Interfacial Reaction between 42Sn-58 Bi Solder and Electroless Ni-P/Immersion Au UBM during Aging (시효 처리에 의한 42Sn-58Bi 솔더와 무전해 Ni-P/치환 Au UBM 간의 계면 반응)
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- Journal of the Microelectronics and Packaging Society
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- v.12 no.2 s.35
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- pp.95-103
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- 2005