• 제목/요약/키워드: e-Beam Lithography

검색결과 137건 처리시간 0.054초

Cooper pair transistor에서 gate voltage에 의한 임계전류의 진동 (Oscillation of Critical Current by Gate Voltage in Cooper Pair Transistor)

  • 송운;정연욱;김남
    • Progress in Superconductivity
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    • 제11권2호
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    • pp.158-161
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    • 2010
  • We measured the critical current of a Cooper pair transistor consisting of two Josephson junctions and a gate electrode. The Cooper pair transistors were fabricated by using electron-beam lithography and double-angle evaporation technique. The Gate voltage dependence of critical current was measured by observing voltage jumps at various gate voltages while sweeping bias current. The observed oscillation was 2e-periodic, which shows the Cooper pair transistor had low level of quasiparticle poisoning.

완화형 강유전체$Pb(Mg_{1/3}Nb_{2/3})O_{3}-PbTiO_3$ 단결정의 광 집적소자 응용을 위한 도파로 제작 (Waveguides Fabrication for Optical Integrated Devices Application on Relaxor-ferroelectric $Pb(Mg_{1/3}Nb_{2/3})O_{3}-PbTiO_3$Single Crystal)

  • 양우석;이상구;구경환;허현;윤대호;이한영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.546-547
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    • 2002
  • Ni thin film on the PMN-PT crystal wafer were deposited by using E-beam evaporator technique. Deposited film was patterned by UV-lithography and etching and was in-diffused at 300~600C. Diffusion profile of Ni ions in PMN-PT was measured by secondary ion mass spectroscopy (SIMS).

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양극산화 알루미늄을 이용한 나노패턴 성형용 금형제작 (Fabrication of Nano-Pattern Mold Using Anodic Aluminum Oxide Template)

  • 오정길;김종선;강정진;김종덕;윤경환;황철진
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.240-243
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    • 2009
  • Recently, many researches on the development of super-hydrophobic and anti-reflective surfaces have been concentrated on the fabrication of nano-patterned products. The nano-patterned mold is a key to replicate nano-patterned products by mass production techniques such as injection molding and UV molding. The present paper proposes fabricating nano-patterned mold with cost-effective method. The nano-pattern molded was fabricated by electroforming the anodic aluminum oxide template without E-beam lithography. The final mold with nano-patterns showed the pores with the diameter of $100{\sim}120$ nm and the height of 150 nm was fabricated.

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Enhanced Cathode-Luminescence in a InxGa1-xN/InyGa1-y Green Light Emitting Diode Structure Using Two-Dimensional Photonic Crystals

  • Choi, Eui-Sub;Lee, Jae-Jin
    • Journal of Electrical Engineering and Technology
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    • 제3권2호
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    • pp.276-279
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    • 2008
  • We report on the enhancement of cathode-luminescence in an $In_xGa_{1-x}N/In_yGa_{1-y}$ green light emitting diode structure using two-dimensional photonic crystals. The square lattice arrays of photonic crystals with diameter/periodicity of 200/500 nm were fabricated by electron beam lithography. Inductively coupled plasma dry etching was used to etch and define photonic crystals. Three samples with different etch depths, i.e., 170, 95, and 65 nm, were constructed. Field emission scanning electron microscope analysis shows that air holes of photonic crystal structure with inverted-cone shapes were fabricated after dry etching. Cathode-luminescence measurement indicated that up to 30-fold enhancement of cathode-luminescence intensity has been achieved.

리소그라피를 위한 새로운 가스젯 방식의 Z방전 극자외선 광원 (A new gas jet type Z-pinch extreme ultraviolet light source for next generation lithography)

  • 송인호;최창호;고광철
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1459-1460
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    • 2006
  • A new gas jet Z-pinch EUV light source having double gas jet electrodes has been developed. It has two nozzles and two diffusers. The EUV beam is collected from the side of pinch plasma, generated in between the inner nozzle and corresponding diffuser. A cylindrical shell of He gas curtain produced by the outer nozzle is specially designed for shielding the debris and suppressing the inner gas expansion. We have succeeded in generating EUV energy of 1.22 mJ/sr/2%BW/pulse at 13.5nm. The estimated dimension of EUV source is to be FWHM diameter of 0.07 mm and length of 0.34 mm, and FW 1/e2 diameter of 0.15 mm and length of 1.2 mm.

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100 nm T-gate의 InGaAs/InAlAs/GaAs metamorphic HEMT 소자 제작 및 특성에 관한 연구 (Study on the fabrication and the characterization of 100 nm T-gate InGaAs/InAlAs/GaAs Metamorphic HEMTs)

  • 김형상;신동훈;김순구;김형배;임현식;김현정
    • 한국진공학회지
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    • 제15권6호
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    • pp.637-641
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    • 2006
  • 본 논문에서는 100 nm 게이트 길이를 갖는 InGaAs/InAlAs/GaAs MHEMT(metamorphic high electron mobility transistors)m의 DC와 RF 특성을 분석 하였다. 이중 노광 방법으로 ZEP520/P(MMA-MAA)/PMMA 3층 구조의 레지스터와 게이트 길이 100 nm인 게이트를 제작하였다. 게이트의 단위 폭이 $70\;{\mu}m$인 2개의 게이트와 길이가 100 nm로 제작된 MHEMT를 DC 및 RF특성을 조사하였다. 최대 드레인 전류 밀도는 465 mA/mm, 상호전달 컨덕턴스는 844 mS/mm이, RF 측정으로부터 전류 이득 차단 주파수는 192 GHz와 최대 진동주파수 310 GHz인 특성을 보였다.

Fabrication of Micro Patterned Fibronectin for Studying Adhesion and Alignment Behavior of Human Dermal Fibroblasts

  • Lee, Seung-Jae;Son, Young-Sook;Kim, Chun-Ho;Choi, Man-Soo
    • Macromolecular Research
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    • 제15권4호
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    • pp.348-356
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    • 2007
  • The aim of this study was to fabricate a submicro-and micro-patterned fibronectin coated wafer for a cell culture, which allows the positions and dimensions of the attached cells to be controlled. A replica molding was made into silicon via a photomask in quartz, using E-beam lithography, and then fabricated a polydimethylsiloxane stamp using the designed silicon mold. Hexadecanethiol $[HS(CH_2){_{15}}CH_3]$, adsorbed on the raised plateau of the surface of polydimethylsiloxane stamp, was contact-printed to form self-assembled monolayers (SAMs) of hexadecanethiolate on the surface of an Au-coated glass wafer. In order to form another SAM for control of the surface wafer properties, a hydrophilic hexa (ethylene glycol) terminated alkanethiol $[HS(CH_2){_{11}}(OCH_2CH_2){_6}OH]$ was also synthesized. The structural changes were confirmed using UV and $^1H-NMR$ spectroscopies. A SAM terminated in the hexa(ethylene glycol) groups was subsequently formed on the bare gold remaining on the surface of the Aucoated glass wafer. In order to aid the attachment of cells, fibronectin was adsorbed onto the resulting wafer, with the pattern formed on the gold-coated wafer confirmed using immunofluorescence staining against fibronectin. Fibronectin was adsorbed only onto the SAMs terminated in the methyl groups of the substrate. The hexa (ethylene glycol)-terminated regions resisted the adsorption of protein. Human dermal fibroblasts (P=4), obtained from newborn foreskin, only attached to the fibronectin-coated, methyl-terminated hydrophobic regions of the patterned SAMs. N-HDFs were more actively adhered, and spread in a pattern spacing below $14{\mu}m$, rather than above $17{\mu}m$, could easily migrate on the substrate containing spacing of $10{\mu}m$ or less between the strip lines.

Low Temperature Characteristics of Schottky Barrier Single Electron and Single Hole Transistors

  • Jang, Moongyu;Jun, Myungsim;Zyung, Taehyoung
    • ETRI Journal
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    • 제34권6호
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    • pp.950-953
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    • 2012
  • Schottky barrier single electron transistors (SB-SETs) and Schottky barrier single hole transistors (SB-SHTs) are fabricated on a 20-nm thin silicon-on-insulator substrate incorporating e-beam lithography and a conventional CMOS process technique. Erbium- and platinum-silicide are used as the source and drain material for the SB-SET and SB-SHT, respectively. The manufactured SB-SET and SB-SHT show typical transistor behavior at room temperature with a high drive current of $550{\mu}A/{\mu}m$ and $-376{\mu}A/{\mu}m$, respectively. At 7 K, these devices show SET and SHT characteristics. For the SB-SHT case, the oscillation period is 0.22 V, and the estimated quantum dot size is 16.8 nm. The transconductance is $0.05{\mu}S$ and $1.2{\mu}S$ for the SB-SET and SB-SHT, respectively. In the SB-SET and SB-SHT, a high transconductance can be easily achieved as the silicided electrode eliminates a parasitic resistance. Moreover, the SB-SET and SB-SHT can be operated as a conventional field-effect transistor (FET) and SET/SHT depending on the bias conditions, which is very promising for SET/FET hybrid applications. This work is the first report on the successful operations of SET/SHT in Schottky barrier devices.

Nanowire Patterning for Biomedical Applications

  • Yun, Young-Sik;Lee, Jun-Young;Yeo, Jong-Souk
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.382-382
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    • 2012
  • Nanostructures have a larger surface/volume ratio as well as unique mechanical, physical, chemical properties compared to existing bulk materials. Materials for biomedical implants require a good biocompatibility to provide a rapid recovery following surgical procedure and a stabilization of the region where the implants have been inserted. The biocompatibility is evaluated by the degree of the interaction between the implant materials and the cells around the implants. Recent researches on this topic focus on utilizing the characteristics of the nanostructures to improve the biocompatibility. Several studies suggest that the degree of the interaction is varied by the relative size of the nanostructures and cells, and the morphology of the surface of the implant [1, 2]. In this paper, we fabricate the nanowires on the Ti substrate for better biocompatible implants and other biomedical applications such as artificial internal organ, tissue engineered biomaterials, or implantable nano-medical devices. Nanowires are fabricated with two methods: first, nanowire arrays are patterned on the surface using e-beam lithography. Then, the nanowires are further defined with deep reactive ion etching (RIE). The other method is self-assembly based on vapor-liquid-solid (VLS) mechanism using Sn as metal-catalyst. Sn nanoparticle solutions are used in various concentrations to fabricate the nanowires with different pitches. Fabricated nanowries are characterized using scanning electron microscopy (SEM), x-ray diffraction (XRD), and high resolution transmission electron microscopy (TEM). Tthe biocompatibility of the nanowires will further be investigated.

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70 nm T-게이트를 갖는 InGaAs/InAlAs/GaAs metamorphic HEMT 소자의 제작 및 특성 (Fabrication and Characterization of 70 nm T-gate AlGaAs/InGaAs/GaAs metamorphic HEMT Device)

  • 김성찬;임병옥;백태종;고백석;신동훈;이진구
    • 대한전자공학회논문지SD
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    • 제41권9호
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    • pp.19-24
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    • 2004
  • 우리는 3층 구조의 레지스터와 이중 노광 방법을 이용하여 유전체 지지대를 사용하지 않은 새로운 방법으로 게이트 길이가 70 nm인 T-게이트를 갖는 InGaAs/InAlAs/GaAs metamorphic HEMT 제작 하였다. 게이트 길이가 70 nm이고 게이트 단위폭이 70 ㎛인 2개의 게이트를 가지고 있는 MHEMT는 최대 포화 전류밀도가 최대 포화 전류밀도가 228.6 mA/mm, 상호전달 컨덕턴스는 645 mS/mm, 전류이득차단주파수가 255 GHz인 특성을 보였다.