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http://dx.doi.org/10.4150/KPMI.2013.20.2.114

Direct Bonding of Cu/AlN using Cu-Cu2O Eutectic Liquid  

Hong, Junsung (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Lee, Jung-Hoon (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Oh, You-Na (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Cho, Kwang-Jun (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Riu, Doh-Hyung (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Oh, Sung-Tag (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Hyun, Chang-Yong (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of Powder Materials / v.20, no.2, 2013 , pp. 114-119 More about this Journal
Abstract
In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.
Keywords
Direct bonding of Cu and AlN; Cu-oxides bed; Heat treatment; Microstructure;
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