• Title/Summary/Keyword: crack layer

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Effect of the processing variables on the formation of $Pb(Sc_{1/2}Nb_{1/2})O_3$ thin layers ($Pb(Sc_{1/2}Nb_{1/2})O_3$ 박막 형성에 미치는 공정변수의 영향)

  • Park, Kyung-Bong;Kwon, Seung-Hyeop;Kim, Tae-Huei
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.19 no.2
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    • pp.70-74
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    • 2009
  • Effect of the processing variables on the formation of $Pb(Sc_{1/2}Nb_{1/2})O_3$(hereafter PSN) thin layers prepared on Pt(111)/Ti/$SiO_2$/Si substrates using the sol-gel and the spin coating method has been studied. After each deposition, the coated films were heated at $370^{\circ}C$ for 5 min. Then they were finally sintered at temperature range of $600{\sim}700^{\circ}C$ by RTA(rapid thermal annealing). The final multilayered films showed a (111) preferred orientation. On a while, the layer-by-layer crystallization of multilayered amorphous thin films without the intermediate heating exhibited a (100) preferred orientation. In case of heat treatment in the tube furnace with the heating rate of $4^{\circ}C/min$, (100) and (111) oriented thin layers were formed simultaneously. The microstructure of the deposited films were dense and crack-free with thickness of 300nm, irrespective of the processing variables.

Effects of the V/III ratio on a-plane GaN epitaxial layer on r-plane sapphire grown by HVPE (r-Plane sapphire 위에 HVPE에 의해 성장한 a-plane GaN에피텍셜층의 V/III족 ratio에 따른 특성 변화)

  • Ha, Ju-Hyung;Park, Mi-Seon;Lee, Won-Jae;Choi, Young-Jun;Lee, Hae-Yong
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.24 no.3
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    • pp.89-93
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    • 2014
  • In this study, effects of the V/III ratio on a-plane GaN epitaxial on r-plane grown by HVPE have been investigated. According to increasing of V/III ratio, the value of FWHM of a-plane (11-20) GaN and the value of surface roughness (Ra) were decreased. Growth rate of a-plane GaN epitaxial layer were increased until V/III ratio = 7 as the increasing of V/III ratio, but it was reduced at V/III ratio = 10. At V/III ratio = 10, the FWHM of a-plane (11-20) GaN RC and the surface roughness (Ra) were 829 arcsec and 1.58 nm, respectively, as the lowest value in this study. Also for V/III ratio = 10, cracks under surface or voids were observed the lowest values in images of optical microscope. An M-shaped azimuthal dependence over $360^{\circ}$ angle range was observed for all samples. At V/III ratio = 10, the difference of FWHM of a-plane GaN between $0^{\circ}$ and $90^{\circ}$ was 439 arcsec revealed as the lowest value in the 4 samples.

Flexural Behavior of High Performance Fiber Reinforced Cementitious Composites (HPFRCC) Beam with a Reinforcing Bar (휨 철근이 배근된 HPFRCC 보 부재의 휨 거동)

  • Shin, Kyung-Joon;Kim, Jae-Hwa;Cho, Jae-Yeol;Lee, Seong-Cheol
    • Journal of the Korea Concrete Institute
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    • v.23 no.2
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    • pp.169-176
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    • 2011
  • In this study, the flexural test for reinforced high performance fiber reinforced cementitious composites (R/HPFRCC) members has been conducted in order to investigate the flexural behavior including the effect of an ordinary tensile reinforcing bar. Through the test, it was observed that the flexural strength increased due to the stable tensile stress transfer of HPFRCC, even up to the ultimate state. In addition, no localized crack appeared until the yielding of the reinforcement. From the layered section analysis of the tested members, it was found that the analysis with the tensile model obtained from the tension stiffening test showed better agreement with the flexural test results, whereas the analysis with direct tension test results overestimated the flexural capacity. Through the experimental and analytical studies, two flexural failure modes have been defined in this paper; concrete crushing at the top compression layer or tensile failure at the bottom tensile layer of the beam section. Based on these two flexural failure modes, a simple formula that estimates the ultimate flexural strength of the member has been proposed in this paper. The proposed equations can be useful in a design and an analysis of R/HPFRCC members.

Nondestructive Deterioration Diagnosis for the Former Ore Dressing Plant in the Yongwha Mine of Registered Cultural Property No. 255 (등록문화재 제255호 영양 구 용화광산 선광장의 비파괴 훼손도 진단)

  • Chun, Yu Gun;Lee, Chan Hee
    • Journal of Conservation Science
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    • v.28 no.3
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    • pp.235-245
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    • 2012
  • Nondestructive deterioration diagnosis has been carried out for the former ore dressing plant of the Yongwha mine in Yeongyang (Registered Cultural Property No. 255). Deterioration rates about organic contaminant and soil of the upper part (7 to 13 layer) indicate higher than the lower part (1 to 6 layer) of the ore dressing plants. By contrast, deterioration rates such as crack, break out and discoloration of the lower part indicate very higher than the upper part. It is estimated that the plants of the lower part that mechanical and chemical process had been done for flotation were damaged severely by physicochemical weathering with reaction of concrete and chemical solution. As results of ultrasonic velocity measurement, average p-wave velocity of plants were measured 2,462m/s (compressive strength $529kgf/cm^2$). As for the analytical results of surface contaminants and soil compositions using P-XRF, they were identical with major elements (Cu, Zn, Pb, Fe and As) of ore minerals from the Yongwha mine. Therefore, the ore dressing plant should be treated by phytoremediation with conservation because heavy metals could impinged upon plants and natural environment.

A Morphological Comparison of Bamboo Zephyr Produced from Phyllostachys nigra var. henonis and Indonesian Gigantochloa apus (국산 솜대와 인도폐시아산 TALI를 이용한 대나무 Zephyr의 형태적 특성 비교)

  • Kim, Yu-Jung;Jung, Ki-Ho;Park, Sang-Jin;Roh, Jeang-Kwan
    • Journal of the Korean Wood Science and Technology
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    • v.29 no.2
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    • pp.84-90
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    • 2001
  • To investigate morphological characteristics of zephyr produced from two bamboo species, Phyllostachys nigra var. henonis and Gigantochloa apus, basic anatomic properties were examined by scanning electron microscopy and image analysis. According to SEM observation, zephyr from Phyllostachys nigra var. henonis was not of uniform in shape and showed macro crack between vascular bundle sheaths. This may be attributes to the sclerenchymatous fibers connected closely, thus resulting in difficult separation of intercellular layer. Zephyr from Gigantochloa apus was of uniform in shape, which may be caused by easy separation of intercellular layer of sclerenchymatous fibers having thin cell wall and large cell lumen. By image analysis in cross section of two species, the ratio of vascular bundle sheaths and cell wall ratio of sclerenchymatous fibers were examined. The ratio of vascular bundle sheaths in Phyllostachys nigra var. henonis was lower than that in Gigantochloa apus. However, cell wall ratio of sclerenchymatous fibers in Phyllostachys nigra var. henonis was higher than that in Gigantochloa apus.

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Manufacture of Cement-Bonded Particleboards from Korean Pine and Larch by Curing of Supercritical CO2 Fluid

  • Suh, Jin-Suk;Hermawan, Dede;Kawai, Shuichi
    • Journal of the Korean Wood Science and Technology
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    • v.28 no.4
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    • pp.41-50
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    • 2000
  • Cement-bonded particleboard is being used as outdoor siding material all over the world, because this composite particularly bears a light weight, high resistance against fire, decay, and crack by cyclic freezing and thawing, anti-shock property, and strength enhancement. Construction systems are currently changing into a frame-building style and wooden houses are being constructed with prefabrication type. Therefore, they require a more durability at outdoor-exposed sides. In this study, the cement hydration property for Korean pine particle, Japanese larch particle and face- and middle layer particles (designated as PB particle below) used in Korean particleboard-manufacturing company was investigated, and the rapid manufacturing characteristics of cement-bonded particleboard by supercritical $CO_2$ curing was evaluated. Korean pine flour showed a good hydration property, however, larch flour showed a bad one. PB particle had a better hydration property than larch flour. The addition of $Na_2SiO_3$ indicated a negative effect on hydration, however, $MgCl_2$ had a positive one. Curing by supercritical $CO_2$ fluid gave a conspicuous enhancement in the performances of cement-bonded particleboards compared to conventional curing. $MgCl_2$ 3%-added PB particle had the highest properties, and $MgCl_2$ 1%-added Korean pine particle had the second class with the conditions of cement/wood ratio of 2.7, a small fraction-screened particle and supercritical curing. On the contrary, the composition of non-hammermilled or large fraction-screened particle at cement/wood ratio of 2.2 was poorer. Also, the feasibility for actual use of 3%-added, small PB particle-screened fraction was greatest of all the conventional curing treatments. Relative superiority of supercritical curing vs. conventional curing at dimensional stability was not so apparent as in strength properties. Through the thermogravimetric analysis, it was ascertained that the peak of a component $CaCO_3$ was highest, and the two weak peaks of calcium silicate hydrate and ettringite and $Ca(OH)_2$ were present in supercritical treatment. Accordingly, it was inferred that the increased formation of carbonates in board contributes to strength enhancement.

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Numerical Analysis of Warpage and Stress for 4-layer Stacked FBGA Package (4개의 칩이 적층된 FBGA 패키지의 휨 현상 및 응력 특성에 관한 연구)

  • Kim, Kyoung-Ho;Lee, Hyouk;Jeong, Jin-Wook;Kim, Ju-Hyung;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.7-15
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    • 2012
  • Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

Study About Filling-Material for Clay Layer Restoration of Seated Amitabha Triad at Muwisa Temple (Treasure No. 1312) (보물 제1312호 무위사 아미타여래삼존좌상 소조층 보수 충전제에 관한 연구)

  • Lee, Su Yea
    • Journal of Conservation Science
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    • v.31 no.1
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    • pp.1-11
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    • 2015
  • Seated Amitabha Triad at Muwisa Temple (Treasure No. 1312) had been known as wooden Buddha statue, but a precise safety inspection revealed that the statue is terracotta Buddha statue made with clay. The clay layer of Amitabha Triad was conserved due to its severe damage. In this study, experiments were conducted to produce the most appropriate filler for the conservation treatment of the seated Amitabha Triad. Mixed clay samples with various ratios were produced and surface hardening state, crack, color change, and shrinkage of the samples during dry process were measured. Loess, fine sand powder, and cotton were used to produce the mixed clay for the filler with six different ratios and then 12 different concentration glues made with glutinous rice glue, Pachymeniopsis Elliptica glue, and animal glue were added as adhesives. Total 72 types of samples were prepared and comparative study was conducted. As a result, when the mixed clay contains 2.5% cotton compared to the weight per cent of loess and fine sand powder and also loess and fine sand in the mixed clay have a 15:1 ratio, the mixed clay had the lowest shrinkage. Animal glue is considered as an appropriate glue since it had small color change, low physical property change and shringkage. Therefore, mixed clay (loess:fine sand=15:1) mixed with 15ml animal glue is likely to be a suitable filler for conservation treatment of the seated amitabha triad at the Muwisa Temple.

A Case Study on the Reinforcement of Stabilizing Piles against Slope Failures in a Cut Slope (사면붕괴가 발생된 절개사면에서의 억지말뚝 보강 사례연구)

  • Song Young-Suk
    • The Journal of Engineering Geology
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    • v.16 no.2 s.48
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    • pp.189-199
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    • 2006
  • This paper presents a field study of the stability of slope collapsed during road construction and proposes a reasonable countermeasure if the current slope is unstable. As a result of slope investigation, it was found that the slope includes five tension cracks and the sliding surface is started from the tension crack and propagated the surface soil layer through weathered rock layer. The slope stability analyses are conducted in case of dry and rainfall seasons. The results indicate that the slope is unstable status. A reinforcement method of slope failure should be selected according to the scale of failure. That is, the scale of slope failure, which is classified small, middle and large size determines the reinforcement method of slope. Since the slope interested in this study is large size failure slope, the reinforcement method to control slope failure is selected stabilizing piles, and seed spray and drainage of surface waterare also selected to remain the factor of safety. The SLOPILE (Ver. 3.0) program is applied in order to do stability analysis of slope reinforced by piles. As the result of analysis, the slope reinforced by a row of piles shows the stable state. It is clearly confirmed that the stabilizing of piles can improve the stability of slope.

Reliability of Cu Interconnect under Compressive Fatigue Deformation Varying Interfacial Adhesion Treatment (유연소자용 기판과의 접착 특성에 따른 구리 배선의 압축 피로 거동 및 신뢰성)

  • Min Ju Kim;Jeong A Heo;Jun Hyeok Hyun;So-Yeon Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.105-111
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    • 2023
  • Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.