• Title/Summary/Keyword: dielectric materials(low-k)

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A Study on the Low-Firing Dielectric Material (저온 소결 유전체에 관한 연구)

  • Lee, Jong-Kyu;Kim, Wang-Sup;Kim, Kyeong-Yong
    • Korean Journal of Materials Research
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    • v.2 no.4
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    • pp.263-269
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    • 1992
  • Low-firing dielectric materials with negative small temperature coefficients were investigated. The newly developed materials are based on Ti$O_2$(100-x)/ CuOx(X=1~5wt%) with small amount of Mn$O_2$ additive. The sample without CuO was not sintered at 90$0^{\circ}C$. As CuO content was increased the sample could be sintered at low temperature. However, the dielectric constant was decreased and the dielectric loss was increased. In the case of adding 3wt% CuO and 0.6wt% Mn$O_2$, the dielectric constant and the Q values appeared very high.

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Thin Films Deposition Study Using Plasma Enhanced CVD with Low Dielectric Materials DEMS(diethoxymethlysiliane) below 45nm (PE-CVD를 이용한 45nm이하급 저유전물질 DEMS(Diethoxymethylsiliane) 박막증착연구)

  • Kang, Min-Goo;Kim, Dae-Hee;Kim, Yeong-Cheol;Seo, Hwa-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.148-148
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    • 2008
  • Low-k dielectric materials are an alternative plan to improve the signal propagation delay, crosstalk, dynamic power consumption due to resistance and parasitic capacitance generated the decrease of device size. Now, various materials is studied for the next generation. Diethoxymethlysiliane (DEMS) precursor using this study has two ethoxy groups along with one methyl group attached to the silicon atoms. SiCOH thin films were deposited on p-type Si(100) substrate by Plasma Enhanced Chemical Vapor Deposition (PECVD) using DEMS. In this study, we studied the effect of oxygen($O_2$) flow rate for DEMS to characteristics of thin films. The characteristics of thin films deposited using DEMS and $O_2$ evaluated through refractive index, dielectric constant(k), surface roughness, I-V(MIM:Al / SiCOH / Ag), C-V(MIM), deposition rate.

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Dielectric Properties of Orthorhombic Dysprosium Manganites

  • Wang, Wei Tian
    • Korean Journal of Materials Research
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    • v.29 no.12
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    • pp.753-756
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    • 2019
  • Orthorhombic dysprosium manganite DyMnO3 with single phase is synthesized using solid-state reaction technique and the crystal structure and dielectric properties as functions of temperature and frequency are investigated. Thermally activated dielectric relaxations are shown in the temperature dependence of the complex permittivity, and the respective peaks are found to be shifted to higher temperatures as the measuring frequency increases. In Arrhenius plots, activation energies of 0.32 and 0.24 eV for the high- and low-temperature relaxations are observed, respectively. Analysis of the relationship between the real and imaginary parts of the permittivity and the frequencies allows us to explain the dielectric behavior of DyMnO3 ceramics by the universal dielectric response model. A separation of the intrinsic grain and grain boundary properties is achieved using an equivalent circuit model. The dielectric responses of this circuit are discerned by impedance spectroscopy study. The determined grain and grain boundary effects in the orthorhombic DyMnO3 ceramics are responsible for the observed high- and low-temperature relaxations in the dielectric properties.

Characterization of Thin Film Transistor using $Ta_2O_5$ Gate Dielectric

  • Um, Myung-Yoon;Lee, Seok-Kiu;Kim, Hyeong-Joon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.157-158
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    • 2000
  • In this study, to get the larger drain current of the device under the same operation condition as the conventional gate dielectric SiNx thin film transistor devices, we introduced new gate dielectric $Ta_2O_5$ thin film which has high dielectric constant $({\sim}25)$ and good electrical reliabilities. For the application for the TFT device, we fabricated the $Ta_2O_5$ gate dielectric TFT on the low-temperature-transformed polycrystalline silicon thin film using the self-aligned implantation processing technology for source/drain and gate doping. The $Ta_2O_5$ gate dielectric TFT showed better electrical performance than SiNx gate dielectric TFT because of the higher dielectric constant.

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Calculation of Field Enhancement Factor in CNT-Cathodes Dependence on Dielectric Constant of Bonding Materials

  • Kim, Tae-Sik;Shin, Heo-Young;Cho, Young-Rae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1092-1095
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    • 2005
  • The effect of the dielectric constant (${\varepsilon}$) of bonding materials in screen-printed carbon nanotube cathode on field enhancement factor was investigated using the ANSYS software for high-efficient CNT-cathodes. The field enhancement factor increased with decreasing the dielectric constant and reaching a maximum value when the dielectric constant is 1, the value for a vacuum. This indicates that the best bonding materials for screen-printing CNT cathodes should have a low dielectric constant and this can be used as criteria for selecting bonding materials for use in CNT pastes for high-efficient CNT-cathodes

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Electrical Properties of Organic Materials as Low Dielectric Constant Materials

  • Oh Teresa;Kim Hong Bae;Kwon Hak Yong;Son Jae Gu
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.05a
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    • pp.67-72
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    • 2005
  • The bonding structure of organic materials such as fluorinated amorphous carbon films was classified into two types due to the chemical shifts. The electrical properties of fluorinated amorphous carbon films also showed very different effect of two types notwithstanding a very little difference. Fluorinated amorphous carbon films with the cross-link breakage structure existed large leakage current resulting from effect of the electron tunneling. Increasing the cation due to the electron-deficient group increased the barrier height of the films with the cross-link amorphous structure, therefore the electric characteristic of the final materials with low dielectric constant was also improved. The lowest dielectric constant is 2.3 at the sample with the cross-link amorphous structure.

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The Microwave Measurement of the Dielectric Properties of Low-Loss Materials by the Dielectric Rod Resonator Method (고주파 대역에서 Dielectric Rod Resonator 방법에 의한 저유전 손실 물질의 유전 특성 측정)

  • Kim, Geun-Young;Shim, Hwa-Sup;An, Chul;Chang, Ik-Soo
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.10
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    • pp.10-15
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    • 1990
  • Theory and experimental results of measuring the microwave dielectric characteristics of low-loss materials by using dielectric rod resonator method are presented. The $TE_{011}$ mode resonance frequency was adapted to minimize the effect of the air gap between the rod and the conducting plates. The dielectric properties were computed from the resonance frequency, sample geometry and 3 dB bandwidth. The error of measurements was within ${\pm}3{\%}$ for dielectric constant and was within ${\pm}12{\%}$ for dielectric loss.

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Effects of Sputtering Pressure on the Properties of BaTiO3 Films for High Energy Density Capacitors

  • Park, Sangshik
    • Korean Journal of Materials Research
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    • v.24 no.4
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    • pp.207-213
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    • 2014
  • Flexible $BaTiO_3$ films as dielectric materials for high energy density capacitors were deposited on polyethylene terephthalate (PET) substrates by r.f. magnetron sputtering. The growth behavior, microstructure and electrical properties of the flexible $BaTiO_3$ films were dependent on the sputtering pressure during sputtering. The RMS roughness and crystallite size of the $BaTiO_3$ increased with increasing sputtering pressure. All $BaTiO_3$ films had an amorphous structure, regardless of the sputtering pressures, due to the low PET substrate temperature. The composition of films showed an atomic ratio (Ba:Ti:O) of 0.9:1.1:3. The electrical properties of the $BaTiO_3$ films were affected by the microstructure and roughness. The $BaTiO_3$ films prepared at 100 mTorr exhibited a dielectric constant of ~80 at 1 kHz and a leakage current of $10^{-8}A$ at 400 kV/cm. Also, films showed polarization of $8{\mu}C/cm^2$ at 100 kV/cm and remnant polarization ($P_r$) of $2{\mu}C/cm^2$. This suggests that sputter deposited flexible $BaTiO_3$ films are a promising dielectric that can be used in high energy density capacitors owing to their high dielectric constant, low leakage current and stable preparation by sputtering.

The Study on the Fabrication and Characterization of Dielectric Materials of Front and Back Panel for PDP(Plasma Display Panel)

  • Chang, Myeong-Soo;Lee, Yoon-Kwan;Ryu, Byung-Gil;Park, Myung-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.181-182
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    • 2000
  • The glass compositions of $PbO-SiO_2-B_2O_3$ system and $P_2O_5-PbO-ZnO$ system for the transparent dielectric materials for front panel and $P_2O_5-ZnO-BaO$ and $SiO_2-ZnO-B_2O_3$ for the reflective dielectric materials for back panel of PDP(Plasma Display Panel) were investigated. As a transparent dielectric materials for front panel, $PbO-SiO_2-B_2O_3$ glass showed good dielectric properties, high transparency and proper thermal expansion matching to soda-lime glass substrate. And the reflective dielectric materials for back panel were prepared from parent glass of $SiO_2-ZnO-B_2O_3$ system and oxide filler. It was found that these glass-ceramics are useful materials for reflective dielectric layers, as those have a similar thermal expansion to soda-lime glass plate, high reflectance, low sintering temperature.

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Millimeter-wave Dielectric Ceramics of Alumina and Forsterite with High Quality factor and Low Dielectric Constant

  • Ohasto, Hitoshi;Tsunooka, Tsutomu;Ando, Minato;Ohishi, Yoshihiro;Miyauchi, Yasuharu;Kakimoto, Ken ichi
    • Journal of the Korean Ceramic Society
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    • v.40 no.4
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    • pp.350-353
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    • 2003
  • Millimeter-wave dielectric ceramics have been used like applications for ultrahigh speed wireless LAN because it reduces the resources of electromagnetic wave, and Intelligent Transport System (ITS) because of straight propagation wave. For millimeterwave, the dielectric ceramics with high quality factor (Q$.$f), low dielectric constant($\varepsilon$), and nearly zero temperature coefficient of resonant frequency ($\tau$) are needed. No microwave dielectric ceramics with these three properties exist except Ba(Mg$\_$1/3/Ta/sub1/3/)O$_3$ (BMT), which has a little high s: In this paper, alumina (Al$_2$O$_3$) and fosterite (Mg$_2$SiO$_4$), candidates for millimeter-wave applications, were studied with an objective to get high q$.$f and nearly zero $\tau$$\_$f/ For alumina ceramics, q$.$f more than 680,000 GHz was obtained but it was difficult to obtain nearly zero Qf. On the other hand, for forsterite ceramics, q$.$f was achieved from 10,000 GHz of commercial for sterite to 240,000 GHz of highly purified MgO and SiO$_2$ raw materials, and $\tau$$\_$f/ was reduced a few by adding TiO$_2$ with high positive $\tau$$\_$f/.