• Korean Journal of Materials Research
• /
• v.26 no.4
• /
• pp.167-172
• /
• 2016

The high temperature deformation behavior of $Ni_3Al$ and $Ni_3(Al,Mo)$ single crystals that were oriented near <112> was investigated at low strain rates in the temperature range above the flow stress peak temperature. Three types of behavior were found under the present experimental conditions. In the relatively high strain rate region, the strain rate dependence of the flow stress is small, and the deformation may be controlled by the dislocation glide mainly on the {001} slip plane in both crystals. At low strain rates, the octahedral glide is still active in $Ni_3Al$ above the peak temperature, but the active slip system in $Ni_3(Al,Mo)$ changes from octahedral glide to cube glide at the peak temperature. These results suggest that the deformation rate controlling mechanism of $Ni_3Al$ is viscous glide of dislocations by the <110>{111} slip, whereas that of $Ni_3(Al,Mo)$ is a recovery process of dislocation climb in the substructures formed by the <110>{001} slip. The results of TEM observation show that the characteristics of dislocation structures are uniform distribution in $Ni_3Al$ and subboundary formation in $Ni_3(Al,Mo)$. Activation energies for deformation in $Ni_3Al$ and $Ni_3(Al,Mo)$ were obtained in the low strain rate region. The values of the activation energy are 360 kJ/mol for $Ni_3Al$ and 300 kJ/mol for $Ni_3(Al,Mo)$.

• Journal of Mechanical Science and Technology
• /
• v.20 no.8
• /
• pp.1209-1216
• /
• 2006

An AZ31 magnesium alloy was tested at constant temperatures ranging from 423 to 473 K (0.46 to 0.51 Tm) under constant stresses. All of the creep curves exhibited two types depending on stress levels. At low stress (${\sigma}/ G < 4 {\times}10^{-3}$), the creep curve was typical of class A (Alloy type) behavior. However, at high stresses (${\sigma}/ G > 4 {\times}10^{-3}$), the creep curve was typical of class M (Metal type) behavior. At low stress level, the stress exponent for the steady-state creep rate was of 3.5 and the true activation energy for creep was 101 kJ/mole which is close to that for solute diffusion. It indicates that the dominant deformation mechanism was glide-controlled dislocation creep. At low stress level where n=3.5, the present results are in good agreement with the prediction of Fridel model.

• Transactions of Materials Processing
• /
• v.11 no.6
• /
• pp.529-537
• /
• 2002

A series of load-relaxation tests and tensile tests were conducted to study the high temperature deformation mechanism of fine duplex gamma TiAl alloy at temperatures ranging from 800 to 105$0^{\circ}C$. Results of load relaxation test showed that deformation behavior at a small imposed strain ($\varepsilon$≒0.05) was dominated by dislocation glide and dislocation climb. To investigate the deformation behavior at a large amount of strain, the processing map was constructed using a dynamic materials model. Two domains were characterized in the processing map obtained at a strain level of 0.6. One domain was found at the region of 98$0^{\circ}C$ and $10^{-3}/sec$ with a peak efficiency of 48%, which was identified as a domain of dynamic recrystallization from the microstructural observation. The order was observed at the region of 125$0^{\circ}C$ and $10^{-4}/sec$ with a peak efficiency of 64%. The strain rate sensitivity measured indicates that the material was deformed by the superplasticity in the region.

• Transactions of Materials Processing
• /
• v.14 no.1 s.73
• /
• pp.65-70
• /
• 2005

A phase mixture model was employed to simulate the deformation behaviour of metallic materials covering a wide grain size range from micrometer to nanometer scale. In this model a polycrystalline material is treated as a mixture of two phases: grain interior phase whose plastic deformation is governed by dislocation and diffusion mechanisms and grain boundary 'phase' whose plastic flow is controlled by a boundary diffusion mechanism. The main target of this study was the effect of grain size on stress and its strain rate sensitivity as well as on the strain hardening. Conventional Hall-Petch behaviour in coarse grained materials at high strain rates governed by the dislocation glide mechanism was shown to be replaced with inverse Hall-Petch behaviour in ultrafine grained materials at low strain rates, when both phases deform predominantly by diffusion controlled mechanisms. The model predictions are illustrated by examples from literature.

• Journal of the Korean Society of Safety
• /
• v.24 no.6
• /
• pp.20-26
• /
• 2009

The creep deformation behavior of AZ31 magnesium alloy was examined in the temperature range from 573 to 673K (0.62 to 0.73 Tm) under various constant stresses covering low strain rate range from $4{\times}10^{-9}\;s^{-1}$ to $2{\times}10^{-2}\;s^{-1}$. At low stress level, the stress exponent for the steady-state creep rate was ~3 and the present results were in good agreement with the prediction of Takeuchi and Argon model. At high stress level, the stress exponent was ~5 and the present results were in good agreement with the prediction of Weertman model. The transition of deformation mechanism from solute drag creep to dislocation climb creep could be explained in terms of solute-atmospherebreakaway concept.

• Transactions of Materials Processing
• /
• v.25 no.6
• /
• pp.359-365
• /
• 2016

The rate-controlling mechanisms for time-dependent plastic deformation of eutectoid and hyper-eutectoid pearlitic steels at low $T/T_m$ temperatures were explored. The strain rate - stress data obtained from a series of constant load tensile tests at $0.25{\sim}0.30T/T_m$ were applied to the power law, the lattice friction controlled plasticity, and the obstacle controlled plasticity. Of these models, the obstacle controlled plasticity was found to best-describe the rate-controlling mechanism for time-dependent plastic deformation of two steels at low $T/T_m$ temperatures in terms of the activation energy for overcoming the obstacles against dislocation glide in ferrite. The deformed microstructures revealed the dislocation forests of a high density as the main obstacles. In addition, the obstacle controlled plasticity well-explained the effects of cementite on the $0^{\circ}K$ flow stress of two steels.

• Transactions of Materials Processing
• /
• v.16 no.6
• /
• pp.473-478
• /
• 2007

In this study, a deformation mechanism map of metallic nanocrystalline materials(NCMs) using the phase mixture model is proposed. It is based on recent modeling that appears to provide a conclusive description of the phenomenology and the mechanisms underlying the mechanical properties of NCMs. The proposed models adopted the concept of a 'phase mixture' in which the grain interior and the grain boundaries are treated as separate phases. The volume fraction of this grain boundary 'phase' may be quite appreciable in a NCM. Based on the theoretical model that provides an adequate description of the grain size dependence of plasticity covering all grain size range from coarse down to the nanoscale, the tensile deformation response of NCMs, especially focusing on the deformation mechanisms was investigated. The deformation mechanism map is newly proposed with axes of strain rate, grain size and temperature.

• Journal of the Korean Society for Precision Engineering
• /
• v.2 no.1
• /
• pp.53-61
• /
• 1985

This study is concerned with creep mechanism of SUS 316 under high stresses. Creep tests were conducted at temperatures between $480^{\circ} and $820^{\circ}C and stresses between 7.6 and 24.6$kg/mm^2$. To investigate the mechanism of the steady-state creep under high stresses, work hardening coefficient and activation energy are obtained. The activation energy was calculated by means of the temperature differential test together with the method of correlating the creep rates against the inverse of the absolute temperature for different stresses and strains. From the experimental results and their analyzed facts, it is concluded that the steady-state creep behavior of SUS 316 under high stresses is controlled by dislocation glide mechanism.

• Korean Journal of Materials Research
• /
• v.19 no.12
• /
• pp.699-702
• /
• 2009

Due to the importance of the SiGe/Si heterostructure in the fields of thermoelectric and electronic applications, SiGe/Si heterostructures have been extensively investigated. For practical applications, thermal stability of the heterostructure during the thermoelectric power generation or fabrication process of electronic devices is of great concern. In this work, we focused on the effect of thermal annealing on the defect configuration in the SiGe/Si heterostructure. The formation mechanism of planar defects in an annealed SiGe/Si heterostructure was investigated by transmission electron microscopy. Due to the interdiffusion of Si and Ge, interface migration phenomena were observed in annealed heterostructures. Because of the strain gradient in the migrated region between the original interface and the migrated interface, the glide of misfit dislocation was observed in the region and planar defects were produced by the interaction of the gliding misfit dislocations. The planar defects were confined to the migrated region, and dislocation pileup by strain gradient was the origin of the confinement of the planar defect.

• Journal of Powder Materials
• /
• v.8 no.3
• /
• pp.168-173
• /
• 2001

The effect of grain refinement of the strength and ductility of metallic materials is investigated. A model in which a single phase material is considered as an effectively two-phase one is discussed. A distinctive feature of the model is that grain boundaries are treated as a separate phase deforming by a diffusion mechanism. Deformation of the grain interior phase is assumed to be carried by two concurrent mechanism. Deformation of the grain interior phase is assumed to be carried by two concurrent mechanisms: dislocation glide and mass transfer by diffusion. The model was exemplified by simulating uniaxial tensile deformation of Cu down to the nanometer grain size. The results confirm the observed strain hardening behaviour and a trend for reduction of ductility with decreasing grain size at room temperature.