• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.295-296
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• 2006

High hardness of P/M parts can be obtained in the cooling section of the sintering furnace by using sinter hardenable materials, thus the post-sintering heat treatment can be eliminated. However, the sinter hardened materials would have difficulties in secondary machining if it is required, which will limit the applications of sinter hardenable materials in the machined parts. Recent development in warm compaction technology can enable us not only to achieve the high green density up to $7.4\;g/cm^3$, but also the high green strength which is needed for green machining. Therefore by using warm compaction technology, the green machining can be applied to sinter hardenable materials for the high density, strength and hardness P/M parts. In the present study, a pre-alloyed steel powder, ATOMET4601, was used by mixing with 2.0% copper, 1.0% nickel, 0.9% graphite and a proprietary lubricant using a binder treatment process - FLOMET. The specimens were compacted and green machined with different machining parameters. The machined surface finish and part integrity were evaluated in selecting the optimal conditions for green machining. The possibility of applying the green machining to the high-density structural parts was explored.

• Journal of Powder Materials
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• v.8 no.4
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• pp.245-252
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• 2001

Recent remarkable progress in the semiconductor industry has promoted smaller size of semiconductor chips and increased amounts of heat generation. So, the demand for a substrate material to meet both the characteristics of thermal expansion coefficient and heat radiation has been on the increase. Under such conditions, tungsten(W)-copper(Cu) has been proposed as materials to meet both of the above characteristics. In the present study, the W-10wt.%Cu powders were synthesised by the mixing and hydrogen reduction of the starting mixture materials such as W-Cu, $W-CuCl_2$and $WO_3-CuCl_2$ in order to obtain the full densification. The W-10wt.%Cu produced by hydrogen reduction showed the higher interparticle friction than the simple mixed W-10wt%Cu because of the W agglomerates. In the dilatometric analysis the W-10wt.%Cu prepared from the $W-CuCl_2$was largely shrank by heating up $1400^{\circ}C$ at the constant heating rate of $5^{\circ}C$/min. The possibility of application of metal injection molding (MIM) was also investigated for mass production of the complex shaped W-Cu parts in semiconductor devices. The relationship between the temperature of molding die and the pressure of injection molding was analyzed and the heating up stage of 120-$290^{\circ}C$ in the debinding process was controlled for the most suitable MIM condition.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.464-465
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• 2006

Monodispersed and nano-sized Cu powders were synthesized from copper sulfate pentahydrate $(CuSO_4{\cdot}5H_2O)$ inside a nonionic polymer matrix by using wet chemical reduction process. The sucrose was used as a nonionic polymer network source. The influences of a nonionic polymer matrix on the particle size of the prepared Cu powders were characterized by means of X-ray diffraction), scanning electron microscopy), and particle size analysis). The smallen Cu powders with size of approximately 100 nm was obtained with adding of 0.04M sucrose at reaction temperature of $60\;^{\circ}C$. The particle size of the Cu powders prepared by the reduction inside polymer network was strongly dependent of the sucrose content and reaction temperature.

• Journal of Powder Materials
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• v.20 no.2
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• pp.114-119
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• 2013

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1205-1206
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• 2006

Dispersion-strengthened copper with $TiB_2$ was produced by ball-milling and spark plasma sintering (SPS).Ball-milling was performed at a rotation speed of 300rpm for 30 and 60min in Ar atmosphere by using a planetary ball mill (AGO-2). Spark-plasma sintering was carried out at $650^{\circ}C$ for 5min under vacuum after mechanical alloying. The hardness of the specimens sintered using powder ball milled for 60min at 300rpm increased from 16.0 to 61.8 HRB than that of specimen using powder mixed with a turbular mixer, while the electrical conductivity varied from 93.40% to 83.34%IACS. In the case of milled powder, hardness increased as milling time increased, while the electrical conductivity decreased. On the other hand, hardness decreased with increasing sintering temperature, but the electrical conductiviey increased slightly

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1097-1102
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• 2010

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

• Journal of Powder Materials
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• v.27 no.1
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• pp.25-30
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• 2020

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m^-1K^-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10^-6 to 3.06 × 10^-6K^-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

• Journal of Powder Materials
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• v.25 no.2
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• pp.158-164
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• 2018

Multi-walled carbon nanotube (MWCNT)-copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT-Cu composites. The electrical conductivities of MWCNT-Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT-Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.

• Membrane and Water Treatment
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• v.9 no.2
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• pp.95-104
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• 2018

Copper pollution around the world has caused serious public health problems recently. The heavy metal adsorption on traditional membranes from wastewater is limited by material properties. Different adsorptive materials are embedded in the membrane matrix and act as the adsorbent for the heavy metal. The carbonized leaf powder has been proven as an effective adsorbent material in removing aqueous Cu(II) because of its relative high specific surface area and inherent beneficial groups such as amine, carboxyl and phosphate after carbonization process. Factors affecting the adsorption of Cu(II) include: adsorbent dosage, initial Cu(II) concentration, solution pH, temperature and duration. The kinetics data fit well with the pseudo-first order kinetics and the pseudo-second order kinetics model. The thermodynamic behavior reveals the endothermic and spontaneous nature of the adsorption. The adsorption isotherm curve fits Sips model well, and the adsorption capacity was determined at 61.77 mg/g. Based on D-R model, the adsorption was predominated by the form of physical adsorption under lower temperatures, while the increased temperature motivated the form of chemical adsorption such as ion-exchange reaction. According to the analysis towards the mechanism, the chemical adsorption process occurs mainly among amine, carbonate, phosphate and copper ions or other surface adsorption. This hypothesis is confirmed by FT-IR test and XRD spectra as well as the predicted parameters calculated based on D-R model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.6015-6022
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• 2013

It has been known that there are large amount of nitric acid and valuable metals, copper in the plating waste solution of automobile wheel. As nitric acid and valuable metals are high price and toxic, they should be recovered for economics and environment. Plating waste was extracted with TBP diluted with kerosene. The concentration of nitric acid in aqueous phase was analyzed by titration method by NaOH solution (0.1~1.0N) and the amount of metals by ICP-MS and ICP-AES. The concentration of copper in plating waste were 76,850 mg/L. The concentration of nitric acid in plating waste was 1.02 M. After three step extraction was performed with 50% TBP, each organic phase was stripped three times with distilled water to obtain 48.1% of nitric acid. Purity of final nitric acid was over 99.9% by ICP analysis. After recovery of nitric acid, copper was extracted with various solvent extractors like PC 88A, D2EPHA, LIX 84 and ISE 106. Among these extractors, 92% of copper was recovered by ISE 106 after 1st extraction and 30% $H_2SO_4$ stripping. Copper ion was reduced with $N_2H_4$ to make metal powders, respectively.