• Journal of the korean Society of Automotive Engineers
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• v.14 no.2
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• pp.76-87
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• 1992

Flow and heat transfer characteristics in a horizontal electronic circuit board are studied numerically. The board has the arrays of heated blocks and the spaces between the plates and blocks are changed. Air in used as cooling fluid, of which prandt1 number is 0.7. The velocity distributions, temperature distributions, Nusselt numbers and dimensionless friction factors are obtained on the spaces between the plates and the blocks, for the cases of Rayleigh number, 0 and 10$^{5}$ . When Rayleigh number is so large, such as 10$^{5}$ , that the effect of bouyancy is not negligible, fluid friction and heat transfer is increased more than those of forced convection. This may be caused by the generation of secondary flow on the cross section of primary flow. The effect of bouyancy is of the most efficient, when the space of blocks is about block-width and the space of plates is about 1.7 times of block-height.

• IE interfaces
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• v.12 no.1
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• pp.56-67
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• 1999

This paper is about implementation issues for use of the Internet technology in education. An examination of the current status of virtual university provides guidance for subsequent prototype development. A virtual university is the Internet based process by which students increase their specific knowledge and skills via electronic interaction with content and people. Virtual university enables colleges and universities to provide students and faculty with network access to courseware and educational materials on multimedia servers free from time and geography constraints. In this paper, we present a prototype instruction support system (ISS). The ISS consists of the following components in architecture: Internet, software, hardware, database systems, users, and workflow. The ISS also assists several functions as follows: lecture notes, register processes, attendance checks, built-in boards, grading systems, questions and answers, electronic libraries, chats, and search engines. Our work will provide a guideline for the development of a virtual classroom for distance education and learning.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.663-666
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.

• Journal of Information Technology Services
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• v.12 no.4
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• pp.449-459
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• 2013

The software which is used for electronic bulletin boards have shortcomings that the addition of new function and new information's type to the order point software is very difficult, and the aggressive adaption of newly introduced type of media is impossible because the software is developed by custom solution. Eventually new cost and time are required to enhance functionality or performance to software of DID(Digital Information Display). In this paper, we proposed the scheme to package DID's contents and to customize it using plug-in method. We conducted a case study of this scheme. The platform which can install Apps to DID as one of content was designed. Apps can be inserted by plug-in type on DID platform and run separately with DID framework. As a result, We got advantage that various contents, functions and Apps which are drived on Android can be displayed without any restriction and dependency because Apps itself is one of dynamic notice object. This solution increase reusability of Apps or contents, and can be used easily in various places such as airports, stations, terminals, and front desk by customizing.

• The Journal of the Korea institute of electronic communication sciences
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• v.11 no.5
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• pp.465-472
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• 2016

This study materialized an FPGA-based system to extract PCB patterns. The Printed Circuit Boards that are produced these days are becoming more detailed and complex. Therefore, the importance of a vision system to extract defects of detailed patterns is increasing. This study produced an FPGA-based system that has high speed handling for vision automation of the PCB production process. A vision library that is used to extract defect patterns was also materialized in IPs to optimize the system. The IPs materialized are Camera Link IP, pattern matching IP, VGA IP, edge extraction IP, and memory IP.

• Journal of Power Electronics
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• v.12 no.5
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• pp.813-820
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• 2012

This paper presents the development of a software supported acquisition system for metrological verification and testing of the equipment for monitoring and analysis of the basic electrical power quality parameters. The described procedure consists of two functionally connected segments. The first segment involves generation of the reference three-phase voltage signals, including the possibility of simulation of the various power quality disturbances, typical for electrical power distribution networks. The second part of this procedure includes the real-time recording of power quality disturbances in three-phase distribution networks. The procedure is functionally supported by the virtual instrumentation concept, including a software application developed in LabVIEW environment and data acquisition boards NI 6713 and NI 9215A. The software support of this system performs graphical presentation of the previously generated and recorded signal waveforms. A number of the control functions and buttons, implemented on the virtual instrument front panels, are provided to adjust the basic signal acquisition, generation and recording parameters.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.1
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• pp.81-86
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• 2019

This paper is concerned with a system design that enables a the plurality of switching mode power supplies to be supplied with larger power through a parallel connection. For this purpose, a shunt resistor is placed in series at the output of the constant voltage regulator and the output voltage is sensed and controlled using an arduino. In this paper, two constant-voltage regulators were used for the experiment, but it is possible to generalize for more boards. By using the method that controls the system, the sum of the currents delivered by the two systems to the load was found to be 96% of the current drawn from each board. In case of efficiency, 92.4% efficiency is achieved in the unit board and the efficiency in parallel connection is about 90%.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.6
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• pp.43-50
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• 2010

In this paper, we analyzed radiated emission generated by the split power/ground plane structures in order to reduce EMI in system modules. The magnetic fields and electric fields were simulated and measured on the test boards under various conditions. In order to reduce radiated emission, we have to determine spacing and location of the split ground gap so that input signal frequency does not coincide with the resonance frequency of the split power/ground plane structure and the phase of reflection coefficient is close to $0^{\circ}$ at input signal frequency. Moreover, we found that inserting a stitching capacitor could reduce the radiated emission. Low magnitude of reflection coefficient and the phase close to $0^{\circ}$ are required to reduce radiated emission. It is necessary to properly decide value and location of a stitching capacitor to fulfil those requirements.

• Applied Chemistry for Engineering
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• v.23 no.4
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• pp.367-371
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• 2012

Waste printed circuit boards (WPCBs) contain valuable metals such as Cu, Ni, Au, Ag, and Pd. For an effective recycling of WPCBs, it is essential to recover the valuable metals. In recent years, recycling processes have come to be necessary for separating noble metals from WPCBs due to an increasing amount of electronic device wastes. However, it is well known that glass reinforced epoxy resins in the WPCBs are difficult materials to separate into elemental components, namely metals, glass fibers and epoxy resins in the chemical recycling process. $K_3PO_4$ as a catalyst in dimethylformamide (DMF) and N-Methyl-2-pyrrolidone (NMP) was used to depolymerize epoxy resins for recovering metallic and non-metallic components from WPCBs. Reactions of WPCBs were carried out at temperatures $160{\sim}200^{\circ}C$ for 2~12 h. The recycled glass fiber from WPCBs was analyzed by thermogravimetric analyzer (TGA) and evaluated the degree of solubility of the epoxy resin for separation efficiencies of the WPCBs.