• Korean Journal of Optics and Photonics
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• v.18 no.1
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• pp.74-78
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• 2007

We report theoretical and experimental results for application of transmittance-controlled photomask technology to ArF lithography. The transmittance-controlled photomask technology is thought to be a promising technique fo critical dimension (CD) uniformity correction on a wafer by use of phase patterns on the backside of a photomask. We could theoretically reproduce experimental results for illumination intensity drop with respect to the variation of backside phase patterns by considering light propagation from the backside to the front side of a photomask at the ArF lithography wavelength. We applied the transmittance-controlled photomask technology to ArF lithography for a critical layer of DRAM (Dynamic Random Access Memory) having a 110-nm design rule and found that the in-field CD uniformity value was improved from 13.8 nm to 9.7 nm in $3{\sigma}$.

• Journal of the Korea Society of Computer and Information
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• v.18 no.2
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• pp.1-8
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• 2013

TIn this paper, we propose a high performance L1 cache structure on the high clock CPU of 4GHz. The proposed cache memory consists of three parts, i.e., a direct-mapped cache to support fast access time, a two-way set associative buffer to exploit temporal locality, and a buffer-select table. The most recently accessed data is stored in the direct-mapped cache. If a data has a high probability of a repeated reference, when the data is replaced from the direct-mapped cache, the data is selectively stored into the two-way set associative buffer. For the high performance and low power consumption, we propose an one way among two ways set associative buffer is selectively accessed based on the buffer-select table(BST). According to simulation results, Energy $^*$ Delay product can improve about 45%, 70% and 75% compared with a direct mapped cache, a four-way set associative cache, and a victim cache with two times more space respectively.

• The KIPS Transactions:PartC
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• v.18C no.3
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• pp.157-166
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• 2011

The virtualization layer is executed in higher authority layer than kernel layer and suitable for monitoring operating systems. However, existing virtualization monitoring systems provide simple information about the usage rate of CPU or memory. In this paper, the monitoring system using full virtualization technique is proposed, which can monitor virtual machine's dynamic kernel object as memory, register, GDT, IDT and system call table. To verify the monitoring system, the proposed system was implemented based on KVM(Kernel-based Virtual Machine) with full virtualization that is directly applied to linux kernel without any modification. The proposed system consists of KvmAccess module to access KVM's internal object and API to provide other external modules with monitoring result. In experiments, the CPU utilization for monitoring operations in the proposed monitering system is 0.35% when the system is monitored with 1-second period. The proposed monitoring system has a little performance degradation.

• Journal of KIISE:Computer Systems and Theory
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• v.32 no.7
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• pp.349-358
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• 2005

False sharing is a result of co-location of unrelated data in the same unit of memory coherency, and is one source of unnecessary overhead being of no help to keep the memory coherency in multiprocessor systems. Moreover. the damage caused by false sharing becomes large in proportion to the granularity of memory coherency. To reduce false sharing in a page-based DSM system, it is necessary to allocate unrelated data objects that have different access patterns into the separate shared pages. In this paper we propose call-site tracing-based shared memory allocator. shortly CSTallocator. CSTallocator expects that the data objects requested from the different call-sites may have different access patterns in the future. So CSTailocator places each data object requested from the different call-sites into the separate shared pages, and consequently data objects that have the same call-site are likely to get together into the same shared pages. We use execution-driven simulation of real parallel applications to evaluate the effectiveness of our CSTallocator. Our observations show that by using CSTallocator a considerable amount of false sharing misses can be additionally reduced in comparison with the existing techniques.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.261-261
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• 2016

플래시 메모리 (flash memory)는 DRAM(dynamic racdom access memory)이나 SRAM(static random access memory)에 비해 소자의 구조가 매우 단순하기 때문에 집적도가 높아서 기기의 소형화가 가능하다는 점과 제조비용이 낮다는 장점을 가지고 있다. 또한, 전원을 차단하면 정보가 사라지는 DRAM이나 SRAM과 달리 전원이 꺼지더라도 저장된 정보가 지워지지 않는다는 특징을 가지고 있어서 ROM(read only memory)과 정보의 입출력이 자유로운 RAM의 장점을 동시에 가지기 때문에 활용도가 크다. 또한, 속도가 빠르고 소비전력이 작아서 USB 드라이브, 디지털 TV, 디지털 캠코더, 디지털 카메라, 휴대전화, 개인용 휴대단말기, 게임기 및 MP3 플레이어 등에 널리 사용되고 있다. 특히, 낸드(NAND)형의 플래시 메모리는 고집적이 가능하며 하드디스크를 대체할 수 있어 고집적 음성이나 화상 등의 저장용으로 많이 쓰이며 일정량의 정보를 저장해두고 작업해야 하는 휴대형 기기에도 적합하며 가격도 노어(NOR)형에 비해 저렴하다는 장점을 가진다. 최근에는 smart watch, wearable device 등과 같은 차세대 디스플레이 소자에 대한 관심이 증가함에 따라 투명하고 유연한 메모리 소자에 대한 연구가 다양하게 진행되고 있으며 유리나 플라스틱과 같은 기판 위에서 투명한 플래시 메모리를 형성하는 기술에 대한 관심이 높아지고 있다. 전하트랩형 (charge trap type) 플래시 메모리는 플로팅 게이트형 플래시 메모리와는 다르게 정보를 절연막 층에 저장하므로 인접 셀간의 간섭이나 소자의 크기를 줄일 수 있기 때문에 투명하고 유연한 메모리 소자에 적용이 가능한 차세대 플래시 메모리로 기대되고 있다. 전하트랩형 플래시메모리는 정보를 저장하기 위하여 tunneling layer, trap layer, blocking layer의 3층으로 이루어진 게이트 절연막을 가진다. 전하트랩 플래시 메모리는 게이트 전압에 따라서 채널의 전자가 tunnel layer를 통해 trap layer에 주입되어 정보를 기억하게 되는데, trap layer에 주입된 전자가 다시 채널로 빠져나가는 charge loss 현상이 큰 문제점으로 지적된다. 따라서 tunnel layer의 막질향상을 위한 다양한 열처리 방법들이 제시되고 있으며, 기존의 CTA (conventional thermal annealing) 방식은 상대적으로 높은 온도와 긴 열처리 시간을 가지고, RTA (rapid thermal annealing) 방식은 매우 높은 열처리 온도를 필요로 하기 때문에 플라스틱, 유리와 같은 다양한 기판에 적용이 어렵다. 따라서 본 연구에서는 기존의 열처리 방식보다 에너지 전달 효율이 높고, 저온공정 및 열처리 시간을 단축시킬 수 있는 마이크로웨이브 열처리(microwave irradiation, MWI)를 도입하였다. Tunneling layer, trap layer, blocking layer를 가지는 MOS capacitor 구조의 전하트랩형 플래시 메모리를 제작하여 CTA, RTA, MWI 처리를 실시한 다음, 전기적 특성을 평가하였다. 그 결과, 마이크로웨이브 열처리를 실시한 메모리 소자는 CTA 처리한 소자와 거의 동등한 정도의 우수한 전기적인 특성을 나타내는 것을 확인하였다. 따라서, MWI를 이용하면 tunnel layer의 막질을 향상시킬 뿐만 아니라, thermal budget을 크게 줄일 수 있어 차세대 투명하고 유연한 메모리 소자 제작에 큰 기여를 할 것으로 예상한다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.11
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• pp.115-120
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• 2005

This paper describes the design and implementation of engineering model(EM) of Mass Memory Unit(MMU) for Science and Technology Satellite 2(STSAT-2) and the results of integration test. The use of Field-Programmable Gate Array(FPGA) instead of using private electric parts makes a miniaturization and lightweight of MMU possible. 2Gbits Synchronous Dynamic Random Access Memory(SDRAM) module for mass memory is used to store payload and satellite status data. Moreover, file system is applied to manage them easily in the ground station. RS(207,187) code improves the tolerance with respect to Single Event Upset(SEU) induced in SDRAM. The simulator is manufactured to verify receiving performance of payload data.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.6
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• pp.1046-1055
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• 1994

In this paper, to design high speed 1 line VRAM(Video RAM) suitable for image signal processing with ASIC(Application Specific IC) method, the VRAM memory core has been designed using 3-TR dual-port dynamic cell which has excellent access time and integration characteristics. High speed pipeline operation was attained by separating the first row from the subarray 1 memory core and the simultaneous I/Q operation for a selected single address was made possible by adopting data-latch scheme. Peripheral circuits were designed implementing address selector and 1/2V voltage generator. Integrated ASIC has been optimized using 1.5[ m] CMOS design rule.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.446-446
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• 2012

최근 반도체 칩의 트랜지스터 집적화 기술이 발달됨에 따라 dynamic random access memory(DRAM)의 memory cell 영역을 작게 만들어야 하는 문제가 제기되고 있다. 이러한 문제점을 해결하기 위해서 대체 기술이 끊임없이 연구되고 있는 가운데 하나의 트랜지스터와 하나의 캐패시터로 구성된 기존의 DRAM에서 캐패시터가 없이 하나의 트랜지스터만으로 이루어진 1T-DRAM 소자의 연구가 활발히 진행되고 있다. 이는 기존 DRAM의 구조에 비해 캐패시터가 필요하지 않아 복잡한 공정이 줄어들어 소자 제작이 용이하며, 더 높은 집적도를 구현할 수 있는 장점이 있다. 일반적인 planar 타입의 1T-DRAM의 경우 소스 및 드레인과 기판과의 접합면에서 누설 전류가 큰 특징을 가지며 소자의 집적화에 따른 단 채널 효과가 발생하게 되는데, 본 연구에서는 이러한 문제점을 해결하기 위해서 유효 채널 길이를 늘려 단 채널 효과에 의한 영향을 감소시키고, 소스 및 드레인과 기판과의 접합면을 줄여 누설 전류를 줄일 수 있는 recessed 채널 타입의 1T-DRAM을 제작하였다. 1T-DRAM의 메모리 구동방법에는 여러 가지가 있는데 본 연구에서는 impact ionization (II)을 이용한 방법과 gate induced drain leakage (GIDL)을 이용한 방법을 사용하여 1T-DRAM의 채널구조에 따라 어떠한 구동방법이 더 적합한지 평가하였고, 그 결과 recessed 채널 1T-DRAM의 동작은 II 에 의한 측정 방법이 더 적합한 것으로 보여졌다.

• Journal of KIISE:Computing Practices and Letters
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• v.12 no.4
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• pp.264-274
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• 2006

Recently, a variety of organizations including enterprises tend to try to use reporting tools as a data analysis tool for decision making support because reporting tools are capable of formatting data flexibly. Traditional reporting tools have thin-client structure in which all of dynamic documents are generated in the server side. This structure enables reporting tools to avoid repetitive process to generate dynamic documents, when many clients intend to access the same dynamic document. However, generating dynamic documents for data analysis doesn't consider a number of potential readers and increases requests to the server by making clients input various parameters at short intervals. In the structure of the traditional reporting tools, the increase of these requests leads to the increase of processing load in the server side. Thus, we present the reporting tool that can generate dynamic documents at the client side. This reporting tool has a processing mechanism to deal with a number of data despite the limited memory capacity of the client side.