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부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향  

Park, Se-Hun (전자부품연구원)
Kim, Jun-Cheol (전자부품연구원)
Park, Jong-Cheol (전자부품연구원)
Kim, Yeong-Ho (한양대학교)
Publication Information
Information and Communications Magazine / v.28, no.11, 2011 , pp. 24-30 More about this Journal
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연도 인용수 순위
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