Journal of the korean Society of Automotive Engineers (오토저널)
- Volume 14 Issue 2
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- Pages.76-87
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- 1992
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- 1739-4791(pISSN)
A numerical study of design condition for horizontal electronic circuit boards flow and heat transfer characteristics
유동과 열전달 특성을 고려한 수평 전자회로 기판의 설계조건에 관한 수치적 연구
Abstract
Flow and heat transfer characteristics in a horizontal electronic circuit board are studied numerically. The board has the arrays of heated blocks and the spaces between the plates and blocks are changed. Air in used as cooling fluid, of which prandt1 number is 0.7. The velocity distributions, temperature distributions, Nusselt numbers and dimensionless friction factors are obtained on the spaces between the plates and the blocks, for the cases of Rayleigh number, 0 and 10
Keywords