• 제목/요약/키워드: copper stress

검색결과 291건 처리시간 0.03초

이종재 접합부에서의 응력집중현상에 관한 연구 (A Study on the Stress Concentration Phenomenon of a Dissimilar Joints)

  • 조상명;김영식
    • Journal of Welding and Joining
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    • 제10권1호
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    • pp.35-42
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    • 1992
  • In this study, the stress concentration phenomenon for the dissimilar joints(ceramic-metal) bonded by thermal treating using a soft-insert metal(copper) was investigated with the aid of FEM(finite element method) under the load condition of uniform tension. The analysis was carried out by the supposing that stress states are plane stress or plane strain and elastic or elastic-plastic. And the Von Mises yield criterion and the incremental theory as plastic flow were adopted in this analysis. As the summarized results obtained, the stress concentration phenomenon was severer as the soft insert metal was thicker, in plane strain than in plane stress and in elastic-plastic state than in elastic state. Furthermore, the inducing mechanism of stress concentration was well expressed by the constraint forces(Fc) generated between the soft and the hard material.

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Elucidation of Copper and Asparagine Transport Systems in Saccharomyces cerevisiae KNU5377 Through Genome-Wide Transcriptional Analysis

  • KIM IL-SUP;YUN HAE SUN;SHIMISU HISAYO;KITAGAWA EMIKO;IWAHASHI HITOSHI;JIN INGNYOL
    • Journal of Microbiology and Biotechnology
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    • 제15권6호
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    • pp.1240-1249
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    • 2005
  • Saccharomyces cerevisiae KNU5377 has potential as an industrial strain that can ferment wasted paper for fuel ethanol at $40^{\circ}C$ [15, 16]. To understand the characteristics of the strain, genome-wide expression was performed using DNA microarray technology. We compared the homology of the DNA microarray between genomic DNAs of S. cerevisiae KNU5377 and a control strain, S. cerevisiae S288C. Approximately $97\%$ of the genes in S. cerevisiae KNU5377 were identified with those of the reference strain. YHR053c (CUP1), YLR155c (ASP3), and YDR038c (ENA5) showed lower homology than those of S. cerevisiae S288C. In particular, the differences in the regions of YHR053c and YLR155c were confirmed by Southern hybridization, but did not with that of the region of YDR038c. The expression level of mRNA in S. cerevisiae KNU5377 and S288C was also compared: the 550 ORFs of S. cerevisiae KNU5377 showed more than two-fold higher intensity than those of S. cerevisiae S288C. Among the 550 ORFs, 59 ORFs belonged to the groups of ribosomal proteins and mitochondrial ribosomal proteins, and 200 ORFs belonged to the group of cellular organization. DIP5 and GAP1 were the most highly expressed genes. These results suggest that upregulated DIP5 and GAP 1 might take the place of ASP3 and, additionally, the sensitivity against copper might be contributable to the lowest expression level of copper-binding metallothioneins encoded by CUP 1a (YHR053c) and CUP1b (YHR055c) in S. cerevisiae KNU5377.

와이어 하네스의 커텍터 압착공정에 대한 3차원 유한요소해석 (3D FEM simulation for connector crimping process of wire harness)

  • 구선모;윤철호;박진기;최현순;김영석
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 추계학술대회 논문집
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    • pp.245-249
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    • 2009
  • According to the increase of intelligent vehicles many automotive electric components are installed. The wire harness which connects those also increases. The crimping process for compressing the copper wire bundle into the terminal is a key process to assure the good quality of wire harness. For the case of inadequate forming condition many shape failures such as less-filling, over-filling are happen in the crimping process. Even though the quality of crimping shape is satisfactory the quality check for electrical resistance of wire harness is sometime not satisfied the qualification due to large variation of electrical resistance of wire harness under climate test. This large variation is thought to be related with the malfunction automotive electric system and caused by the internal stress of wire, which occurred during the crimping process. In this paper we develop the 3D-FEM simulation scheme and design methodology of optimum terminal shape. Also the effect of terminal shape on the residual stress is discussed.

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고강도강 맞대기 용접 시험편의 루트갭 변경에 따른 피로강도 평가 (Fatigue Assessment of High Strength Steel with Butt Welded Joints for the Root Gap Difference)

  • 김호정;강성원;김명현
    • 대한조선학회논문집
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    • 제48권1호
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    • pp.56-61
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    • 2011
  • In this study, a series of fatigue tests was conducted to evaluate fatigue strength for the root gap difference with high strength steel with butt welded joints. A finite element analysis using effective notch stress method was also performed to compare effective notch factors each other with butt welded specimens made by copper backing. The results of fatigue tests were classified according to the root gap difference. Fatigue life of butt welded specimens is presented for determining the root gap of high strength steel with butt welded joints in terms of fatigue strength. Then effective notch stress was applied to interpret fatigue strength of butt welded specimen model which is reflected actual measured dimensions. As a result, fatigue strength of high strength steel with butt welded specimens is increased by root gap gets longer in length.

Effects of Selenium, Copper and Magnesium on Antioxidant Enzymes and Lipid Peroxidation in Bovine Fluorosis

  • Han, Bo;Yoon, Soonseek;Su, Jingliang;Han, H.R.;Wang, Mei;Qu, Weijie;Zhong, Daibin
    • Asian-Australasian Journal of Animal Sciences
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    • 제17권12호
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    • pp.1695-1699
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    • 2004
  • The antioxidant enzymes, lipid peroxidation and free radicals assessment were made of the effects of selenium, copper and magnesium on bovine endemic fluorosis under high fluoride, low selenium and low copper productive conditions. Thirty-two beef cattle were selected from high fluoride area, and randomly divided into four groups with eight cattle each as follows: (1) high fluoride control group (HFC); (2) supplemented group with 0.25 mg/kg selenium (HFSe); (3) supplemented group with 15 mg/kg copper (HFCu) and (4) supplemented group with 0.25 mg/kg selenium+15 mg/kg copper+1 mg/kg magnesium (HFSeCuMg) per day for 83 days. Moreover, eight beef cattle were selected from non-high fluoride area as normal control group. Blood samples were collected from cattle on 0 d, 30 d and 83 d respectively, to analyze the enzyme activities and concentration of GSH-px, CAT, SOD, MDA and free radicals. The results showed that the contents of free radicals and MDA in HFC group were significantly higher, and the whole blood GSH-px, CAT, erythrocyte SOD activities were lower than the normal control group. Free radicals, metabolic imbalance and antioxidant disorder therefore, play an important role in fluorosis. However, GSH-px, CAT and SOD activities in HFSe group and HFSeCuMg group at 30 d and 83 d were markedly higher than the same groups at the 0 d and the HFC group at the same time. Likewise, there was a corresponding reduction in the contents of free radicals and MDA. These findings indicated that supplementation with selenium, copper and magnesium elevated high fluoride bovine antioxidant enzymes, and decreased MDA and free radicals contents. But, the activities of supplementation selenium group did not increase until day 83. These results demonstrated that fluorosis was associated with lower serum Se and Cu levels than in the control, and it was therefore concluded that fluorosis is associated with decreased serum levels of these minerals. Long-term high fluoride intake under productive condition enhances oxidative stress in the blood, thereby disturbing the antioxidant defense of cattle. Increased oxidative stress could be one of the mediating factors in the pathogenesis of toxic manifestations of fluoride. It is benefical for high fluoride cattle supplemented with proper selenium, copper and magnesium to increase fluoride excretion and obtain the protective impact of the activity of oxidative enzymes, and to decrease lipid peroxidation and free radicals contents.

$Nos\acute{e}-Poincar\acute{e}$ 분자 동역학 알고리즘을 이용한 나노 와이어의 역학적 거동 해석 (Analysis of Mechanical Behavior of Nanowire by $Nos\acute{e}-Poincar\acute{e}$ Molecular Dynamics Simulation)

  • 이병용;조맹효
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.506-511
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    • 2007
  • Mechanical behavior of copper nanowire is investigated. An FCC nanowire model composed of 1,408 atoms is used for MD simulation. Simulations are performed within NVT ensemble setting without periodic boundary conditions. $Nos\acute{e}-Poincar\acute{e}$ MD algorithm is employed to guarantee preservation of Hamiltonian and temperature. Numerical tensile tests of Nanowire are carried out with constant strain rate. Additionally, temperature and strain rate effects are considered. Stress-strain curve is constructed from the calculated Cauchy stresses and specified strain values. In (22,4,4) Copper nanowire, non-linear behavior appears around ${\epsilon}\simeq0.09.$ At this instance, starting of structural reorientations are observed. At the onset of reorientation, the modulus characteristics are also investigated.

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알루미늄 판막과 유리섬유를 합지한 구리방근시트와 폐타이어 용융액상 도막방수재를 이용한 옥상녹화 복합방수공법 (Compound waterproofing method of green roof using copper barrier sheet and recycled tire melting liquid waterproofing material that reinforced treatments are valve and glass fiber mesh.)

  • 김영찬;조일규;최성민;김영찬
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2008년도 추계 학술논문 발표대회
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    • pp.173-178
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    • 2008
  • This is green roof bottom system which composed by aluminum valve and glass fiber together as major reinforcement, so the cooper sheet can have root proof, and using recycled tire gel-type membrane waterproofing system which dost not contains VOCs. The copper sheet reduce the plants' root growing, so it helpes to maintain the waterproofing layer and stability of root proofing. Gel type membrane waterproofing system can do waterproofing, stress dispersion, and reducing leakage expansion. So those two materials can help each other to make green roof bottom layer would have the stability and durability.

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무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰 (Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier)

  • 이창면;전준미;허진영;이홍기
    • 한국표면공학회지
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    • 제47권4호
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    • pp.162-167
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    • 2014
  • The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.

펄스전착법과 첨가제를 사용하여 전착된 ULSI배선용 구리박막의 특성 (Characteristics of Copper Film Fabricated by Pulsed Electrodeposition with Additives for ULSI Interconnection)

  • 이경우;양성훈;이석형;신창희;박종완
    • 전기화학회지
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    • 제2권4호
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    • pp.237-241
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    • 1999
  • 펄스전착법에 의한 구리박막의 특성과 via hole 충진 특성을 연구하였다. 특히 구리박막의 특성에 미치는 첨가제의 영향을 중점적으로 다루었다. 펄스 전류와 첨가제를 사용하여 전착한 구리박막은 83.4 MPa이하의 낮은 인장응력을 가졌으며 높은 Cu (111) 우선 배향성을 나타냈다. Superfilling에 의해 최고 $0.25{\mu}m, 6: 1$ 정도의 고 종횡비를 가지는 via hole에 결함 없이 성공적으로 충진할 수 있었으며 미세 구조를 관찰한 결과 쌍정에 의한 변형이 일어났음을 알 수 있었다. $500^{\circ}C$에서 1시간 동안 진공열처리를 했을 경우 두께의 $1\~2$배에 달하는 결정립을 가지는 bamboo구조를 나타냈으며 이때 전기비저항은 $1.8\~2.0{\mu}{\Omega}{\cdot}cm$을 나타냈다.