• 한국전기전자재료학회논문지
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• 제24권8호
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• pp.647-653
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• 2011

In this study, a method to measure the thickness of thin film by EDS (energy dispersive spectroscopy) is suggested. We have developed a model which calculates the thickness of thin film from the characteristic x-ray intensity ratio of the elements in thin film and substrate by considering incident electron beam energy, x-ray generation curve, backscattering and absorption of x-ray, take-off angle of x-ray and tilt angle of the sample. We obtained the relation curve between the film thickness measured experimentally and the x-ray intensity ratio of elements. The film thicknesses calculated from the model agrees quite well with those measured experimentally. Therefore, the thin film thickness can be measured rapidly and accurately by using the model developed in this study and the x-ray intensity ratio obtained in EDS analysis.

• Bulletin of the Korean Chemical Society
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• 제27권6호
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• pp.853-856
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• 2006

Dion-Jacobson phases $CsCa_2Nb_2FeO_9$ and $CsCa_2Nb_2AlO_9$ were reinvestigated by the Rietveld analysis of powder X-ray diffraction (XRD) method, scanning electron microscopy (SEM), and energy dispersive X-ray spectroscopy (EDS). These nominal compounds, previously known as the oxygen-deficient layered perovskites with the sequences of $NbO_6-MO_4-NbO_6$ in tripled slab, in fact, were mixed phases of n = 3 Dion-Jacobson phases and impurities such as $Ca_2NbFeO_6$ and $Ca_3Al_2O_6$. The difference of morphology and chemical in-homogeneity between Dion-Jacobson phases and impurities could be clearly identified by scanning electron microscopy with energy-dispersive X-ray spectroscopy. The chemical composition of $CsCa_2Nb_2FeO_9$ was calculated into $Cs_{0.59}Ca_{2.64}Nb_{2.92}Fe_{0.81}$ in small agglomerate crystals and $Cs_{0.95}Ca_{1.97}Nb_{3.08}Fe_{0.15}$ in long plate-like crystals.

• 폴리머
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• 제37권4호
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• pp.547-552
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• 2013

폴리이미드에 폴리실록산 블록을 포함시키는 형태의 공중합체를 통해 내열 점착특성을 갖는 박막층을 형성하였다. 카르복시기를 포함하는 폴리이미드를 중합하여 디아미노실록산과 반응하면서 필름을 형성하는 제조방법에서 그래프트화 및 가교결합을 형성하였다. 투과전자현미경과 energy dispersive X-ray spectroscopy(EDX)를 통한 모폴로지 조사에서 폴리이미드와 폴리실록산 부분은 각각 100 nm 크기의 구형 도메인과 연속상을 갖는 마이크로 상분리 구조를 갖는 것을 확인하였다. 또한 X-ray photoelectron spectroscopy(XPS) 분석에서는 공기-필름 계면에 폴리실록산 성분이 주로 노출되고 있음이 나타났다. $400^{\circ}C$까지 내열성을 갖는 폴리(이미드실록산) 박막층은 상온에서 $300^{\circ}C$까지 그 점착 특성이 유지됨을 확인하였다. 폴리이미드의 카르복시기와 아미노실록산의 그래프트화가 마이크로도메인 형성과 점착특성을 나타내는데 중요하게 작용함을 비교실험을 통해 확인하였다.

• 한국입자에어로졸학회지
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• 제9권4호
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• pp.209-219
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• 2013

We have used the modified diffusion flame burner to synthesize silica coated iron oxide nanoparticles having enhanced superparamagnetic property. Silica-encapsulated iron oxide particles were directly observed using a high resolution transmission electron microscope. From the energy dispersive X-ray spectroscopy (EDS) and zeta potential measurements, the iron oxide particles were found to be completely covered by a silica coating layer. X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) measurements revealed that the iron oxide core consists of ${\gamma}-Fe_2O_3$ rather than ${\alpha}-Fe_2O_3$. Our magnetization measurements support this conclusion. Biocompatibility test of the silica-coated iron oxide nanoparticles is also conducted using the protein adsorption onto the coated particle.

• 공업화학
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• 제32권5호
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• pp.497-503
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• 2021

본 연구에서는 악취가스 및 휘발성 유기 화합물을 산화 제거하기 위한 백금/티타니아를 허니컴 및 메탈폼 담체에 코팅하는 방법을 확인하였다. 다양한 방법 중 파우더 코팅과 나노 코팅에 대한 비교를 수행하였다. SEM/EDX (Scanning Electron Microscopy/Energy Dispersive X-ray spectroscopy) 분석은 허니컴 및 메탈폼의 표면 상태 및 노출된 백금 성분비를 조사하는데 사용되었다. 또한, 촉매 코팅 방법에 따른 톨루엔, 트리메틸아민, 아이소프로필 알코올의 제거 성능을 비교하였다.

• 한국진공학회지
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• 제22권2호
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• pp.105-110
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• 2013

Vapor-Liquid-Solid 방법을 이용하여 다양한 성장온도와 V/III 비율 아래 $In_xGa_{1-x}As$ 나노와이어를 실리콘 (111) 기판 위에 성장하였다. 나노와이어 성장은 화학기상증착(MOCVD)장치를 이용하였으며, 나노와이어의 구조적 특성은 주사전자현미경 및 투과전자현미경을 이용하여 분석하였다. 나노와이어의 조성비 분포를 확인하기 위하여 투과전자현미경에 장착된 Energy dispersive X-ray 분석기로 나노와이어의 길이에 따른 In과 Ga의 조성비를 측정하였다. 성장온도와 V/III 비율이 올라갈수록 In 조성비가 나노와이어 내부에서 크게 변하는 것을 확인하였는데, 이는 Vapor-Solid 방식에 의한 나노와이어 표면에서의 성장이 증가하기 때문으로 이해된다.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• 제49권1호
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• pp.43-48
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• 2023

The biocompatibility and durability of implant fixtures are major concerns for dentists and patients. Mechanical complications of the implant include abutment screw loosening, screw fracture, loss of implant prostheses, and implant fracture. This case report aims to describe management of a case of fixture damage that occurred after screw fracture in a tissue level, internal connection implant and microscopic evaluation of the fractured fixture. A trephine bur was used to remove the fixture, and the socket was grafted using allogeneic bone material. The failed implant was examined by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS), which revealed a fractured fixture with both normal and irregular bone patterns. The SEM and EDS results give an enlightenment of the failed fixture surface micromorphology with microfracture and contaminated chemical compositions. Noticeably, the significantly high level of gold (Au) on the implant surface and the trace amounts of Au and titanium (Ti) in the bone tissue were recorded, which might have resulted from instability and micro-movement of the implant-abutment connection over an extended period of time. Further study with larger number of patient and different types of implants is needed for further conclusion.

• 한국세라믹학회지
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• 제27권1호
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• pp.136-146
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• 1990

Whiskers of SiC were grown from the mixture of silica and graphite powders by Acheson method(direct heating method). The structrua, morphological and chemical characterizations have been performed by X-ray diffractometer(XRD), transmission electron microscopy(TEM), optical microscopy(OM), scanning electron microscopy(SEM), X-ray photoelectron spectroscopy(XPS) and energy dispersive spectrometer(EDS). The growth mechanism of SiC whiskers is also discussed.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• 한국전자현미경학회:학술대회논문집
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• 한국현미경학회 2004년도 제35차 추계학술대회 및 제2회 HVEM 이용자 워크샵
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• pp.119-121
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• 2004