A Study on the Computational Design and Analysis of a Die Bonder for LED Chip Fabrication |
Cho, Yong-Kyu
(Department of Mechanical Engineering, Inha University)
Lee, Jung-Won (Department of Mechanical Engineering, Inha University) Ha, Seok-Jae (Department of Mechanical Engineering, Inha University) Cho, Myeong-Woo (Division of Mechanical Engineering, Inha University) Choi, Won-Ho (Wooree ATEC Co. LTD.) |
1 | M. Fan, M. Liang, D. Guo, F. Yang, L. Wang, G. Wang and J. Li, "Color Filter-less Technology of LED Back Light for LCD-TV," Proc. SPIE, Vol. 6841, pp. 68410G1-68410G6, 2007. |
2 | J. R. Ryu, "The Improvement for Performance of White LED chip using Improved Fabrication Process", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 13, No. 1, pp. 329-332, 2012. DOI |
3 | B. C. Gather, A. Kohnen, A. Falcou, H. Becker and K. Meerholz, "Solution-Processed Full-Color Polymer Organic Light-Emitting Diode Displays Fabricated by Direct Photolithography", Advanced Functional Materials, Vol. 17, pp. 191-200, 2007. DOI |
4 | H. H. Kim, S. H. Choi, S. H. Shin, Y. K. Lee, S. M. Choi and S. Yi, "Thermal Transient Characteristics of Die Attach in High Power LED PKG", Microelectronics Reliability Vol. 48, pp. 445-454, 2008. DOI ScienceOn |
5 | J. S. Lee and D. S. Baik, "Structural Analysis of Tension Controller Spring", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 10, No. 1, pp. 1-5, 2009. 과학기술학회마을 DOI |