• Journal of IKEEE
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• v.27 no.4
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• pp.556-560
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• 2023

In this study, the impact of Nitrogen implantation process on deep-level defects and lifetime in 4H-SiC Epi surfaces was comparatively analyzed. Deep Level Transient Spectroscopy (DLTS) and Time Resolved Photoluminescence (TR-PL) were employed to measure deep-level defects and carrier lifetime. As-grown Schottky Barrier Diodes (SBDs) exhibited energy levels at 0.16 eV, 0.67 eV, and 1.54 eV, while for implantation SBD, defects at 0.15 eV were observed. This indicates a reduction in defects associated with energy levels Z_1/2 and EH_6/7, known as lifetime killers, as impurities from nitrogen implantation replace titanium and carbon vacancies.

• Journal of Periodontal and Implant Science
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• v.27 no.3
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• pp.525-532
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• 1997

The purpose of this study was to evaluate the extent and predictability of periodontal regeneration with barrier membranes in deep infrabony defects. 25 patients(40% smokers) were included in this study. Fourty-one deep infrabony defects treated with membranes(PPD>6mm) were evaluated 1 year postoperatively following a plaque control regimen. Probing pocket depth(PPD), gingival recession(REC), and probing attachment level(PAL) were evaluated at baseline and postoperative 1 year. Plaque score at baseline was 16.2 and plaque score at 1 year was 9.9 A PAL gain of $4.1{\pm}2.5mm$ along with a PPD reduction of $5.0{\pm}2.3mm$ were observed. A PAL gain of $4.1{\pm}2.5mm$ was observed at the smoking group and a PAL gain of $4.0{\pm}2.5mm$ was observed at the non-smoking sroup. It was concluded that periodontal regeneration with membrane represented the predictable and effective treatment modality in the deep infrabony defects.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.123-126
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• 2022

We investigated deep levels in n-type 4H-SiC epitaxy layer of the Positive-Intrinsic-Negative diode and Schottky barrier diodes by using deep level transient spectroscopy. Despite the excellent performance of 4H-SiC, research on various deep level defects still requires a lot of research to improve device performance. In Positive-Intrinsic-Negative diode, two defects of 196K and 628K are observed more than Schottky barrier diode. This is related to the action of impurity atoms infiltrating or occupying the 4H-SiC lattice in the ion implantation process. The I-V characteristics of the Positive-Intrinsic-Negative diode shows about ~100 times lower the leakage current level than Schottky barrier diode due to the grid structures in Positive-Intrinsic-Negative. As a result of comparing the capacitance of devices diode and Schottky barrier diode devices, it can be seen that the capacitance value lowered if it exists the P implantation regions from C-V characteristics.

• Journal of IKEEE
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• v.28 no.1
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• pp.104-109
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• 2024

In this research, we explored the influence of post-annealing atmospheres on the electrical properties of Ga₂O₃/SiC heterojunction diodes. We fabricated Ga₂O₃/SiC heterojunction diodes by RF sputtering and after the fabrication the post-annealing in various gas atmospheres was performed. We measured the changes in deep-level defects using Deep Level Transient Spectroscopy (DLTS) and we conducted an electrical characteristic of J-V measurement and Hall measurement to analyzed the effects of annealing atmosphere on Ga₂O₃/SiC heterojunction diode. In the N₂ annealed devices, the highest on-state current was measured as 3.06 × 10^-2 A/cm^2, and an increase in carrier concentration of 3.8 × 10¹⁴ cm^-3 was observed. This confirms that the variations in deep level defects due to the post-annealing atmosphere can influence the electrical properties.

• Korean Journal of Materials Research
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• v.34 no.2
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• pp.111-115
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• 2024

Silicon carbide (SiC) has emerged as a promising material for next-generation power semiconductor materials, due to its high thermal conductivity and high critical electric field (~3 MV/cm) with a wide bandgap of 3.3 eV. This permits SiC devices to operate at lower on-resistance and higher breakdown voltage. However, to improve device performance, advanced research is still needed to reduce point defects in the SiC epitaxial layer. This work investigated the electrical characteristics and defect properties using DLTS analysis. Four deep level defects generated by the implantation process and during epitaxial layer growth were detected. Trap parameters such as energy level, capture-cross section, trap density were obtained from an Arrhenius plot. To investigate the impact of defects on the device, a 2D TCAD simulation was conducted using the same device structure, and the extracted defect parameters were added to confirm electrical characteristics. The degradation of device performance such as an increase in on-resistance by adding trap parameters was confirmed.

• Journal of IKEEE
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• v.26 no.1
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• pp.50-55
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• 2022

SiC is a power semiconductor with a wide bandgap, high insulation failure strength, and thermal conductivity, but many deep-level defects. Defects that appear in SiC can be divided into two categories, defects that appear in physical properties and interface traps that appear at interfaces. In this paper, Z_1/2 trap concentration 0 ~ 9×10¹⁴ cm^-3 reported at room temperature (300 K) is applied to SiC substrates and epi layer to investigate turn-on characteristics. As the trap concentration increased, the current density, Shockley-read-Hall (SRH), and Auger recombination decreased, and Ron increased by about 550% from 0.004 to 0.022 mohm.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.207-212
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• 2014

Aluminum-doped zinc oxide (AZO) films were deposited on SiOC/Si wafer by an RF-magnetron sputtering system, by varying the deposition parameters of radio frequency power from 50 to 200 W. To assess the correlation of the optical properties between the substrate and AZO thin film, photoluminescence was measured, and the origin of deep level emission of AZO thin films grown on SiOC/Si wafer was studied. AZO formed on SiOC/Si substrates exhibited ultraviolet emission due to exciton recombination, and the visible emission was associated with intrinsic and extrinsic defects. For the AZO thin film deposited on SiOC at low RF-power, the deep level emission near the UV region is attributed to an increase of the variations of defects related to the AZO and SiOC layers. The applied RF-power influenced an energy gap of localized trap state produced from the defects, and the gap increased at low RF power due to the formation of new defects across the AZO layer caused by lattice mismatch of the AZO and SiOC films. The optical properties of AZO films on amorphous SiOC compared with those of AZO film on Si were considerably improved by reducing the roughness of the surface with low surface ionization energy, and by solving the problem of structural mismatch with the AZO film and Si wafer.

• Nuclear Engineering and Technology
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• v.55 no.1
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• pp.201-208
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• 2023

The dependence of the electrical characteristics on the fast neutron fluence of an epitaxial 4H-SiC Schottky barrier diode (SBD) was investigated. The 30 MeV cyclotron was used for fast neutron irradiation. The neutron fluences evaluated through Monte Carlo simulation were in the 2.7 × 10¹¹ to 1.45 × 10¹³ neutrons/cm² range. Current-voltage and capacitance-voltage measurements were performed to characterize the samples by extracting the parameters of the irradiated SBDs. Neutron-induced defects in the epitaxial layer were identified and quantified using a deep-level transient spectroscopy measurement system developed at the Korea Atomic Energy Research Institute. As the neutron fluence increased from 2.7 × 10¹¹ to 1.45 × 10¹³ neutrons/cm², the concentration of the Z_1/2 defects increased by approximately 20 times. The maximum defect concentration was estimated as 1.5 × 10¹⁴ cm^-3 at a neutron fluence of 1.45 × 10¹³ neutrons/cm².

• Journal of Information Display
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• v.10 no.4
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• pp.171-174
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• 2009

The optical and electrical properties of the amorphous indium gallium zinc oxide thin-film transistor ($\alpha$-IGZO TFT) were studied. When the $\alpha$-IGZO TFT was illuminated at a wavelength of 660 nm, the off-state drain current slightly increased, while below 550 nm it increased significantly. The $\alpha$-IGZO TFT was found to be extremely sensitive, with deep-level defects at approximately 2.25 eV near the midgap. After UV light illumination, a slight change occurred on the surface of the $\alpha$-IGZO films, such as in terms of the oxygen 1s spectra, resistivity, and carrier concentrations. It is believed that these results will provide information regarding the photo-induced behaviors in the $\alpha$-IGZO films.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.531-533
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• 2009

We've studied the optical and electrical properties of amorphous indium gallium zinc oxide thin-film transistor (a-IGZO TFT). When the a-IGZO TFT was illuminated at a wavelength of 660 nm, the offstate drain current was slightly increased, while below 550 nm it was increased significantly. The a-IGZO TFT was extremely sensitive, with deep-level defects at approximately 2.25 eV near the midgap.