• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.11
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• pp.12-20
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• 2013

Even though extensive research results have been applied to wireless cellular systems to improve their capacity and coverage, severe performance degradation experienced in cell boundary areas still remains as a major limiting factor to prohibit further improvement of user equipment (UE) throughput. In the Long Term Evolution-Advanced (LTE-A) standard of the Third Generation Partnership Project (3GPP), Some advanced techniques have been introduced to overcome this "cell-edge problem", including coordinated multipoint transmission and reception (CoMP) and inter-cell interference coordination (ICIC). In this paper, we propose yet another strategy to improve the performance of low-tier UEs by using the concept of multiple beam direction patterns (BDPs). Such multiple BDPs can be implemented using multi-layer antenna arrays stacked vertically at base station (BS) sites to transmit signals in different main beam directions. In comparison to conventional three-sector antennas with a fixed beam pattern, the proposed methods makes signal transmission in a rotational fashion to significantly enhance the reception quality of UEs located near sector (or cell) edge areas, preventing the situation where certain UEs are marginally covered by the BS for the whole transmission time. Performance evaluation results show that the proposed scheme outperforms the conventional three-sector transmission by 171% in low 5% UEs in terms of the UE throughput.

• Journal of IKEEE
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• v.20 no.1
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• pp.61-67
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• 2016

In this paper, a hardware design method is proposed for high speed high precision neutron radiation measurements. Our system is fabricated to use a high performance A/D Converter for digital data conversion of high precision and high speed analog signals. Using a neutron sensor, incident neutron radiation particles are detected; a precision microcurrent measurement module is also included: this module allows for more precise and rapid neutron radiation measurement design. The high speed high precision neutron measurement hardware system is composed of the neutron sensor, variable high voltage generator, microcurrent precision measurement component, embedded system, and display screen. The neutron sensor detects neutron radiation using high density polyethylene. The variable high voltage generator functions as a 0 ~ 2KV variable high voltage generator that is robust against heat and noise; this generator allows the neutron sensor to perform normally. The microcurrent precision measurement component employs a high performance A/D Converter to precisely and swiftly measure the high precision high speed microcurrent signal from the neutron sensor and to convert this analog signal into a digital one. The embedded system component performs multiple functions including neutron radiation measurement for high speed high precision neutron measurements, variable high voltage generator control, wired and wireless communications control, and data recording. Experiments using the proposed high speed high precision neutron measurement hardware shows that the hardware exhibits superior performance compared to that of conventional equipment with regard to measurement uncertainty, neutron measurement rate, accuracy, and neutron measurement range.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.1135-1144
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• 2018

An electric wheelchair used to be utilized as a piece of equipment for the disabled and the elderly in the past, but the recent changes to its functions and forms have made it available across various fields and purposes. In this paper, we propose a continuous track type of electric wheelchair prototype to be used in various fields and environments and a monitoring system to control it. A frame stress design was applied to improve its stability during driving compared with the previous wheelchairs. In addition, we provide a convenience for free and easy operation of them using the App. based on android. A monitoring system based on C# was also added to control a large number of electric wheelchairs. As a result of the implementation and performance evaluation, the von Mises stress value was measured 4.401% within the normal range through five times of stress interpretations, and its accuracy of communication for system manipulation was recorded about 98.75%, which means that it has been proven to be safer than the previous wheelchairs.

• Journal of Navigation and Port Research
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• v.29 no.5 s.101
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• pp.395-402
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• 2005

The most important point when we engage on waterway dredging work is supplying safe navigational passage to the vessels underway by narrowing dredge work area and removing submerged dangers. In order to meet this end it is necessary to use auxiliary equipment for shifting actively and mooring and adopt automation of dredging work by integrating information on real time position, dredging depth, and work information. The dredger with a spud control system in this study, by the way, is able to employed on continuous dredging work with the narrowest working area allowing wide and safe passages to vessels underway, by moving the dredger to the working zone with the spud controlled automatically. Furthermore, it has been improved definitely compared with the existing dredging process management system such that it shows the track of spud and working depth on the electronic navigation chart of window, together with the final outcome of dredging work. The test dredging work at the entrance of Busan North Port for system evaluation showed that actual working time available was twice of the one by the existing anchor system, and that it reduced $38\%$ of time for preparation work and one man power.

• Journal of Navigation and Port Research
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• v.31 no.10
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• pp.807-812
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• 2007

With the advent of Electronic Chart Display and Information Systems(ECDIS) and Automatic Identification Systems (AIS) as the principal navigation equipment of E-navigation strategy, mariners will begin to practice "e-navigation" and increasingly rely upon these systems to navigate safely and efficiently. However, these electronic systems require "e-inputs" in order to function. At present, the choices for e-input are limited, and they are installation dependent. This means that the mariner must be suitably equipped in order to use an alternative e-input. If the primary e-input is lost, and the vessel is not equipped to make use of suitable alternative e-inputs, then continued operations will have to be done the "old fashioned way" using conventional navigation The final objective is a recommendation of dual harbor positioning system on the most appropriate mix of positioning systems to satisfy the marine needs for radionavigation, positioning services.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• Resources Recycling
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• v.27 no.6
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• pp.23-29
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• 2018

Recently rapid economic growth and technological development have led to an increase in the generation of waste electrical and electronic equipment (WEEE). As the amount of electric and electronic waste generated increases, the importance of processing waste printed circuit boards (PCB) is also increasing. Various studies have been conducted to recycle various valuable metals contained in a waste PCB in an environmentally friendly and economical manner. To get anode slime containing Ag and Au, Anode copper prepared from PCB scraps was used by means of electro-refining. Ag and Au recovery was conducted by leaching, direct reduction, and ion exchange method. In the case of silver, the anode slime was leached at 3 M $HNO_3$, 100 g/L, $70^{\circ}C$, and Ag was recovered by precipitation, alkali dissolution, and reduction method. In the case of gold, the nitrate leaching residues of the anode slime was leached at 25% aqua regia, 200 g/L, $70^{\circ}C$, and Au was recovered by pH adjustment, ion exchange resin adsorption, desorption and reduction method. The purity of the obtained Au and Ag were confirmed to be 99.99%.