• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.211.1-211.1
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• 2015

최근 용액 공정을 이용한 산화물 반도체에 대한 연구가 활발히 진행되고 있다. 넓은 밴드갭을 가지고 있는 산화물 반도체는 높은 투과율을 가지고 있어 투명 디스플레이에 적용이 가능하다. 기존의 박막 진공증착 방법은 진공상태를 유지하기 위한 장비의 가격이 비싸며, 대면적의 어려움, 높은 생산단가 등으로 생산율이 높지 않다. 하지만 용액 공정을 이용하면 대기압에서 증착이 가능하고 대면적화가 가능하다. 그리고 각각의 조성비를 조절하는 것이 가능하다. 이러한 장점에도 불구하고, 소자의 신뢰성이나 저온공정은 중요한 이슈이다. Instability는 threshold voltage (Vth)의 shift 및 on/off switching의 신뢰성과 관련된 parameter이다. 용액은 소자의 전기적 특성을 열화 시키는 수분 과 탄소계열의 불순물을 다량 포함 하고 있어 고품질의 박막을 형성하기 위해서는 고온의 열처리가 필요하다. 기존의 열처리는 고온에서 장시간 이루어지기 때문에 유리나 플라스틱, 종이 기판의 소자에서는 불가능하지만 $100^{\circ}C$ 이하의 저온 공정인 microwave를 이용하면 유리, 플라스틱, 종이 기판에서도 적용이 가능하다. 본 연구에서는 산화물 반도체 중에서 InGaZnO (IGZO)를 용액 공정으로 제작한 juctionless thin-film transistor를 제작하여 기존의 열처리를 이용하여 처리한 소자와 microwave를 이용해서 열처리한 소자의 전기적 특성을 한 달 동안 관찰 하였다. 또한 In:Zn의 비율을 고정한 후 Ga의 비율을 달리하여 특성을 비교하였다. 먼저 p-type bulk silicon 위에 SiO2 산화막이 100 nm 증착된 기판에 RCA 클리닝을 진행 하였고, solution InGaZnO 용액을 spin coating 방식으로 증착하였다. Coating 후에, solvent와 수분을 제거하기 위해서 $180^{\circ}C$에서 10분 동안 baking공정을 하였다. 이후 furnace열처리와 microwave열처리를 비교하기 위해 post-deposition-annealing (PDA)으로 furnace N2 분위기에서 $600^{\circ}C$에서 30분, microwave를 1800 W로 2분 동안 각각의 샘플에 진행하였다. 또한, HP 4156B semiconductor parameter analyzer를 이용하여 제작된 TFT의 transfer curve를 측정하였다. 그 결과, microwave 열처리한 소자의 경우 기존의 furnace 열처리 소자와 비교하여 높은 mobility, 낮은 hysteresis 값을 나타내었으며, 1달간 소자의 특성을 관찰하였을 때 microwave 열처리한 소자의 경우 전기적 특성이 거의 변하지 않는 것을 확인하였다. 따라서 향후 용액공정, 저온공정을 요구하는 소자 공정에 있어 열처리방법으로 microwave를 이용한 활용이 기대된다.

• 한국자기학회지
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• 제18권5호
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• pp.190-194
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• 2008

FePd 합금박막을 스퍼터링법으로 초격자 박막의 형태로 제작하고 기판온도, 조성변화에 따른 미세구조 및 자기적 특성을 분석하였다. FePd 합금박막의 규칙화를 위한 열처리 온도를 FePt의 열처리 온도에 비해 $150^{\circ}C$ 낮추는데 성공하였다. 또한 FePd 규칙화 합금 박막은 화학양론적 조성일 때 장범위 규칙도는 가장 높은 값을 가졌으며(Fe조성 50 at.%, S = 0.79), 자기이방성 에너지는 Fe 조성이 약간 낮은 조성에서(Fe조성 48 at.%, $K_U=1.6{\times}10^7\;erg/cm^3$) 가장 높은 값을 나타내었다. 이것은 FePd 합금박막의 조성이 장범위 규칙도와 수직자기이방성에 직접적으로 영향을 미친다는 것을 나타낸다.

• 대한기계학회논문집B
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• 제33권11호
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• pp.840-848
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• 2009

In the boiling heat transfer mechanism, CHF(critical heat flux) is the significantly important parameter of the system. So, many researchers have been struggling to enhance the CHF of the system in enormous methods. Recently, there were lots of researches about enormous CHF enhancement with the nanofluids. In that, the pool boiling CHF in nanofluids has the significantly increased value compared to that in pure water because of the deposition of the nanoparticle on the heater surface in the nanofluids. The aim of this study is the comparison of the effect of the nanoparticle deposited surface and the modified surface which has the similar morphology and made by MEMS fabrication. The nanoparticle deposited surface has the complex structures in nano-micro scale. Therefore, we fabricated the surfaces which has the similar wettability and coated with the micro size post and nano structure. The experiment is performed in 3 cases : the bare surface with 0.002% water-ZnO nanofluids, the nanoparticle deposited surface with pure water and the new fabricated surface with pure water. The contact angle, a representative parameter of the wettability, of the all 3 cases has the similar value about 0 and the SEM(scanning electron microscope) images of the surfaces show the complex nano-micro structure. From the pool boiling experiment of the each case, the nanoparticle deposited surface with pure water and the fabricated surface with pure water has the almost same CHF value. In other words, the CHF enhancement of the nanoparticle deposited surface is the surface effect. It also shows that the new fabricated surface follows the nanoparticle deposited surface well.

• 한국재료학회지
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• 제9권7호
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• pp.688-694
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• 1999

Ti-6Al-4V 합금을 타겟트로 사용하여 유리 기판위에 dc reactive magnetron sputtering법으로 $N_2$/(Ar+N_2)$ 비, 기전력 및 시간등의 여러 가지 증착 조건에서 Ti-6Al-4V-N 필름을 증착하였고, 각각의 증착 조건에 따른 결정구조 및 우선방위 거동은 X-선 회절장치를 사용하여 조사하였다. Ti-6Al-4V-N 필름은 본질적으로 fcc 결정구조의 $\delta$-TiN에 Al과 V이 결함으로서 고용된 변형된 형태의 $\delta$-TiN구조이고, TiN의 격자상수(4.240 )보다 작은 값을 나타내었는데, 이는 Ti(1.47 )에 비하여 상대적으로 원자반경이 작은 Al(1.43 )과 V (1.32 )이 Ti의 격자위치에 치환된 결과이다. 그리고 Ti-6Al-4V-N 필름은 $_N2$가스 분압이 감소됨에 따라 (111) 우선방위 성장거동을 하였을 뿐만아니라 증착시간의 증가에 따라 뚜렷한 (111) 우선방위 성장거동을 나타내었다. 그리고 증착속도 및 결정입도의 거동 또한 여러 가지 증착 조건에 크게 의존한다

• Nuclear Engineering and Technology
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• 제56권7호
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• pp.2650-2658
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• 2024

In this paper, we use a Monte Carlo (MC) simulation based on Geant4 to investigate the influence of four parameters on the spatial resolution of the lens-coupled lutetium yttrium orthosilicate (LYSO) scintillator, including the thickness of the LYSO scintillator, the F-number and minification factor of the lens, and the incident position of the gamma-rays. Simulation results show that when the gamma-rays are incident along the lens axis, the smaller the thickness, the larger the F-number, the larger the minification factor, the higher the spatial resolution, with an isotropic point spread function (PSF). As the incident position of the gamma-rays deviates from the lens axis, the spatial resolution decreases, and the PSF becomes anisotropic. In addition, by analyzing the whole physical process of the lens-coupled LYSO scintillator from gamma-rays to secondary electrons to fluorescence photons, we aim to provide a detailed analysis of the influence of each parameter on the spatial resolution. The results show that the PSF of the secondary electrons energy deposition is almost constant in the simulation, which determines the upper limit of the spatial resolution. Meanwhile, the dispersion process of the fluorescence photons can explain the reason why each parameter affects the spatial resolution.

• 한국분말재료학회지
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• 제24권6호
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• pp.437-443
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• 2017

SiC-based composite materials with light weight, high durability, and high-temperature stability have been actively studied for use in aerospace and defense applications. Moreover, environmental barrier coating (EBC) technologies using oxide-based ceramic materials have been studied to prevent chemical deterioration at a high temperature of $1300^{\circ}C$ or higher. In this study, an ytterbium silicate material, which has recently been actively studied as an environmental barrier coating because of its high-temperature chemical stability, is fabricated on a sintered SiC substrate. $Yb_2O_3$ and $SiO_2$ are used as the raw starting materials to form ytterbium disilicate ($Yb_2Si_2O_7$). Suspension plasma spraying is applied as the coating method. The effect of the mixing method on the particle size and distribution, which affect the coating formation behavior, is investigated using a scanning electron microscope (SEM), an energy dispersive spectrometer (EDS), and X-ray diffraction (XRD) analysis. It is found that the originally designed compounds are not effectively formed because of the refinement and vaporization of the raw material particles, i.e., $SiO_2$, and the formation of a porous coating structure. By changing the coating parameters such as the deposition distance, it is found that a denser coating structure can be formed at a closer deposition distance.

• 한국표면공학회지
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• 제42권6호
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• pp.256-259
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• 2009

The wafer surface temperature is an important parameter in the etching process which influences the reaction probabilities of incident species, the vapor pressure of etch products, and the re-deposition of reaction products on feature surfaces. In this study, we investigated all of the effects of substrate temperature on the etch rate of $ZrO_2$ thin film and selectivity of $ZrO_2$ thin film over $SiO_2$ thin film in inductively coupled plasma as functions of $Cl_2$ addition in $BCl_3$/Ar plasma, RF power and dc-bias voltage based on the substrate temperature in range of $10^{\circ}C$ to $80^{\circ}C$. The elements on the surface were analyzed by x-ray photoelectron spectroscopy (XPS).

• Transactions on Electrical and Electronic Materials
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• 제17권3호
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• pp.146-149
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• 2016

The CrN/TiN/Al thin films for solar selective absorber were prepared by dc reactive magnetron sputtering with multi targets. The binary nitride CrN layer deposited with change in N₂ gas flow rates. The gas mixture of Ar and N2 was an important parameter during sputtering deposition because the metal volume fraction (MVF) was controlled by the N2 gas flow rate. In this study, the crystallinity and surface properties of the CrN/TiN/Al thin films were estimated by X-ray diffraction (XRD), atomic force microscopy (AFM) and field emission scanning electron microscopy (FESEM). The composition and depth profile of thin films were investigated using Auger electron spectroscopy (AES). The absorptance and reflectance with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 300~1,100 nm.

• 반도체디스플레이기술학회지
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• 제6권4호
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• pp.11-15
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• 2007

As preparing electrode for the OLED with the sputtering process, in order to be lower damage of the bottom organic layer and increase the life-time of the OLED, we prepared Al electrode for that by using Facing Targets Sputtering (FTS) system. Al electrode directly deposited on the cell (LiF/EML/HTL/Bottom electrode). Deposition condition was the working gas (Ar, Kr and Ar+Kr) and working gas pressure (1 and 6 mTorr). The film thickness and I-V curve of Al/cell were evaluated by a $\acute{a}$-step profiler and a semiconductor parameter (HP4156A) measurement. The thin film surface image was observed by a Atomic Force Microscope (AFM). In result, in comparison with about 11 [V] of the turn-on voltage of Al/cell with using the pure Ar gas, when Al thin film was deposited using the Ar-Kr mixture gas, the surface morphology was improved in some region and the turn-on voltage of Al/cell could be decreased to about 7 [V].

• 한국표면공학회지
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• 제36권2호
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• pp.135-140
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• 2003

The difference in lattice parameter and thermal expansion coefficient between GaN and Si which results in many defects into the grown GaN is larger than that between GaN and sapphire. In order to obtain high quality GaN films on Si substrate, it is essential to understand growth characteristics of GaN. In this study, GaN layers were grown on Si(111) substrates by MOCVD at three different GaN growth temperatures ($900^{\circ}C$, $1,000^{\circ}C$ and $1,100^{\circ}C$), using AlN and LT-GaN buffer layers. Using TEM, we carried out the comparative investigation of growth characteristics of GaN by characterizing lattice coherency, crystallinity, orientation relationship and defects formed (transition region, stacking fault, dislocation, etc). The localized region with high defect density was formed due to the lattice mismatch between AlN buffer layer and GaN. As the growth temperature of GaN increases, the defect density and surface roughness of GaN are decreased. In the case of GaN grown at $1,100^{\circ}$, growth thickness is decreased, and columns with out-plane misorientation are formed.