. Kim, J. Microelectron. Packag. Soc., 16(3), 25 (2009) (in Korean).
9 E. M. Petrie, Epoxy Adhesive Formulations, p.99, McGraw-Hill, USA (2006).