• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.173-176
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• 1998

Epitaxial Si layers were deposited on n- or p-type Si(100) substrates by hot-wall chemical vapor deposition (CVD) technique using the {{{{ {SiH }_{ 2} {Cl }_{2 } - {H }_{ 2} }}}}chemistry. Thermodynamic calculations if the Si-H-Cl system were carried out to predict the window of actual Si deposition procedd and to investigate the effects of process variables(i.e., the deposition temperature, the reactor pressure, and the source gas molar ratios) on the growth of epitaxial layers. The calculated optimum process conditions were applied to the actual growth runs, and the results were in good agreement with the calculation. The expermentally determined optimum process conditions were found to be the deposition temperature between 900 and 9$25^{\circ}C$, the reactor pressure between 2 and 5 Torr, and source gad molar ration({{{{ {H }_{2 }/ {SiH }_{ 2} {Cl }_{2 } }}}}) between 30 and 70, achieving high-quality epitaxial layers.

• International Journal of Precision Engineering and Manufacturing
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• 제7권4호
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• pp.18-22
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• 2006

Although many efforts have been made in making nanometer-sized holes, there is still a major challenge in fabricating individual single-digit nanometer holes in a more controllable way for different materials, size distribution and hole shapes. In this paper we describe our efforts to use a top down approach in nanofabrication method to make single-digit nanoholes. There are three major steps towards the fabrication of a single-digit nanohole. 1) Preparing the freestanding thin film by epitaxial deposition and electrochemical etching. 2) Making sub-micro holes ($0.2{\mu}\;to\;0.02{\mu}$) by focused ion beam (FIB), electron beam (EB), atomic force microscope (AFM), and others methods. 3) Reducing the hole size to less than 10 nm by epitaxial deposition, FIB or EB induced deposition and micro coating. Preliminary work has been done on thin films (30 nm in thickness) preparation, sub-micron hole fabrication, and E-beam induced deposition. The results are very promising.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.264.2-264.2
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• 2013

Molecular layer deposition (MLD) is sequential, self-limiting surface reaction to form conformal and ultrathin polymer film. This technique generally uses bifunctional precursors for stepwise sequential surface reaction and entirely organic polymer films. Also, in comparison with solution-based technique, because MLD is vapor-phase deposition based on ALD, it allows epitaxial growth of molecular layer on substrate and is especially good for surface reaction or coating of nanostructure such as nanopore, nanochannel, nanwire array and so on. In this study, polyurea film that consisted of phenylenediisocyanate and phenylenediamine was formed by MLD technique. In situ Fourier Transform Infrared (FTIR) measurement on high surface area SiO2 substrate was used to monitor the growth of polyurethane and polyurea film. Also, to investigate orientation of chemical bonding formed polymer film, plan-polarized grazing angle FTIR spectroscopy was used and it showed epitaxial growth and uniform orientation of chemical bones of polyurea films.

• 한국진공학회지
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• 제11권1호
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• pp.16-21
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• 2002

$Si_2H_6$가스를 이용한 LPCVD내에서의 실리콘의 선택적 에피텍시 성장을 $1000^{\circ}C$ 이하의 초청정 분위기하의 저온에서 수행하였다. HCI 첨가없이 초청정 공정으로 인한 양질의 에피텍시 Si층이 균일하게 얻어 졌으며, $SiO_2$위에 증착된 실리콘의 잠복기를 발견할 수 있었다. 단결정위의 에피텍시 층은 산화물 층위 보다 더 두껍게 증착되었다. 산소첨가로 잠복기가 20~30초간 증가하였다. 증착된 박막의 절단면과 표면 형상은 SEM으로 관찰되었으며, XRD를 통해 막질을 평가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.208-211
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• 2002

$Bi_2Sr_2CuO_x$(Bi-2201) thin films were fabricated by atomic layer-by-layer deposition using an ion beam sputtering method. 10 wt% and 90 wt% ozone mixed with oxygen were used with ultraviolet light irradiation to assist oxidation. At early stages of the atomic layer by layer deposition, two dimensional epitaxial growth which covers the substrate surface would be suppressed by the stress and strain caused by the lattice misfit, then three dimensional growth takes place. Since Cu element is the most difficult to oxidize, only Sr and Bi react with each other predominantly, and forms a buffer layer on the substrate in an amorphous-like structure, which is changed to $SrBi_2O_4$ by in-situ anneal.

• 한국결정성장학회지
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• 제12권4호
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• pp.215-221
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• 2002

$SiH_2Cl_2/H_2$ 기체혼합물을 원료로 사용하여 (100) Si 기판 위에 고온벽 화학기상증착법(hot-wall CVD)으로 에피 실리콘을 증착시켰다. 공정변수(증착온도, 반응기 압력, 입력 기체의 조성비($H_2/SiH_2Cl_2$)등)가 실리콘 증착에 미치는 영향을 조사하기 위해 열화학적 전산모사를 수행하였으며, 전산모사를 통해 얻은 공정조건의 범위를 바탕으로 실험한 결과, 전산모사의 결과와 실험이 잘 일치함을 알 수 있었다. 실험을 통해 얻은 최적 증착 조건은 증착온도가 850~$950^{\circ}C$, 반응기 압력은 2~5 Torr, $H_2/SiH_2Cl_2$비는 30~70 정도임을 알 수 있었고, 증착된 에피 실피콘은 두께 및 비저항의 균일도가 우수하고 불순물 함량이 낮은 양질의 박막임을 확인할 수 있었다.

• 한국재료학회지
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• 제10권11호
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• pp.738-741
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• 2000

사이클로펜타디에닐 디카보닐 코발트 (Co(η(sup)5-C(sub)5H(sub)5) ($CO_2$)의 반응성 화학 기상 증착법에 의해 $600^{\circ}C$ 근처의기판온도에서 (100)Si 기판 위에 균일한 에피택셜 CoSi2 층이 후열처리를 거치지 않고 직접 성장되었다. (100) Si 기판 위에서 에피택셜 CoSi(sub)2 층의 성장 속도론을 $575^{\circ}C$에서 $650^{\circ}C$의 온도 구간에서 조사하였다. 증착 초기 단계에서 판(plate)모양의 CoSi(sub)2 스차이크가 쌍정의 구조를 가지고 (100) Si 기판에서 <111> 방향을 따라서 불연속적으로 핵생성되었다. {111}과 (100)면을 가진 불연속의 CoSi(sub)2 판은 (100) Si 위에서 평평한 계면으로 이루어진 에피택셜 층으로 성장했다. (100) Si 위에서 에피택셜 CoSi(sub)2 층을 통한 Co의 확산에 의해 제어되는 것으로 나타났다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.256-256
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• 2008

We report epitaxial growth of ZnO thin films on (100) single-crystalline $LaAlO_3$ (LAO) substrates using pulsed laser deposition (PLD) at different substrate temperatures (400~$800^{\circ}C$). The structural and electrical properties of the films have been investigated by means of X-ray diffraction (XRD), atomic force microscope (AFM), transmission line method (TLM). The poly-crystalline of $\alpha$- and c-axis oriented ZnO film was formed at lower deposition temperature ($T_s$) of $400^{\circ}C$. At higher $T_s$, however, the films exhibit single-crystalline of $\alpha$-axis orientation represented by ZnO[$\bar{1}11$ || LAO <001>. The electrical properties of ZnO thin films depend upon their crystalline orientation, showing lower electrical resistivity values for $\alpha$-axis oriented ZnO films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.480-483
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• 2001

Epitaxial rutile-$TiO_2$ and anatase-$TiO_2$ films were grown at $800^{\circ}C$ on $Al_2O_3$ (1102) and $LaAlO_3$ (001), respectively, using pulsed laser deposition. The formation of different phases on different substrates could be qualitatively explained by the atomic arrangements at the interfaces. We also successfully deposited epitaxial rutile-$TiO_2$ and anatase-$TiO_2$ films on conductive $RuO_2$ and $La_{0.5}Sr_{0.5}CoO_{3}$ electrodes, respectively. Using a Kelvin probe, we measured the photovoltaic properties of these multilayer structures. A rutile-$TiO_2$ film grown on $RuO_2$ showed a very broad peak in the visible light region. An epitaxial anatase-$TiO_2$ film grown on $La_{0.5}Sr_{0.5}CoO_{3}$ showed a strong peak with a threshold energy of 3.05 eV.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.480-483
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• 2001

Epitaxial rutile-TiO$_2$ and anatase-TiO$_2$ films were grown at 80$0^{\circ}C$ on $Al_2$O$_3$ (1102) and LaAlO$_3$ (001), respectively, using pulsed laser deposition. The formation of different phases on different substrates could be qualitatively explained by the atomic arrangements at the interfaces. We also successfully deposited epitaxial rutile-TiO$_2$ and anatase-TiO$_2$ films on conductive RuO$_2$ and La$_{0.5}$Sr$_{0.5}$CoO$_3$ electrodes, respectively Using a Kelvin probe, we measured the photovoltaic properties of these multilayer structures. A rutile-TiO$_2$ film grown on RuO$_2$ showed a very broad peak in the visible light region. An epitaxial anatase-TiO$_2$ film grown on La$_{0.5}$Sr$_{0.5}$CoO$_3$ showed a strong peak with a threshold energy of 3.05 eV 3.05 eV