• Information and Communications Magazine
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• v.28 no.11
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• pp.24-30
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• 2011

본고에서는 소형 고집적 이동단말기용 패키지를 위해 구현 되고 있는 능/수동소자 내장형 패키지 기술에 대해 알아보고자 한다. 능/수동소자내장형 패키지 기술은 IC 칩과 같은 능동 소자와 저항, 커패시터, 인덕터와 같은 수동소자 부품들을 패키지 기판 내부에 내장시켜 소형화를 추구함과 더불어 칩과 수동소자간의 접속 길이를 짧게 해서 전기적 성능을 향상시키실 수 있는 패키징 기술이다. 본 원고에서는 PCB기술에 기반을 둔 embedded active device 기술과 웨이퍼 레벨 패키징 기술에 기반을 둔 fan-out embedded wafer level package 기술 동향에 대해 서술하고 그 특정들을 비교 분석하였으며 이 기술들에 대환 동향을 살펴보고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.315-315
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• 2010

휴대용 전자 기기는 얇고 가벼우면서 빠른 대용량을 처리하는 속도와 다기능이 필요한 추세로 가고 있다. 기기 크기가 작아짐에 따라서 내장 되는 칩 또한 소형화, 고집적화, 고성능화가 요구되므로 이에 상응하는 발전된 패키징 기술이 필요하게 되었고, 이에 대응하기위해서 embedded components device 패키징 기술이 필요로 하게 되었다. 본 연구에서는 $21{\Omega}$ 의 저항 값을 갖는 1005 수동 소자를 prepreg를 이용하여 PCB기판에 내장 한 후 micro via를 이용하여 무전해 구리 도금으로 전기적인 연결을 하여 기판을 제작하였다. 제작되어진 기판으로 Reflow, Aging 테스트 후 칩과 계면간의 금속화합물 반응을 관찰하였다. 또한 Reflow외 시효처리를 끝마친 기판을 사용하여 drop test를 실시한 후 fail 발생 시 저항 값의 변화와 접합부의 미세조직을 관찰하였다.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.737-743
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• 2011

In this paper, we designed and implemented a Monopole+IFA(Inverted F Antenna) hybrid antenna using the coupled feeding structure for the all band mobile phone. Studied antenna has wide band characteristics by the simultaneous operation both monopole and IFA under the coupled feeding structure. An antenna has designed PCB embedded type without antenna carrier component for the low in cost. Implemented antenna has within 2.5:1 for VSWR under LTE/CDMA/GSM900/DCS/USPCS/WCDMA/WiBro/WiFi in all band for the mobile services Measured average gains and efficiencies were -3.98~-0.09 dBi and 40.03~97.99 % for the LTE, CDMA, GSM900 band, and -3.90~-1.01 dBi and 40.70~79.31 % for the DCS, USPCS, WCDMA, WiBro, WiFi band. It's shown that studied antenna can be applied to all band mobile phone antenna including LTE.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.4
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• pp.357-364
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• 2015

In this paper, we designed and implemented a PIFA(Planar Inverted F Antenna) + IFA(Inverted F Antenna) hybrid MIMO(Multi Input Multi Output) antenna for the hexa mobile communication service band. By the simultaneous operation both PIFA and IFA using the coupled feeding structure, we tried for application to modern mobile phones that have large ground size. A PIFA is applied to the ground area, and an IFA is applied to no ground small space on top of the phone. A diagonal fed MIMO antenna is implemented PCB embedded type without antenna carrier component. Implemented antenna on the bare board measured within 3 : 1 for VSWR under hexa mobile communication band as CDMA, GSM900, DCS, KPCS, USPCS, and WCDMA. Measured average gains and efficiencies were -5.19~-3.16 dBi and 30.27~48.26 % for the CDMA, GSM900 band, and -9.50~-5.19 dBi and 11.23~30.28 % for the DCS, KPCS, USPCS, WCDMA band. It's shown that studied antenna can be applied to the antenna for the modern mobile phone.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.6
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• pp.1413-1421
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• 2014

This paper realize power control embedded system with one master of Core-A 32-bit RISC processor and several slaves controling power with synchronized digital signals. Core-A platform is consisted of Core-A processor, AMBA bus, SSRAM, AC97, DMA, UART, GPIO etc. Slave is made by both digital part and analog part. The former generates various power control patterns synchronized with master signal. The latter converts 220V power proportional to 4 bit digital signals. design of Embedded system is executed in Flowrian II, in which software is cross-compiled and hardware is verified by simulation. Embedded system is implemented in FPGA board and CPLD chips as well as PCB board for analog power control.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.644-647
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• 2004

RF 시스템에서 발룬(Balun)은 회로기판과 집적회로 사이의 임피던스 매칭에 사용되는 소자로서, 전력의 균등한 분배와 함께 180도 위상차를 만드는 역할을 하는 주요 회로부품이다. 시스템의 요구사양에 따라 balanced 임피던스가 $50\Omega$인 소자뿐만 아니라, 25 또는 100, $200\Omega$인 소자들도 많이 사용되는데, 대부분의 계측기가 $50\Omega$을 I/O 임피던스로 설정하고 있어, balanced 임피던스가 $50\Omega$이 아닌 경우 특성을 측정하기 위해서는 별도의 지그설계가 필요하다. 본 연구에서는 중심주파수가 900MHz이고, balanced 임피던스가 $100\Omega$이며, LTCC 모듈 내에 내장되는 임베디드 발룬의 최적 평가를 위한 PCB 측정지그의 구조에 대하여 설계 및 시뮬레이션을 실시하고, 이에 따라 제작된 지그를 시뮬레이션 결과와 비교하였다. 지그를 구성하는 마이크로스트림의 임피던스를 조절함으로써 유효한 측정주파수범위를 넓힐 수 있었으며, 제작된 지그는 설계치에 거의 근접한 전송특성을 나타내었다.

• Journal of Korea Society of Industrial Information Systems
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• v.11 no.5
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• pp.98-104
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• 2006

In this parer, proposed a Miniature inverted F Antenna for Bluetooth applications using folded structure and confirm it through producing and measurement. The proposed antenna as PIFA is optimized the impedance matching and the radiation pattern by positioning of feed line and short line. This antenna is designed with Microwave Studio presented CST and the optimized antenna structure is fabricated. The optimized miniature antenna size is 17.3 * 6 * 0.8 mm, the measured return loss bandwidth is 220MHz at 2.45GHz, the radiation pattern is quasi omni, and the gain is -1 dBi. these results are similar to the simulation data. It is comparatively appropriate for Bluetooth system.

• Journal of Advanced Navigation Technology
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• v.24 no.6
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• pp.593-600
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• 2020

The equipment for marine IoT service have to overcome the effect of seawater. Furthermore, the free floating transmitter in seawater will be less affected by the seawater environment. The results of the design and fabrication of antenna, which is embedded in buoy, are shown in this research. The proposed antenna is used to supervise the states of fishing gears in monitoring system for real-name system of electric fishing gear. The selected frequency band of the proposed antenna is 920 MHz, and PCB pattern type is selected for subminiature and light weight. It is confirmed that RF characteristics is more degraded, however, the radiation is gradually upward as the contact surface of buoy with seawater is more broaden through the simulation results. That is, the RF performance of the proposed antenna is more deteriorated but beam radiation characteristics is more suited the marine IoT, the seawater effect is more increased. It is expected that the proposed antenna will contribute the implementation of IoT network based on low power wide area (LPWA) when the degradation of RF performance will be settled.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.809-812
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• 2013

This paper realize power control embedded system with one master of Core-A 32-bit RISC processor and several slaves controling power with synchronized digital signals. Core-A platform provided by Dynalith Systems consists of Core-A processor, AMBA bus, SSRAM, AC97, DMA, UART, GPIO etc. Slave is made by both digital part and analog part. The former generates various power control patterns synchronized with master signal. The latter converts 220V power proportional to 4 bit digital signals. Design of Embedded system is executed in Flowrian2 of System Centroid Inc., in which software is cross-compiled and hardware is verified by simulation. Embedded system is implemented in FPGA board and CPLD chips as well as PCB board for analog power control.