• The Transactions of the Korean Institute of Power Electronics
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• v.13 no.1
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• pp.15-21
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• 2008

This paper presented a actual conditions on a false-tripping of ELB(Earth Leakage Breakers) and an assessment of the harmonics due to non-linear electronic equipment such as personal computers, rectifier, electric furnace and test equipments in factory electrical installation. Actual conditions on a failure of ELB were surveyed and analyzed by making up a question to safety managers of factory electrical installation. Also, power quality measurements such as harmonic currents, voltage and current waveform and current imbalance were made at various factory electrical installation where nuisance tripping of ELB is often occurred. The results of this study can be used in making decisions regarding cause of ELB trip and operating and tripping characteristics test of ELB when subjected to distorted current waveform.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.112-117
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• 2004

$Y_2$$_{-x}$G $d_{x}$ $O_3$:E $u^{3+}$(x=0.0, 0.3, 0.6, 1.0, 1.4) luminescent thin films have been grown on Si (100) substrates using pulsed laser deposition. The films grown under different deposition conditions have been characterized using microstructural and luminescent measurements. The crystallinity, the surface morphology and photoluminescence (PL) of the films are highly dependent on the amount of Gd. The photoluminescence (PL) brightness data obtained from $Y_2$$_{-x}$G $d_{x}$ $O_3$:E $u^{3+}$ films grown under optimized conditions have indicated that Si (100) is one of promised substrates for the growth of high quality $Y_2$$_{-x}$G $d_{x}$ $O_3$:E $u^{3+}$ thin film red phosphor. In particular, the incorporation of Gd into $Y_2$ $O_3$ lattice could induce a remarkable increase of PL. The highest emission intensity was observed with $Y_{1.35}$G $d_{0.60}$ $O_3$: $E^{3+}$, whose brightness was increased by a factor of 1.95 in comparison with that of $Y_2$ $O_3$:E $u^{3+}$ films.3+/ films.films.lms.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.764-768
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• 2002

Characteristics of ohmic Co/Si/Co contacts to n-type 4H-SiC are investigated systematically. The ohmic contacts were formed by annealing Co/Si/Co sputtered sequentially. The annealings were performed at $800^{\circ}C$ using RTP in vacuum ambient and $Ar:H_2$(9:1) ambient, respectively. The specific contact resistivity$(\rho_c)$, sheet resistance$(R_s)$, contact resistance$(R_c)$, transfer length$(L_T)$ were calculated from resistance$(R_T)$ versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. While the resulting measurement values of sample annealed at vacuum ambient were $\rho_c=1.0{\tiimes}10^{-5}{\Omega}cm^2$, $R_c=20{\Omega}$ and $L_T$ = 6.0 those of sample annealed at $Ar:H_2$(9:1) ambient were $\rho_c=4.0{\tiimes}10^{-6}{\Omega}cm^2$, $R_c=4.0{\Omega}$ and $L_T$ = 2.0. The physical properties of contacts were examined using XRD and AES. The results showed that cobalt silicide was formed on SiC and Co was migrated into SiC.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.91-97
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• 2013

Self-heating effects during operation of high current AlGaN/GaN power transistors degrade the current-voltage characteristics. In particular, this problem becomes serious when a low thermal conductivity Si substrate is used. In this work, AlGaN/GaN-on-Si devices were fabricated with various channel widths and Si substrate thicknesses in which the structure dependent self-heating effects were investigated by temperature dependent measurements as well as thermal simulation. Accordingly, a device structure that can effectively dissipate the heat was proposed in order to achieve the maximum current in a multi-channel, large area device. Employing via-holes and common electrodes with a 100 ${\mu}m$ Si substrate thickness improved the current level by 75% reducing the channel temperature by 68%.

• Journal of IKEEE
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• v.24 no.2
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• pp.604-609
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• 2020

We investigated the influence of rapid thermal annealing on aluminum nitride (AlN) thin film Schottky barrier diodes (SBDs) manufactured structures deposited on a 4H-silicon carbide (SiC) wafer using radio frequency sputtering. The Ni/AlN/4H-SiC devices annealed at 400℃ exhibited Schottky barrier diode (SBDs) properties with an on/off current ratio that was approximately 10 times higher than that of the as-deposited device structures and the devices annealed at 600℃ as measured at room temperature. Auger electron spectroscopy (AES) measurements revealed that atomic oxygen concentrations in the annealed AlN devices at 400℃, is ascribed to the improvement in on/off ratio and the reduction of on-resistance. Additionally, we investigated the electrical characteristics of the AlN/SiC SBD structures depending on the frequency variation of sound waves.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.83-87
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• 2002

Plasma enhanced chemical vapor deposited (PECVD) silicon nitride ($SiN_X$) is widely used as a gate dielectric material for the hydrogenated amorphous silicon(a-Si:H) thin film transistors (TFT's). We investigated $SiN_X$ films were deposited PECVD at low temperature ($300^{\circ}C$). The reaction gases were used pure nitrogen and a helium diluted of silane gas(20% $SiH_4$, 80% He). Experimental investigations were carried out with the variation of $N_2/SiH_4$ flow ratios from 3 to 50 and the rf power of 200 W. This article presents the $SiN_X$ gate dielectric studies in terms of deposition rate, hydrogen content, etch rate and C-V, leakage current density characteristics for the gate dielectric layer of thin film transistor applications. Electrical properties were analyzed through high frequency (1MHz) C-V and current-voltage (I-V) measurements. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.808-812
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• 2006

In this dissertation, Ru-Zr metal gate electrode deposited on two kinds of dielectric were formed for MOS capacitor. Sample co-sputtering method was used as a alloy deposition method. Various atomic composition was achieved when metal film was deposited by controlling sputtering power. To study the characteristics of metal gate electrode, C-V(capacitance-voltage) and I-V(current-voltage) measurements were performed. Work function and equivalent oxide thickness were extracted from C-V curves by using NCSU(North Carolina State University) quantum model. After the annealing at various temperature, thermal/chemical stability was verified by measuring the variation of effective oxide thickness and work function. This dissertation verified that Ru-Zr gate electrodes deposited on $SiO_{2}\;and\;ZrO_{2}$ have compatible work functions for NMOS at the specified atomic composition and this metal alloys are thermally stable. Ru-Zr metal gate electrode deposited on $SiO_{2}\;and\;ZrO_{2}$ exhibit low sheet resistance and this values were varied with temperature. Metal alloy deposited on two kinds of dielectric proposed in this dissertation will be used in company with high-k dielectric replacing polysilicon and will lead improvement of CMOS properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.1
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• pp.51-56
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• 2015

The object of this study is to obtain the optimum mix proportion of halogen free compound with flame resistance and, for the purpose, thermal/electrical characteristics test are conducted using compatibilizing agents, flame resistance agents, hydroxide aluminum, sunscreen, antioxidant and silicon oil on the base resin of linear low density polyethylene (LLDPE), Ethylene vinyl acetate copolymer (EVA). Existing compound method accompanies many requirements to be satisfied including a lot of addition of flame resistance agents, prohibition of impact on mixing capability with base and property and etc. In this study, different from the existing method, the optimum mix proportion is determined and experimented by adding nano clay. Oxygen index test shows no difference between specimens while T-6, T-9 shows oxygen index of 29[%] and 26[%], respectively. This is concluded that hydroxide aluminum, which is a flame resistance agent, leads low oxygen index. From UL94-V vertical flame resistance test, the combustion behavior is determined as V-0, Fail based on UL94-V decision criteria. Viscometry shows low measurements in specimens with separate addition of compatibilizing agents or nano clay. Volume resistivity test shows low measurement mainly in specimens without compatibilizing agents. Therefore, with the flame resistance compound shows better performance for thermal/electrical property and the optimum mix proportion are achieved among many existing materials.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1058-1064
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• 2006

In this paper, the channel capacity of a specified wireless indoor multiple-input multiple-output(MIMO) channel is estimated by analyzing spatial characteristics of this channel using the three-dimensional ray tracing method, and a technique for deriving an optimized separation of multi-antenna elements is proposed. At first, the ray paths, the path losses, and the time-delay profile are computed using the three-dimensional ray tracing method in an indoor corridor environment, which has the line of sight(LOS) and non-line of sight(NLOS) regions. The ray tracing method is verified by a comparison between the computation results and the measurements which are obtained with dipole antennas, an amplifier and a network analyzer. Then, an MIMO system is positioned in the indoor channel environment and the ray paths and path losses are computed for four antenna-position combinations and various values of the antenna separation to obtain the channel capacity for the MIMO system. An optimum antenna-separation is derived by averaging the channel capacities of 100 receiver positions with four different antenna combinations.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.24-27
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• 2011

Effect of substitution of Mn for Ni on transformation behavior, shape memory characteristics and superelasticity of Ti45Ni-5Cu alloy has been investigated by means of electrical resistivity measurements, X-ray diffraction, thermal cycling tests under constant load and tensile tests. The one-stage B2-B19' transformation occurred when Mn content was 0.5 at%, above which the two-stage B2-B19-B19' transformation occurred. A temperature range where the B19 martensite exists was expanded with increasing Mn content because decreasing rate of Ms (60 K / % Mn) was larger than that of Ms' (40 K / % Mn). Ti-(45-x)Ni-5Cu-xMn alloys were deformed in plastic manner with a fracture strain of 60 % ~ 32 % depending on Mn content. Clear superelasticity was found in fully annealed Ti-(45-x)Ni-5Cu-xMn alloys with Mn content more than 1.0 at%, which was ascribe to a solid solution hardening by substitution of Mn for Ni.