• 제목/요약/키워드: electro-migration test

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콘크리트 중의 염화물 확산평가를 위한 전기화학적 촉진시험법 (Electrochemical Acceletated Test for Evaluation of Chloride Diffusion in Concrete)

  • 문한영;김홍삼;이승태;정호섭;최두선
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 가을 학술발표회논문집(I)
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    • pp.409-412
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    • 2000
  • Many researchers have been trying to evaluate the diffusion coefficient of chloride ion in concrete by using qualitative and quantitative electro-migration tests. Up to now, however, there has been no sufficient method to closely determine the diffusion coefficient of chloride ion through electro-migration test. In this paper, the diffusion coefficient of chloride ion in concrete was investigated through an electro-migration test, that is, AASHTO T 277, Dhir's method, Tang's method and Andrade's method. And the results of these test were compared with each other.

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TSDC 방법을 이용한 X5R MLCC의 신뢰성 평가 (Thermally Stimulated Depolarization Current Test for Reliability of X5R MLCC)

  • 박지영;박재성;김영태;허강헌
    • 한국세라믹학회지
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    • 제46권2호
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    • pp.155-160
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    • 2009
  • The reliability could be one of the essential properties for multilayer ceramic capacitor (MLCC) using in various electronic devices and the concentration and mobility of oxygen vacancy would play important role in the reliability. To investigate the migration behavior of oxygen vacancies, thermally stimulated depolarization current (TSDC) is adopted. In dielectric material of X5R MLCC, the TSD-Current peak observed around 150$^{\circ}C$ and 200$^{\circ}C$ which represented the migration of oxygen vacancy. Substituting Yttrium for Dysprosium in X5R MLCC showed higher migration activation energy and lower TSD current density.

$0.18{\mu}m$ Generic 공정 기반의 8비트 eFuse OTP Memory 설계 (Design of an eFuse OTP Memory of 8bits Based on a Generic Process)

  • 장지혜;김광일;전황곤;하판봉;김영희
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2011년도 춘계학술대회
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    • pp.687-691
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    • 2011
  • 본 논문에서는 아날로그 트리밍용으로 사용되는 $0.18{\mu}m$ generic 공정 기반의 EM(Electro-Migration)과 eFuse의 저항 변동을 고려한 8bit eFuse OTP (One-Time Programmable) 메모리를 설계하였다. eFuse OTP 메모리는 eFuse에 인가되는 program power를 증가시키기 위해 external program voltage를 사용하였으며, 프로그램되지 않은 cell에 흐르는 read current를 낮추기 위해 RWL (Read Word-Line) activation 이전에 BL을 VSS로 precharging하는 방식과 read NMOS transistor를 최적화 설계하였다. 그리고 프로그램된 eFuse 저항의 변동을 고려한 variable pull-up load를 갖는 sensing margin test 회로를 설계하였다. 한편 eFuse link의 length를 split하여 eFuse OTP의 프로그램 수율 (program yield)을 높였다.

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Design of 1-Kb eFuse OTP Memory IP with Reliability Considered

  • Kim, Jeong-Ho;Kim, Du-Hwi;Jin, Liyan;Ha, Pan-Bong;Kim, Young-Hee
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제11권2호
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    • pp.88-94
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    • 2011
  • In this paper, we design a 1-kb OTP (Onetime programmable) memory IP in consideration of BCD process based EM (Electro-migration) and resistance variations of eFuse. We propose a method of precharging BL to VSS before activation of RWL (Read word-line) and an optimized design of read NMOS transistor to reduce read current through a non-programmed cell. Also, we propose a sensing margin test circuit with a variable pull-up load out of consideration for resistance variations of programmed eFuse. Peak current through the non-programmed eFuse is reduced from 728 ${\mu}A$ to 61 ${\mu}A$ when a simulation is done in the read mode. Furthermore, BL (Bit-line) sensing is possible even if sensed resistance of eFuse has fallen by about 9 $k{\Omega}$ in a wafer read test through a variable pull-up load resistance of BL S/A (Sense amplifier).

혼합재 치환율에 따른 모르타르의 염소이온 확산 특성 (Characteristic of Chloride ion Diffusion in Mortar According to the Substitution Ratios of the Additive)

  • 양승규;정연식;이웅종;유재상;이종열
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2002년도 가을 학술발표회 논문집
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    • pp.17-22
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    • 2002
  • Chloride ions have a tendency to penetrate into concrete and proceed the corrosion by depassivating rebar surface. Thus the deteriorated concrete is subject to experience severe degrading of durability under marine environment. Physical properties of mortar, such as, compressive strength and penetration depth of chloride ion were investigated. And to investigate the effect of containing SG, FA in mortar, the diffusion coefficient of chloride was measured through an electro - migration test. The diffusion coefficient of chloride was decreased with the increase of replacement ratio of SG compared with plain specimen.

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고로슬래그미분말 혼합 콘크리트의 염소이온 확산특성 (Characteristic of Chloride Ion Diffusion in Concrete Containing GGBF)

  • 문한영;김홍삼;김진철;최두선
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2001년도 가을 학술발표회 논문집
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    • pp.793-796
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    • 2001
  • Physical properties of concrete, Such as, compressive strength, permeable pore and penetration depth of chloride ion were investigated. And to investigate the effect of containing GGBF in concrete, the diffusion coefficient of chloride was measured through an electro- migration test. The diffusion coefficient of chloride was decreased with increase of replacement ratios of GGBF when compared to OPC. Relation coefficients between physical properties of concrete and diffusion coefficient of chloride were more than 0.9.

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전기 영동법에 기초한 콘크리트의 급속 염소이온 확산 특성 평가 (Rapid Chloride Penetration Test for Concrete Based on the Electrochemical Method)

  • 오상균;박동천
    • 한국항해항만학회지
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    • 제34권10호
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    • pp.787-792
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    • 2010
  • 콘크리트는 물시멘트비에 상응하는 공극을 가지게 되며, 공극을 통한 염소이온의 확산을 평가하기 위하여 해안가 폭로 및 해수 침지실험이 널리 사용된다. 이상의 실험은 경우에 따라서 다년간의 시간을 요하는 경우도 있어, 최근에는 전기 영동법에 기초한 급속 염소이온 확산시험을 실시하는 경우가 많으나, 그 값이 폭로 및 침지 시험에서 얻은 값과 상이한 경우가 많아 데이터의 실용성을 높이기 위하여 그 원인 규명이 절실한 실정이다. 본 연구에서는 평가 방법으로써 Nernst-Einstein의 식을 통한 염화물 이온 이동계수의 산정방법을 사용하였으며, NT BUILD 492법 및 해수 침지실험을 통한 확산 특성과 비교하여 값의 차이에 대하여 고찰하였다. 그 결과 실험인자의 변화가 염소이온 확산에 미치는 영향은 미비한 것으로 평가되어져 실험조건에서 발생하는 영향은 거의 없는 것으로 규명되었으며, NT BUILD 492법과도 거의 동일한 값이 구해졌다. 침지실험 결과와의 상이는 염소이온 확산에서 경계조건의 차이 및 염소이온의 시멘트 수화물과의 고정화에 의한 것으로 판단되어진다.

고온고습 전원인가 시험에서 Cl에 의한 이온 마이그레이션 불량 (Chlorine effect on ion migration for PCBs under temperature-humidity bias test)

  • 허석환;신안섭
    • Journal of Welding and Joining
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    • 제33권3호
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    • pp.47-53
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    • 2015
  • By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

가속수명시험을 이용한 Packaging Substrate PCB의 ECM에 대한 신뢰성 예측에 관한 연구 (A Study on the Reliability Prediction about ECM of Packaging Substrate PCB by Using Accelerated Life Test)

  • 강대중;이화기
    • 대한안전경영과학회지
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    • 제15권1호
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    • pp.109-120
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    • 2013
  • As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, $20/20{\mu}m$ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

Influence of Endurance tests on Space Charge Distribution of 160kV HVDC XLPE Cable

  • Liu, Yun-Peng;Liu, He-Chen
    • Journal of Electrical Engineering and Technology
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    • 제12권1호
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    • pp.302-309
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    • 2017
  • The ageing of XLPE cable insulation will lead to the accelerating accumulation of space charge, which will greatly affect the safe operation of the HVDC cable. In order to investigate the influence of different ageing modes on the space charge distribution of the HVDC cable, thermal stressed, electrical stressed and electro-thermal stressed endurance tests were carried out on the XLPE peelings. The tested XLPE peelings were obtained from 160kV HVDC cable insulation. The endurance tests were carried at thermal stress of 363K, electrical stress of 20kV/mm DC and a combination of both. The Pulsed Electro-Acoustic (PEA) method was used to measure the space charge distribution of the samples. The influences of ageing on the trap energy distribution were analyzed based on the isothermal relaxation theory and the decay characteristics of the space charge. The results showed that thermal ageing would help to improve the crystalline morphologies of the XLPE at the early stage. The total amount of space charge decreased compared to the ones before thermal ageing. The long term of electrical stress would result in the cleavage of polymer molecule chains which would intensify the accumulation of space charge and increase the density and depth of electron traps. With a combination of electrical and thermal stress, the injection and migration of space charge were more significant. Besides, the depth and density of electron traps increased rapidly with the increase of endurance time.