Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1987.07a
- /
- Pages.284-287
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- 1987
Development of Die Bonder Machine for Semiconductor Automatic Assembly
반도체 소자용 자동 Die Bonder 기계장치의 개발
-
Bien, Z.
(KAIST)
;
- Youn, M.J. (KAIST) ;
- Oh, S.R. (KAIST) ;
- Oh, Y.S. (KAIST) ;
-
Suh, I.H.
(HANYANG UNIV.)
;
- Ahn, T.Y. (SAMSUNG AEROSPACE) ;
- Kwon, K.B. (SAMSUNG AEROSPACE) ;
- Kim, J.O. (SAMSUNG AEROSPACE) ;
- Kim, J.D. (SAMSUNG AEROSPACE)
-
변증남
(한국과학기술원)
;
- 윤명중 (한국과학기술원) ;
- 오상록 (한국과학기술원) ;
- 오영석 (한국과학기술원) ;
-
서일홍
(한양대학교)
;
- 안태영 (삼성항공) ;
- 권구빈 (삼성항공) ;
- 김제옥 (삼성항공) ;
- 김정덕 (삼성항공)
- Published : 1987.07.03
Abstract
In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.
Keywords