• 제목/요약/키워드: deposited layer

검색결과 2,397건 처리시간 0.031초

Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics

  • Sharma, Mukesh Kumar;Jang, Youngjoo;Kim, Jongmin;Kim, Hyungtae;Jung, Jae Pil
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.27-33
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    • 2014
  • This paper presents a brief summary on a relatively new plasma aided electrolytic surface treatment process for light metals. A brief discussion regarding the advantages, principle, process parameters and applications of this process is discussed. The process owes its origin to Sluginov who discovered an arc discharge phenomenon in electrolysis in 1880. A similar process was studied and developed by Markov and coworkers in 1970s who successfully deposited an oxide film on aluminium. Several investigation thereafter lead to the establishment of suitable process parameters for deposition of a crystalline oxide film of more than $100{\mu}m$ thickness on the surface of light metals such as aluminium, titanium and magnesium. This process nowadays goes by several names such as plasma electrolytic oxidation (PEO), micro-arc oxidation (MOA), anodic spark deposition (ASD) etc. Several startups and surface treatment companies have taken up the process and deployed it successfully in a range of products, from military grade rifles to common off road sprockets. However, there are certain limitations to this technology such as the formation of an outer porous oxide layer, especially in case of magnesium which displays a Piling Bedworth ratio of less than one and thus an inherent non protective oxide. This can be treated further but adds to the cost of the process. Overall, it can be said the PEO process offers a better solution than the conventional coating processes. It offers advantages considering the fact that he electrolyte used in PEO process is environmental friendly and the temperature control is not as strict as in case of other surface treatment processes.

Interfacial Properties of Antiferromagnetically-coupled Fe/Si Multilayeres Films

  • Kim, K.W.;Y.V.Kudryavtsev;J.Y.Rhee;J.Dubowik;Lee, Y.P.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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    • pp.168-168
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    • 1999
  • Recently, Fe/Si multilayered films (MLF) have been a focus of interest due to the strong antiferromagnetic (AF) coupling observed in such kind of MLF originates from the same nature as in the metal/metal MLF. In particular, a question of whether the spacer layer in the Fe/Si MLF is metallic or semiconducting is of interest. In spite of various experimental techniques envolved in the study, the chemical composition and the properties of the interfacial regions in the MLF exhibiting the AF coupling is still questionable. The nature of the AF coupling and the interfacial properties of Fe/Si MLF are investigated in this study. A series of Fe/Si MLF with a fixed nominal thickness of Fe(3nm) and a variable thickness of Sk(1.0-2.2nm) were deposited by RF-sputtering onto glass substrates at room temperature. The atomic structures and the actual sublayer thicknesses of the Fe/Si MLF are investigated by using x-ray diffraction. The magnetic-field dependence of the equatorial Kerr effect clearly shows an appearance of the AF coupling between Fe sublayers at tsi = 1.5 - 1.8 nm. the drastic discrepancies between the experimental magnetooptical (MO) and optical properties, and based on the assumption of sharp interfaces between Fe and Si sublayers leads to a conclusion that pure si is absent in the AF-coupled Fe/Si MLF. Introducing in the model nonmagnetic semiconducting FeSi alloy layers between Fe and Si sublayers or as spacer between pure Fe sublayers only slightly improves the agreement between model and experiment. A reasonable agreement between experimental and simulated MO spectra was reached with using the fitted optical properties for the spacer with a typical metallic type of behavior. The results of the magnetic properties measured by vibrating sample magnetometer and magnetic circular dichroism are also analyzed in connection with the MO and optical properties.

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RE 바이어스 스퍼터링한 Cr 박막과 감광성 폴리이미드 사이의 계면 TEM 분석 (TEM Analysis of Interfaces between Cr Film Sputtered with RE Bias and Photosensitive Polyimide)

  • 조성수;김영호
    • 마이크로전자및패키징학회지
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    • 제10권2호
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    • pp.39-47
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    • 2003
  • 감광성 폴리이미드 위에 Cr을 RF 바이어스 스퍼터링 및 RF클리닝 후 DC 스퍼터링한 Cr/폴리이미드의 계면을 TEM으로 관찰하였다. RF power 밀도를 $0.13W/cm^2$에서 $2.12W/cm^2$로 증가시키면서 RF클리닝을 실시한 결과 폴리이미드의 에칭 양상이 둥근 모양에서 뾰족한 모양으로 변하였고 이방성 에칭으로 인해 거칠기가 크게 증가하였다. RF 바이어스 스퍼터링의 경우 RF power를 올리는 동안 RF 클리닝에 의해 폴리이미드가 에칭되었고, 에칭된 부분에 Cr이 증착된 계면을 단면으로 관찰한 결과 Cr과 폴리이미드가 겹쳐져서 혼합된 것처럼 보였다. 그러나 RF power를 올리는 시간을 단축시켜 Cr을 바이어스 스퍼터링했을 때에는 계면이 분명하게 관찰되어 Cr의 implantation이 일어나지 않았음을 알 수 있었다. RF 클리닝한 Cu/Cr/Polyimide를 필 테스트한 결과 짧은 시간의 RF 클리닝으로도 접착력이 크게 증가하였다. 그러므로 RF power를 올리는 동안 실시되었던 RF 클리닝이 RF 바이어스 스퍼터링한 Cr/Polyimide의 접착력 향상에 영향을 주었을 것으로 예상된다.

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블록 공중합체 박막을 이용한 텅스텐 나노점의 형성 (Fabrication of Tungsten Nano Dot by Using Block Copolymer Thin Film)

  • 강길범;김성일;김영환;박민철;김용태;이창우
    • 마이크로전자및패키징학회지
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    • 제13권3호
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    • pp.13-17
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    • 2006
  • 밀도가 높고 주기적인 배열의 기공과 나노패턴이 된 텅스텐 나노점이 실리콘 산화물/실리콘 기판위에 형성이 되었다. 기공의 지름은 25 nm이고 깊이는 40 nm 이었으며 기공과 기공 사이의 거리는 60 nm이었다. nm 크기의 패턴을 형성시키기 위해서 자기조립물질을 사용했으며 폴리스티렌(PS) 바탕에 벌집형태로 평행하게 배열된 실린더 모양의 폴리메틸메타아크릴레이트(PMMA)의 구조를 형성했다. 폴리메틸메타아크릴레이트를 아세트산으로 제거하여 폴리스티렌만 남아있는 건식 식각용 마스크를 만들었다. 실리콘 산화막은 불소 기반의 화학반응성 식각법을 이용하여 식각했다. nm크기의 트렌치 안에 선택적으로 증착된 텅스텐 나노점을 만들기 위해서 저압화학기상증착(LPCVD)방법을 이용하였다. 텅스텐 나노점과 실리콘 트렌치의 지름은 26 nm 와 30 nm였다.

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Physical Vapor Deposition 방법으로 제조된 Al-Ni 전극의 두께가 알칼라인 수전해 수소발생반응에 미치는 영향 연구 (Understanding the Effect on Hydrogen Evolution Reaction in Alkaline Medium of Thickness of Physical Vapor Deposited Al-Ni Electrodes)

  • 한원비;조현석;조원철;김창희
    • 한국수소및신에너지학회논문집
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    • 제28권6호
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    • pp.610-617
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    • 2017
  • This paper presents a study of the effect of thickness of porous Al-Ni electrodes, on the Hydrogen Evolution Reaction (HER) in alkaline media. As varying deposition time at 300 W DC sputtering power, the thickness of the Al-Ni electrodes was controlled from 1 to $20{\mu}m$. The heat treatment was carried out in $610^{\circ}C$, followed by selective leaching of the Al-rich phase. XRD studies confirmed the presence of $Al_3Ni_2$ intermetallic compounds after the heat treatment, indicating the diffusion of Ni from the Ni-rich phase to Al-rich phase. The porous structure of the Al-Ni electrodes after the selective leaching of Al was also confirmed in SEM-EDS analysis. The double layer capacitance ($C_{dl}$) and roughness factor ($R_f$) of the electrodes were increased for the thicker Al-Ni electrodes. As opposed to the general results in above, there were no further improvements of the HER activity in the case of the electrode thickness above $10{\mu}m$. This result may indicate that the $R_f$ is not the primary factor for the HER activity in alkaline media.

나노-마이크로 정밀 분사 시스템을 이용한 하이브리드 인공지지체의 제작 및 평가 (Fabrication and Evaluation of Hybrid Scaffold by Nano-Micro Precision Deposition System)

  • 하성우;김종영
    • 대한기계학회논문집A
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    • 제38권8호
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    • pp.875-880
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    • 2014
  • 최근에, 3 차원 인공지지체와 나노섬유는 골 조직 재생을 위해 개발되고 있다. 본 연구에서는, 나노-마이크로 정밀 분사 시스템을 이용하여 하이브리드 인공지지체를 제작하였다. 하이브리드 인공지지체는 마이크로 인공지지체와 나노섬유가 결합하여 제작되었으며, 마이크로 인공지지체와 나노섬유를 얻기 위해 자유 형상 제작 기술과 전기방사 기법이 사용되었다. 마이크로 인공지지체는 정밀한 공극을 고려하여 CAD/CAM 데이터 따라 자유 형상 제작 기술에 의해 제작되었으며, 제작 공정은 $100^{\circ}C$의 온도, 평균 650 kPa의 압력, 그리고 250 mm/sec의 Z 축 이송속도가 적용되었다. 그리고 전기방사법을 통하여 나노섬유를 제작함에 있어서 본 시스템에 적용한 공정 조건은, 5 kV의 전압, 0.1 ml/min의 유량, 그리고 1 mm의 노즐 팁과 콜렉터와의 거리로 설정하였다. 제작된 하이브리드 인공지지체는 MG-63 세포를 이용하여 세포 증식 실험을 진행하였다.

Planar Type Flexible Piezoelectric Thin Film Energy Harvester Using Laser Lift-off

  • Noh, Myoung-Sub;Kang, Min-Gyu;Yoon, Seok Jin;Kang, Chong-Yun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.489.2-489.2
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    • 2014
  • The planar type flexible piezoelectric energy harvesters (PEH) based on PbZr0.52Ti0.48O3 (PZT) thin films on the flexible substrates are demonstrated to convert mechanical energy to electrical energy. The planar type energy harvesters have been realized, which have an electrode pair on the PZT thin films. The PZT thin films were deposited on double side polished sapphire substrates using conventional RF-magnetron sputtering. The PZT thin films on the sapphire substrates were transferred by PDMS stamp with laser lift-off (LLO) process. KrF excimer laser (wavelength: 248nm) were used for the LLO process. The PDMS stamp was attached to the top of the PZT thin films and the excimer laser induced onto back side of the sapphire substrate to detach the thin films. The detached thin films on the PDMS stamp transferred to adhesive layer coated on the flexible polyimide substrate. Structural properties of the PZT thin films were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). To measure piezoelectric power generation characteristics, Au/Cr inter digital electrode (IDE) was formed on the PZT thin films using the e-beam evaporation. The ferroelectric and piezoelectric properties were measured by a ferroelectric test system (Precision Premier-II) and piezoelectric force microscopy (PFM), respectively. The output signals of the flexible PEHs were evaluated by electrometer (6517A, Keithley). In the result, the transferred PZT thin films showed the ferroelectric and piezoelectric characteristics without electrical degradation and the fabricated flexible PEHs generated an AC-type output power electrical energy during periodically bending and releasing motion. We expect that the flexible PEHs based on laser transferred PZT thin film is able to be applied on self-powered electronic devices in wireless sensor networks technologies. Also, it has a lot of potential for high performance flexible piezoelectric energy harvester.

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Cu, Zn, Sn의 스퍼터링 적층방법과 황화 열처리공정이 Cu2ZnSnS4 태양전지재료 특성에 미치는 효과 (Effects of Sputter Deposition Sequence and Sulfurization Process of Cu, Zn, Sn on Properties of Cu2ZnSnS4 Solar Cell Material)

  • 박남규;비나야쿠마;김의태
    • 한국재료학회지
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    • 제23권6호
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    • pp.304-308
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    • 2013
  • The effect of a sputter deposition sequence of Cu, Zn, and Sn metal layers on the properties of $Cu_2ZnSnS_4$ (CZTS) was systematically studied for solar cell applications. The set of Cu/Sn/Zn/Cu multi metal films was deposited on a Mo/$SiO_2$/Si wafer using dc sputtering. CZTS films were prepared through a sulfurization process of the Cu/Sn/Zn/Cu metal layers at $500^{\circ}C$ in a $H_2S$ gas environment. $H_2S$ (0.1%) gas of 200 standard cubic centimeters per minute was supplied in the cold-wall sulfurization reactor. The metal film prepared by one-cycle deposition of Cu(360 nm)/Sn(400 nm)/Zn(400 nm)/Cu(440 nm) had a relatively rough surface due to a well-developed columnar structure growth. A dense and smooth metal surface was achieved for two- or three-cycle deposition of Cu/Sn/Zn/Cu, in which each metal layer thickness was decreased to 200 nm. Moreover, the three-cycle deposition sample showed the best CZTS kesterite structures after 5 hr sulfurization treatment. The two- and three-cycle Cu/Sn/Zn/Cu samples showed high-efficient photoluminescence (PL) spectra after a 3 hr sulfurization treatment, wheres the one-cycle sample yielded poor PL efficiency. The PL spectra of the three-cycle sample showed a broad peak in the range of 700-1000 nm, peaked at 870 nm (1.425 eV). This result is in good agreement with the reported bandgap energy of CZTS.

여러 분위기에서의 저온 열처리와 폴리머 기판의 표면 morphology가 비정질 $Ta_2O_5$ 박막 커패시터의 특성에 미치는 영향 (Effects of Low Temperature Annealing at Various Atmospheres and Substrate Surface Morphology on the Characteristics of the Amorphous $Ta_2O_5$ Thin Film Capacitors)

  • 조성동;백경욱
    • 한국재료학회지
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    • 제9권5호
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    • pp.509-514
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    • 1999
  • Interest in the integrated capacitors, which make it possible to reduce the size of and to obtain improved electrical performance of an electronic system, is expanding. In this study, $Ta_2$O\ulcorner thin film capacitors for MCM integrated capacitors were fabricated on a Upilex-S polymer film by DC magnetron reactive sputtering and the effects of low temperature annealing at various atmospheres and substrate surface morphology on the capacitor characteristics were discussed. The low temperature($150^{\circ}C$) annealing produced improved capacitor yield irrespective of the annealing at mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably due to the change of the $Ta_2$O\ulcorner film surface by oxygen, which was explained by conduction mechanism study. Leakage current and breakdown field strength of the capacitors fabricated on the Upilex-S film were 7.27$\times$10\ulcornerA/$\textrm{cm}^2$ and 1.0 MV/cm respectively. These capacitor characteristics were inferior to those of the capacitors fabricated on the Si substrate but enough to be used for decoupling capacitors in multilayer package. Roughness Analysis of each layer by AFM demonstrated that the properties of the capacitors fabricated on the polymer film were affected by the surface morphology of the substrate. This substrate effect could be classified into two factors. One is the surface morphology of the polymer film and the other is the surface morphology of the metal bottom electrode determined by the deposition process. Therefore, the control of the two factors is important to obtain improved electrical of capacitors deposited on a polymer film.

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단원자 증착법으로 증착한 $AlO_x/\;HfO_y$ 박막에서의 $AlO_x/$ 산화제에 따른 특성 변화 (Comparison of $AlO_x/$ barriers oxidized with $H_2O$, $O_2$ plasma or $O_3$ in Atomic Layer Deposited $AlO_x/\;HfO_y$ stacks)

  • 조문주;박홍배;박재후;이석우;황철성;정재학
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.275-277
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    • 2003
  • 최근 logic 소자의 gate oxide로 기존의 $SiO_2$, SiON보다 고유전, 작은 누설전류를 가지는 물질의 개발이 중요한 이슈가 되고 있다. 본 실험실에서는 Si 기판위에 $HfO_2$를 바로 증착하는 경우, 기판의 Si이 박막내로 확산하여 유전율이 저하되는 문제점을 인식하고, 기판과 $HfO_2$ 사이에 $AlO_x$를 방지막으로 사용하였다. 이 때, $AlO_x$의 Al precursor는 TMA로 고정하고, 산화제로는 $H_2O$, $O_2$-plasma, $O_3$를 각각 사용하였다. 모든 $AlO_x/\;HfO_y$ 박막에서 매우 우수한 누설전류특성을 얻을 수 있었는데, 특히 $O_3$를 산화제로 사용한 $AlO_x$방지막의 경우 가장 우수한 특성을 보였다. 또한 질소 분위기에서 $800^{\circ}C$ 10분간 열처리한 후, 방지막을 사용한 모든 경우에서 보다 향상된 열적 안정성을 관찰할 수 있었다.

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