Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 10 Issue 2
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- Pages.39-47
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- 2003
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
TEM Analysis of Interfaces between Cr Film Sputtered with RE Bias and Photosensitive Polyimide
RE 바이어스 스퍼터링한 Cr 박막과 감광성 폴리이미드 사이의 계면 TEM 분석
Abstract
Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12
감광성 폴리이미드 위에 Cr을 RF 바이어스 스퍼터링 및 RF클리닝 후 DC 스퍼터링한 Cr/폴리이미드의 계면을 TEM으로 관찰하였다. RF power 밀도를