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http://dx.doi.org/10.5762/KAIS.2012.13.8.3301

A Study on the Computational Design and Analysis of a Die Bonder for LED Chip Fabrication  

Cho, Yong-Kyu (Department of Mechanical Engineering, Inha University)
Lee, Jung-Won (Department of Mechanical Engineering, Inha University)
Ha, Seok-Jae (Department of Mechanical Engineering, Inha University)
Cho, Myeong-Woo (Division of Mechanical Engineering, Inha University)
Choi, Won-Ho (Wooree ATEC Co. LTD.)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.13, no.8, 2012 , pp. 3301-3306 More about this Journal
Abstract
In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.
Keywords
LED chip package; Die bonder; Pick-up head; Structural analysis; Vibration analysis;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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