• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

• 한국환경과학회지
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• 제19권9호
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• pp.1119-1127
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• 2010

The behavior of copper throughout the whole process of wastewater treatment plant that uses the activated sludge process to treat the wastewater of petrochemical industry that contains low concentration of copper was investigated. Total inflow rate of wastewater that flows into the aeration tank was $697\;m^3$/day with 0.369 mg/L of copper concentration, that is, total copper influx was 257.2 g/day. The ranges of copper concentrations of the influent to the aeration tank and effluent from the one were 0.315 ~ 0.398 mg/L and 0.159 ~ 0.192 mg/L, respectively. The average removal rate of copper in the aeration tank was 50.8 %. The bioconcentration factor (BCF) of copper by microbes in the aeration tank was 3,320. The accumulated removal rate of copper throughout the activated sludge process was 71.3%, showing a high removal ratio by physical and chemical reactions in addition to biosorption by microbes. The concentration of copper in the solid dehydrated by filter press ranged from 74.8 mg/kg to 77.2 mg/kg and the concentration of copper by elution test of waste was 2.690 ~ 2.920 mg/L. It was judged that the copper concentration in dehydrated solid by bioconcentration could be managed with the control of that in the influent.

• International Journal of Quality Innovation
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• 제2권2호
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• 한국주조공학회지
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• 제25권6호
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• 한국분말재료학회지
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• 제16권5호
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• pp.351-357
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• 2009

A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.55-60
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• 2020

최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• 한국분말재료학회지
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• 제19권6호
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• pp.405-411
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• 2012

Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Journal of Advanced Marine Engineering and Technology
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• 제34권2호
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• pp.303-309
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• 2010

유한요소법을 통하여 유성압연기(planetary rolling mill)에 의한 동관 압연공정을 연구하였다. 이 압연은 3개의 롤에 의해 만네스만 공법으로 동관을 성형하는 공정이고, 냉간가공으로 시작하여 열간가공으로 종료되며, 기존의 압출방식에 비해 공정의 단축과 원가 절감의 장점을 갖고 있다. 압연공정은 다양하고 복합적인 공정변수 들을 포함하고 있고, 각각의 변수들은 성형결과에 영향을 미친다. 그러므로 동관압연의 모든 공정변수가 고려되어져야 한다. 동관 압연공정은 성공적으로 시뮬레이션 되었고 최적의 압연조건을 결정하는데 유용할 것이다.