• 제목/요약/키워드: deposited layer

검색결과 2,401건 처리시간 0.035초

Effect of Annealing Temperature on the Properties of ITO/Au/ITO Films

  • Chae, Joo-Hyun;Kim, Dae-Il
    • 한국재료학회지
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    • 제19권2호
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    • pp.108-110
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    • 2009
  • Transparent Sn-doped $In_2O_3$ (ITO) single-layer and ITO/Au/ITO multilayer films were deposited on glass substrates by reactive magnetron sputtering to compare the properties of the films. They were then annealed in a vacuum of $1{\times}10^{-2}\;Pa$ at temperatures ranging from 150 to $450^{\circ}C$ for 20 min to determine the effect of the annealing temperature on the properties of the films. As-deposited 100 nm thick ITO films exhibit a sheet resistance of $130{\Omega}/{\square}$ and optical transmittance of 77% at a wavelength length of 550 nm. By inserting a 5 nm-thick Au layer in ITO/metal/ITO (IMI) films, the sheet resistance was decreased to as low as $20{\Omega}/{\square}$ and the optical transmittance was decreased to as little as 73% at 550 nm. Post-deposition annealing of ITO/Au/ITO films led to considerably lower electrical resistivity and higher optical transparency. In the Xray diffraction pattern, as-deposited ITO films did not show any diffraction peak, whereas as-deposited ITO/ Au/ITO films have Au (222) and $In_2O_3$ (110) crystal planes. When the annealing temperature reached the 150 - $450^{\circ}C$ range, the both diffraction peak intensities increased significantly. A sheet resistance of $8{\Omega}/{\square}$ and an optical transmittance of 82% were obtained from the ITO/Au/ITO films annealed at $450^{\circ}C$.

TiO2/CdS 복합광촉매의 밴드갭 에너지 특성과 광촉매 효율 (Photocatalytic Efficiency and Bandgap Property of the CdS Deposited TiO2 Photocatalysts)

  • 이종호;허수정;윤정일;김영직;서수정;오한준
    • 한국재료학회지
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    • 제29권12호
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    • pp.790-797
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    • 2019
  • To improve photocatalytic performance, CdS nanoparticle deposited TiO2 nanotubular photocatalysts are synthesized. The TiO2 nanotube is fabricated by electrochemical anodization at a constant voltage of 60 V, and annealed at 500 for crystallization. The CdS nanoparticles on TiO2 nanotubes are synthesized by successive ionic layer adsorption and reaction method. The surface characteristics and photocurrent responses of TNT/CdS photocatalysts are investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), UV-Vis spectrometer and LED light source installed potentiostat. The bandgaps of the CdS deposited TiO2 photocatalysts are gradually narrowed with increasing of amounts of deposited CdS nanoparticles, which enhances visible light absorption ability of composite photocatalysts. Enhanced photoelectrochemical performance is observed in the nanocomposite TiO2 photocatalyst. However, the maximum photocurrent response and dye degradation efficiency are observed for TNT/CdS30 photocatalyst. The excellent photocatalytic performance of TNT/CdS30 catalyst can be ascribed to the synergistic effects of its better absorption ability of visible light region and efficient charge transport process.

ALD법으로 제조된 Al2O3 박막의 물리적 특성 (Physical Properties of the Al2O3 Thin Films Deposited by Atomic Layer Deposition)

  • 김재범;권덕렬;오기영;이종무
    • 한국재료학회지
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    • 제12권6호
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    • pp.493-498
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    • 2002
  • $Al_2O_3$ is a promising gate dielectric because of its high dielectric constant, high resistivity and low leakage current. Since $OH^-$ radical in $Al_2O_3$ films deposited by ALD using TMA and $H_2O$ degrades the good properties of $Al_2O_3$, TMA and $O_3$ were used to deposite $Al_2O_3$ films and the effects of $O_3$ on the properties of the $Al_2O_3$ films were investigated. The growth rate of the $Al_2O_3$ film under the optimum condition was 0.85 $\AA$/cycle. According to the XPS analysis results the $OH^-$ concentration in the $Al_2O_3$ film deposited using $O_3$ is lower than that using $H_2O$. RBS analysis results indicate the chemical formula of the film is $Al_{2.2}O_{2.8}$. The carbon concentration in the film detected by AES is under 1 at%. SEM observation confirms that the step coverage of the $Al_2O_3$ film deposited by ALD using $O_3$ is nearly 100%.

Plasma Assisted ALD 장비 계발과 PAALD법으로 증착 된 TaN 박막의 전기적 특성 (Development of Plasma Assisted ALD equipment and Electrical Characteristic of TaN thin film deposited PAALD method)

  • 도관우;김경민;양충모;박성근;나경일;이정희;이종현
    • 반도체디스플레이기술학회지
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    • 제4권2호
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    • pp.39-43
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    • 2005
  • In the study, in order to deposit TaN thin film for diffusion barrier and bottom electrode we made the Plasma Assisted ALD equipment and confirmed the electrical characteristics of TaN thin films grown PAALD method. Plasma Assisted ALD equipment depositing TaN thin film using PEMAT(pentakis(ethylmethlyamino) tantalum) precursor and NH3 reaction gas is shown that TaN thin film deposited high density and amorphous phase with XRD measurement. The degree of diffusion and reaction taking place in Cu/TaN (deposited using 150W PAALD)/$SiO_{2}$/Si systems with increasing annealing temperature was estimated for MOS capacitor property and the $SiO_{2}$, (600${\AA}$)/Si system surface analysis by C-V measurement and secondary ion material spectrometer (SIMS) after Cu/TaN/$SiO_{2}$ (400 ${\AA}$) layer etching. TaN thin film deposited PAALD method diffusion barrier have a good diffusion barrier property up to 500$^{\circ}C$.

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MOCVD법에 의한 TiO2 박막의 제조에 미치는 산소의 영향 (Effects of Oxygen on Preparation of TiO2 Thin Films by MOCVD)

  • 유성욱;박병옥;조상희
    • 한국결정학회지
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    • 제6권2호
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    • pp.111-117
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    • 1995
  • 화학증착법에 의해 TiO2 박막을 Si-wafer(100)위에 제조하였다. Titanium tetraisopropoxide (TTIP)를 출발물질로 하여 200-500℃의 온도범위에서 증착을 행하였다. 증착된 박막의 두께는 Ellipsometry 및 SEM을 사용하여 측정하였으며, 산소의 함량에 따른 증착층의 성분분석은 ESCA를 사용하였다. TiO2 박막의 증착속도는 산소의 함량에 따라 증가하였고, 반응가스인 산소를 공급하지 않았을 때 증착층내에 불순물로 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 Ti로 변하였다. 산소를 600scm 공급하였을 때 증착층내에 소량의 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 TiO, Ti로 됨을 알 수 있었다. 산소를 1200scm공급하였을 때 증착층내에 탄소가 존재하지 않았으며, 증착층 성분은 표면에는 TiO2를 이루나 증착층 내부로 갈수록 Ti복합화합물을 이루고 있었다.

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SiO2 버퍼층을 갖는 PET 기판위에 증착한 IZTO 박막의 전기적 및 광학적 특성 (Electrical and Optical Properties of the IZTO Thin Film Deposited on PET Substrates with SiO2 Buffer Layer)

  • 박종찬;정양희;강성준
    • 한국정보통신학회논문지
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    • 제21권3호
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    • pp.578-584
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    • 2017
  • PET (Polyethylene terephthalate) 플라스틱 기판 위에 IZTO (In-Zn-Sn-O) 박막을 증착하기 전에, $SiO_2$ 버퍼층을 전자빔 증착 방법으로 100 nm 의 두께로 증착하였다. IZTO 박막은 RF 마그네트론 스퍼터링법으로 RF 파워는 30~60 W 로, 공정 압력은 1~7 mTorr 로 변화시켜가며 $SiO_2$/PET 에 증착하여 IZTO 박막의 구조적, 전기적, 광학적 특성을 분석하였다. RF 파워 50 W 와 공정 압력 3 mTorr 에서 증착한 IZTO 박막이 $4.53{\times}10^{-3}{\Omega}$ 의 제일 큰 재료평가지수와 이때 $4.42{\times}10^{-4}{\Omega}-cm$ 의 비저항과 $27.63{\Omega}/sq.$ 의 면저항으로 가장 우수한 전기적 특성을 보였고, 가시광 영역 (400~800 nm) 에서의 평균 투과도도 81.24 % 로 가장 큰 값을 나타내었다. AFM 으로 IZTO 박막의 표면 형상을 관찰한 결과, 모든 IZTO 박막이 핀홀이나 크랙 같은 결함이 없는 표면을 가지며, RF 파워 50 W 와 공정 압력 3 mTorr에서 증착한 박막이 1.147 nm 의 가장 작은 표면 거칠기를 나타내었다. 이로부터 $SiO_2$/PET 구조위에 증착한 IZTO 박막이 차세대 플렉시블 디스플레이 소자에 응용될 수 있는 매우 유망한 재료임을 알 수 있었다.

RABiTS 위에 PLD 방법으로 증착된 YBCO 초전도 박막 선재의 제조 (Manufacturing of YBCO coated conductor deposited on RABiTS by pulsed laser deposition method)

  • 고락길;;정준기;하홍수;김호섭;송규정;박찬;문승현;유상임;김영철
    • Progress in Superconductivity
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    • 제6권1호
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    • pp.74-78
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    • 2004
  • YBCO coated conductor is one of the most promising materials as a new generations wire especially for practical power applications. In this work, $YBa_2$$Cu_3$$O_{7}$ -$\delta$/(YBCO) coated conductors (CC) were deposited by pulsed laser deposition (PLD) from buffer layers to superconducting layer on hi-axially textured metal tape. The oxide multilayer buffered substrate of architectures of $CeO_2$/$YSZ/Y_2$$O_3$ was fabricated by PLD at steady status. Then YBCO layer was deposited on RABiTS substrate by stationary and reel-to-reel (R2R) continuous process and we compared with deposition conditions of both processes. The degree of texture of each layer was investigated using X-ray diffraction including $\theta$-2$\theta$ scans, $\omega$-scans and $\Phi$-scans analysis. Their surface morphology was observed by scanning electron microscopy (SEM). The FWHM of the X-ray $\Phi$-scans and $\Phi$-scans indicated that YBCO and buffer layers closely replicate the in-plane and out-of-plane texture of metal tape. Critical current (Ic) at 77 K, self-field of 75.8 A/cm-width, critical temperature (Tc) of 85 K, and critical current density (Ic) of 3.7 MA/$\textrm{cm}^2$ were measured from coated conductor deposited by stationary process. And coated conductor deposited by R2R continuous process had Ic of 57.5 A/cm-width, Tc of 86.5 K and Jc of 2.0 MA/$\textrm{cm}^2$. The film also exhibits a homogeneous and dense surface morphology.

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공정압력이 SiO2 버퍼층을 갖는 PES 기판위에 증착한 ITZO 박막의 전기적 및 광학적 특성에 미치는 영향 (Effect of Working Pressure on the Electrical and Optical Properties of ITZO Thin Films Deposited on PES Substrate with SiO2 Buffer Layer)

  • 정양희;최병균;강성준
    • 한국전자통신학회논문지
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    • 제14권5호
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    • pp.887-892
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    • 2019
  • 본 연구에서는 플라스틱 기판 중에서 가장 내열성이 우수하다고 알려진 PES 기판위에 버퍼층으로 20nm두께로 $SiO_2$ 박막을 플라즈마 화학기상증착 법으로 증착한 후, ITZO 박막을 고주파 마그네트론 스퍼터링 법으로 증착하여 공정압력에 따른 ITZO 박막의 전기적 및 광학적 특성을 조사하였다. 공정압력 3 mTorr 에서 증착한 ITZO 박막이 $8.02{\times}10^{-4}{\Omega}-cm$의 비저항과 $50.13{\Omega}/sq.$의 면저항으로 가장 우수한 전기적 특성을 보였다. 모든 ITZO 박막의 가시광 영역(400-800 nm)에서 평균 투과도는 공정압력에 무관하게 80 %이상으로 나타났다. 재료평가지수는 3 mTorr에서 증착한 ITZO 박막에서 $23.90{\times}10^{-4}{\Omega}^{-1}$로 가장 큰 값을 나타내었다. 본 연구를 통해 ITZO 박막이 차세대 플렉시블 디스플레이 소자에서 ITO 박막을 대체할 매우 유망한 재료라는 것을 알 수 있었다.

무전해 도금법으로 제조된 Co(Re,P) capping layer제조 및 특성 평가 (Synthesis and Characterization of The Electrolessly Deposited Co(Re,P) Film for Cu Capping Layer)

  • 한원규;김소진;주정운;조진기;김재홍;염승진;곽노정;김진웅;강성군
    • 한국재료학회지
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    • 제19권2호
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    • pp.61-67
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    • 2009
  • Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm Co (Re,P) films were deposited on Cu/Ti-coated silicon wafers which acted as a catalytic seed and an adhesion layer, respectively. To obtain the optimized bath composition, electroless deposition was studied through an electrochemical approach via a linear sweep voltammetry analysis. The results of using this method showed that the best deposition conditions were a $CoSO_4$ concentration of 0.082 mol/l, a solution pH of 9, a $KReO_4$ concentration of 0.0003 mol/l and sodium hypophosphite concentration of 0.1 mol/L at $80^{\circ}C$. The thermal stability of the Co (Re,P) layer as a barrier preventing Cu was evaluated using Auger electron spectroscopy and a Scanning calorimeter. The measurement results showed that Re impurities stabilized the h.c.p. phase up to $550^{\circ}C$ and that the Co (Re,P) film efficiently blocked Cu diffusion under an annealing temperature of $400^{\circ}C$ for 1hr. The good barrier properties that were observed can be explained by the nano-sized grains along with the blocking effect of the impurities at the fast diffusion path of the grain boundaries. The transformation temperature from the amorphous to crystal structure is increased by doping the Re.

기상 자기조립박막 법을 이용한 나노임프린트용 점착방지막 형성 및 특성평가 (Deposition and Characterization of Antistiction Layer for Nanoimprint Lithography by VSAM (Vapor Self Assembly Monolayer))

  • 차남구;김규채;박진구;정준호;이응숙;윤능구
    • 한국재료학회지
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    • 제17권1호
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    • pp.31-36
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    • 2007
  • Nanoimprint lithography (NIL) is a new lithographic method that offers a sub-10nm feature size, high throughput, and low cost. One of the most serious problems of NIL is the stiction between mold and resist. The antistiction layer coating is very effective to prevent this stiction and ensure the successful NIL results. In this paper, an antistiction layer was deposited by VSAM (vapor self assembly monolayer) method on silicon samples with FOTS (perfluoroctyltrichlorosilane) as a precursor for making an antistiction layer. A specially designed LPCVD (low pressure chemical vapor deposition) was used for this experiment. All experiments were achieved after removing the humidity. First, the evaporation test of FOTS was performed for checking the evaporation temperature at low pressure. FOTS was evaporated at 5 Tow and $110^{\circ}C$. In order to evaluate the temperature effect on antistiction layer, chamber temperature was changed from 50 to $170^{\circ}C$ with 0.1ml of FOTS for 1 minute. Good hydrophobicity of all samples was shown at about $110^{\circ}$ of contact angle and under $20^{\circ}$ of hysteresis. The surface energies of all samples calculated by Lewis acid/base theory was shown to be about 15mN/m. The deposited thicknesses of all samples measured by ellipsometry were almost 1nm that was similar value of the calculated molecular length. The surface roughness of all samples was not changed after deposition but the friction force showed relatively high values and deviations deposited at under $110^{\circ}$. Also the white circles were founded in LFM images under $110^{\circ}$. High friction forces were guessed based on this irregular deposition. The optimized VSAM process for FOTS was achieved at $170^{\circ}C$, 5 Torr for 1 hour. The hot embossing process with 4 inch Si mold was successfully achieved after VSAM deposition.