• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.35-40
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• 1997

The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.

• 한국산학기술학회논문지
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• 제13권8호
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• pp.3301-3306
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• 2012

LED 칩 패키징에서 다이 본딩은 분할된 칩을 리드 프레임에 고정시켜 칩이 이후 공정을 견딜 수 있도록 충분한 강도를 제공하는 중요한 공정이다. 기존의 다이 본더의 픽업 장치는 단순히 콜렛의 하강 동작과 이젝터 핀의 상승 동작만으로 구동되어 픽업 장치와 다이가 접촉하는 순간 충격에 의한 다이의 손상과 위치 정렬 오차에 대한 문제점이 발생한다. 본 연구에서는 위치 정렬 에러 및 다이의 손상을 최소화시키기 위하여 고정밀, 고속 이송이 가능한 픽업 헤드를 사용한 다이 본더 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 다이 본더의 유한요소모델을 생성하였고 구조 해석을 수행하였다. 그다음, 다이 본더의 작동 주파수에 대해 픽업 헤드의 유한요소모델을 이용하여 진동해석을 수행하였다. 해석 결과, 다이 본더에 작용하는 응력 및 변위, 고유진동수에 대해 분석하였고 개발된 시스템의 구조적 안정성에 대해 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.284-287
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• 1987

In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• 한국산학기술학회논문지
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• 제14권6호
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• pp.2624-2630
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• 2013

LED 칩 패키징에서 다이 본딩은 분할된 칩을 리드 프레임에 고정시켜 칩이 이후 공정을 견딜 수 있도록 충분한 강도를 제공하는 중요한 공정이다. 다이본딩 공정 중에서, 측정 단계는 정확한 에폭시 토출 위치 지정과 충분한 강도를 가지고 접합할 수 있도록 다이가 정확한 위치에 놓여있는지 상태를 결정하는데 있어 매우 중요하다. 본 연구에서는 LED 다이 본딩을 위한 머신 비전 기반의 측정 시스템을 개발하였다. 제안된 시스템에서 에폭시 토출과 어태칭 상태 검출을 위해 각각 2개의 카메라를 사용하였다. 제안된 측정 시스템에 새로운 비전 알고리즘을 적용하였고, 실험을 통해 본 알고리즘의 효율을 검증하였다. 비전 알고리즘을 이용하여 측정된 위치 오차는 $X:-29{\mu}m$, $Y:-32{\mu}m$, 회전오차는 3도 이내 인 것을 확인할 수 있었다. 결론적으로 제안된 머신 비전 기반의 측정 시스템을 통해 개발된 다이 본딩 시스템의 향상된 성능을 확인하였다.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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• pp.261-264
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• 2001

반도체 생산현장에서의 생산성 향상과 집약적 기술의 보유는 장비 도입과 잉여 기술자 또는 숙련기술자를 교육하는 과정을 요구한다. 본 연구에서는 (주)옵토텍과 산학협동의 일환으로 장비의 교육과 관련하여 교육 소요시간을 줄이고, 주요 구동 Procedure를 매개로 하는 구동 인력의 기술력 향상과 구동 안전성을 도모하기 위하여 PCB Automatic Die Bonder(AD809-06, ASM)의 지능형 구동 학습전문화 시스템을 구축하려는 것이다.

• 한국산업융합학회 논문집
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• 제15권1호
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• Structural Engineering and Mechanics
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• 제37권5호
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• pp.475-487
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• 2011

In a flexible multi-body dynamic system the typical topological optimization method for structures cannot be directly applied, as the stiffness varies with position. In this paper, the topological optimization of the flexible multi-body dynamic system is converted into structural optimization using the equivalent static load method. First, the actual boundary conditions of the control system and the approximate stiffness curve of the mechanism are obtained from a flexible multi-body dynamical simulation. Second, the finite element models are built using the absolute nodal coordination for different positions according to the stiffness curve. For efficiency, the static reanalysis method is utilized to solve these finite element equilibrium equations. Specifically, the finite element equilibrium equations of key points in the stiffness curve are fully solved as the initial solution, and the following equilibrium equations are solved using a reanalysis method with an error controlled epsilon algorithm. In order to identify the efficiency of the elements, a non-dimensional measurement is introduced. Finally, an improved evolutional structural optimization (ESO) method is used to solve the optimization problem. The presented method is applied to the optimal design of a die bonder. The numerical results show that the presented method is practical and efficient when optimizing the design of the mechanism.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 한국생산제조학회지
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• 제23권4호
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.