• 농약과학회지
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• 제16권4호
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• pp.328-335
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• 2012

경채류로 분류될 수 있는 쪽파에 대한 살균제 dimethomorph와 pyraclostrobin의 잔류특성을 조사하였다. 수확일을 기준으로 각각 1주일 간격으로 2회 살포한 후 수확당일, 수확 3일전, 수확 7일전, 수확 10일전 및 수확 14일전에 시료를 수거하여 잔류량을 조사하였다. Dimethomorph의 경우 수확당일에는 26.31 mg/kg에서 39.08 mg/kg의 잔류수준을 나타내었으나 시간이 경과함에 따라 그 잔류량은 감소하여 수확 14일전 살포구에서의 잔류량은 6.86 mg/kg에서 9.34 mg/kg으로 나타났으며, pyraclostrobin의 경우도, 수확 당일 살포구에서의 농약 잔류량은 13.46 mg/kg에서 39.08 mg/kg으로 나타났으나 수확 14일전 살포구에서는 3.57 mg/kg에서 5.21 mg/kg으로 나타났다. 수확당일의 잔류량을 기초하여 작물 중 농약살포액의 부착량을 환산한 결과 dimethomorph의 경우 274.34~345.84 mL/kg, 그리고 pyraclostrobin의 경우는 213.65~343.33 mL/kg 나타내었다. Dimethomorph와 pyraclostrobin의 생육기간 중 농약의 분해소실 정도를 조사한 결과 dimethomorph의 경우 분해반감기가 6.95~7.45일, pyraclostrobin은 7.15~7.45일로 두 농약의 쪽파에서의 분해반감기는 비슷하였다.

• 농약과학회지
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• 제16권2호
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• pp.98-108
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• 2012

일시에 수확하는 엽채류 중 시금치, 얼갈이배추, 비타민채 및 청경채에 대한 살균제 boscalid와 fludioxonil의 잔류 특성을 조사하였다. 수확일을 기준으로 각각 1주일 간격으로 2회 살포한 후 수확당일, 수확 2일전, 수확 5일전 및 수확 7일전에 시료를 수거하여 잔류량을 조사하였다. 수확당일의 잔류량을 기초하여 작물 중 농약살포액의 부착량을 환산한 결과 boscalid의 경우 시금치에서 253.9 mL/kg, 그리고 얼갈이배추, 비타민채 및 청경채에서는 각각 83.0, 97.8 및 88.3 mL/kg으로 조사되어 시금치에서 가장 많이 살포액이 부착되는 것으로 나타났다. Fludioxonil의 경우도 시금치 157.6 mL/kg, 얼갈이배추 67.6, 비타민채 64.8 그리고 청경채에서 66.6 mL/kg의 부착량을 나타내어 시금치에서 가장 높은 살포액 부착량을 나타내었다. 각 작물에서 boscalid와 fludioxonil의 생육기간 중 농약의 분해소실 정도를 조사한 결과 boscalid의 경우 시금치에서 분해반감기가 5.9일, 얼갈이배추 7.4일, 비타민채 4.6일, 청경채 4.3일로서 얼갈이배추에서 분해 반감기가 가장 길었으며, fludioxonil의 경우에서도 시금치 3.0일, 얼갈이배추 4.0일, 비타민채 3.2일, 청경채 3.5일로 얼갈이배추에서 분해반감기가 가장 길었다. 두 농약의 잔류특성이 비교되었을 때 농약살포 후 살포액의 부착량과 작물생육기간 중 농약의 분해반감기는 fludioxonil 보다 boscalid이 더 많거나 긴 것으로 나타났다.

• 한국정보통신학회논문지
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• 제7권1호
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• pp.106-113
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• 2003

본 논문에서는 CMOS 기술을 이용하여 2.4GHz ISM 주파수 대역의 LNA를 설계하였다. 캐스코드 증폭기를 이용하여 잡음을 억제하고 이득을 향상시켰으며 캐스캐이드의 공통 소스 증폭기의 출력을 캐스코드와 병렬로 연결되는 MOS의 입력으로 연결하여 IM3를 감소시키고자 하였다. 제안된 저잡음증폭기는 3.3V의 전원을 공급하는 Hynix 0.35$\mu\textrm{m}$ 2-poly 4-metal CMOS 공정을 이용하여 설계되었다. HSPICE Tool을 이용하여 시뮬레이션 하여 13dB의 이득과 1.7dB의 잡음지수, 약 8dBm의 IIP3, -3ldB와 -28dB의 입ㆍ출력 매칭특성을 확인하였다. 이 때 reverse isolation은 -25dB, 전력사용은 4.7mW이었다. Mentor를 이용한 Layout은 2${\times}$2$\mu\textrm{m}$ 이하의 크기를 갖는다.

• Earthquakes and Structures
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• 제5권4호
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• pp.461-475
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• 2013

A new experimental system of base-isolated structures is proposed. There are two kinds of dampers usually used in the base-isolated buildings, one is a viscous-type damper and the other is an elastic-plastic hysteretic-type damper. The base-isolated structure with a viscous damper and that with an elastic-plastic hysteretic damper are compared in this paper. The viscous damper is modeled by a mini piston and the elastic-plastic hysteretic damper is modeled by a low yield-point steel. The capacity of both dampers is determined so that the dissipated energies are equivalent at a specified deformation. When the capacity of both dampers is determined according to this criterion, it is shown that the response of the base-isolated structure with the elastic-plastic hysteretic damper is larger than that with the viscous damper. This characteristic is demonstrated through the comparison of the bound of the aspect ratio. It is shown that the bound of aspect ratio for the base-isolated structure with the elastic-plastic hysteretic damper is generally smaller than that with the viscous damper. When the base-isolated structure is subjected to long-duration input, the mechanical property of the elastic-plastic hysteretic damper deteriorates and the response of the base-isolated structure including that damper becomes larger than that with the viscous damper. The effect of this change of material properties on the response of the base-isolated structure is also investigated.

• Computers and Concrete
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• 제16권6호
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• pp.933-961
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• 2015

Damage by high-speed impact fracture is a dominant mode of failure in several applications of concrete structures. Numerical modelling can play a crucial role in understanding and predicting complex fracture processes. The commonly used mesh-based Finite Element Method has difficulties in accurately modelling the high deformation and disintegration associated with fracture, as this often distorts the mesh. Even with careful re-meshing FEM often fails to handle extreme deformations and results in poor accuracy. Moreover, simulating the mechanism of fragmentation requires detachment of elements along their boundaries, and this needs a fine mesh to allow the natural propagation of damage/cracks. Smoothed Particle Hydrodynamics (SPH) is an alternative particle based (mesh-less) Lagrangian method that is particularly suitable for analysing fracture because of its capability to model large deformation and to track free surfaces generated due to fracturing. Here we demonstrate the capabilities of SPH for predicting brittle fracture by studying a slender concrete structure (column) under the impact of a high-speed projectile. To explore the effect of the projectile material behaviour on the fracture process, the projectile is assumed to be either perfectly-elastic or elastoplastic in two separate cases. The transient stress field and the resulting evolution of damage under impact are investigated. The nature of the collision and the constitutive behaviour are found to considerably affect the fracture process for the structure including the crack propagation rates, and the size and motion of the fragments. The progress of fracture is tracked by measuring the average damage level of the structure and the extent of energy dissipation, which depend strongly on the type of collision. The effect of fracture property (failure strain) of the concrete due to its various compositions is found to have a profound effect on the damage and fragmentation pattern of the structure.

• 한국재료학회지
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• 제4권4호
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• pp.453-458
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• 1994

256Mb DRAM에서 박막 커패시터로의 적용을 위해서$(Ba_{0.5}Sr_{0.5)/TiO_3$(BST)박막이 RF Magnetron Sprttering방법에 의해 제조되었다. BST박막의 결정화도는 기판온도가 높아짐에 따라 증가하였고 증착된 박막의 조성은 $(Ba_{0.48}Sr_{0.48)/TiO_{2.93}$이었다. 이때 Pt/Ti장벽층은 Si의 BST계면으로의 확산을 억제하였다. 100kHz에서의 유전상수 및 유전손실은 각각 320 및 0.022이었다. 인가전계도 (Charge Storage Density)는 40fC/$\mu \textrm{m}^{2}$, 누설전류밀도(Leakage Current Density)는 0.8$\mu A/\textrm{cm}^2$ 로서 RF Matnetron sputtering방법에 의해 제조된 BST 박막이 256Mb DRAM 적용 가능함을 보였다.

• 한국기계가공학회지
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• 제12권4호
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• 한국분말재료학회지
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• 제27권1호
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• pp.25-30
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• 2020

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m^-1K^-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10^-6 to 3.06 × 10^-6K^-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 한국강구조학회 논문집
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• 제21권4호
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• pp.375-384
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• 2009

효과적인 횡력저항 시스템중에 하나인 다이아그리드 구조 시스템의 사용이 늘어나고 있다. 하지만 다이아그리드 노드의 바람 및 지진에 대한 구조성능을 해석적으로 평가하는 것은 한계가 있다. 특히 용접특성의 반영이 어려운데, 이 연구에서는 횡하중을 받는 다이아그리드 노드의 구조적 거동을 알아보기 위해 실제부재의 5분의 1로 축소한 모형을 이용해 실험을 수행했다. 주요 부위의 용접방법, 설계상세등 5가지 변수에 대하여 총 네 개의 실험체를 제작했다. 한쪽 가새부재에는 압축력을, 다른 쪽 가새부재에는 인장력을 가하는 반복가력 실험을 수행했다. 실험 결과 주요 파괴 원인은 인장력과 부가모멘트에 의한 파괴와 인장력만에 의한 용접부의 파단으로 나뉜다. 용접방법과 설계상세에 따른 초기강성, 항복강도의 차이는 없었다. 용접방법에 따른 파괴 형상의 차이가 있었으며 설계상세는 에너지 흡수능력에 영향을 미쳤다.