• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.124.1-124.1
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• 2016

In this work, uniform thickness and good adhesion of electrodeposited copper layer were achieved on AZ91 Mg alloy in alkaline noncyanide copper solution containing pyrophosphate ion by employing appropriate zincate pretreatment. Without zincate pretreatment, the electrodeposited copper layer on AZ91 Mg alloy was porous and showed poor adhesion which was explained by small number of nucleation sites of copper due to rapid dissolution of the magnesium substrate in the pyrophosphate solution. The zincate pretreatment was found as one of the most important steps that can form a conducting layer to cover AZ91 surface which decreased the dissolution rate of AZ91 Mg alloy about 40 times in the copper pyrophosphate solution. Electrodeposited copper layer on AZ91 Mg alloy after an appropriate zincate pretreatment showed good adhesion and uniform thickness with bright surface appearance, independent of the deposition time but the surface roughness of the electrodeposited copper layer increased with increasing Cu deposition time.

• Journal of the Korean institute of surface engineering
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• v.49 no.5
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• pp.401-407
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• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.6.2-8
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• 1996

The NO$_2$ GAS-detection characteristic of CuTBT (Copper-tetra-tert-butylphtha1ocyanine) LB films were investigated through a study of current-voltage (I-V) characteristics with a variation of number N of interdigital electrodes (N=1∼25). A concentration of 200ppm NO$_2$ gas was used. It was found that a conductance G increases monotonically as the number of interdigital electrode increases, and a sensitivity $\Delta$G ($\Delta$G=G$\_$gas//G$\_$air/) is at least higher than 50 and stable. As far as a sensitivity is concerned, the sensitivity when N=26 is greater than that when N=1 by 70 or so. It indicates that the number of interdigital electrodes affects the currents, sensitivity and stability.

• Journal of the Korean Chemical Society
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• v.60 no.5
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• pp.317-320
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• 2016

Efficient copper removal from water was achieved by using surface modified silica spheres with 3-mercaptopropyltrimethoxysilane (MPTMS) using base catalyst. The surface modification of silica spheres was performed by hydrolysis and condensation reactions of the MPTMS. The characteristic infrared absorption peaks at 2929, 1454, and 1343 cm⁻¹ represent the −CH₂ stretching vibration, asymmetric deformation, and deformation, respectively. The absorption peaks at 2580 and 693 cm⁻¹ corresponding the −SH stretching vibration and the C-S stretching vibration indicate the incorporation of MPTMS to the surface of silica spheres. Field emission scanning electron microscope (FESEM) image of the surface modified silica sphere (SMSS) shows nano-particles of MPTMS on the surface of silica spheres. High concentration of copper solution (1000 ppm) was used to test the copper removal efficiency and uptake capacity. The FESEM image of SMSS treated with the copper solution shows large number of copper lumps on the surface of SMSS. The copper concentration drastically decreased with increasing the amount of SMSS. The residual copper concentrations were analyzed using inductively coupled plasma mass spectrometer. The copper removal efficiency and uptake capacity with 1000 ppm of copper solution were 99.99 % and 125 mg/g, respectively.

• Advances in materials Research
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• v.4 no.3
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• pp.165-178
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• 2015

Friction coefficient of epoxy metal matrix composites were investigated. The main objective was to increase the friction coefficient through rubber sole sliding against the epoxy floor coating providing appropriate level of resistance. This was to avoid the excessive movement and slip accidents. Epoxy metal matrix composites were reinforced by different copper wire diameters. The epoxy metal matrix composites were experimentally conducted at different conditions namely dry, water and detergent wetted sliding, were the friction coefficient increased as the number of wires increased. When the wires were closer to the sliding surface, the friction coefficient was found to increase. The friction coefficient was found to increase with the increase of the copper wire diameter in epoxy metal matrix composites. This behavior was attributed to the fact that as the diameter and the number of wires increased, the intensity of the electric field, generated from electric static charge increased causing an adhesion increase between the two sliding surfaces. At water wetted sliding conditions, the effect of changing number of wires on friction coefficient was less than the effect of wire diameter. The presence of water and detergent on the sliding surfaces decreased friction coefficient compared to the dry sliding. When the surfaces were detergent wetted, the friction coefficient values were found to be lower than that observed when sliding in water or dry condition.

• Journal of Magnetics
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• v.22 no.2
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• pp.181-187
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• 2017

Flow of electrically conducting nanofluids is of pivotal importance in countless industrial and medical appliances. Fluctuations in thermophysical properties of such fluids due to variations in temperature have not received due attention in the available literature. Present investigation aims to fill this void by analyzing the flow of copper-water nanofluid with temperature dependent viscosity past a Riga plate. Strong wall suction and viscous dissipation have also been taken into account. Numerical solutions for the resulting nonlinear system have been obtained. Results are presented in the graphical and tabular format in order to facilitate the physical analysis. An estimated expression for skin friction coefficient and Nusselt number are obtained by performing linear regression on numerical data for embedded parameters. Results indicate that the temperature dependent viscosity alters the velocity as well as the temperature of the nanofluid and is of considerable importance in the processes where high accuracy is desired. Addition of copper nanoparticles makes the momentum boundary layer thinner whereas viscosity parameter does not affect the boundary layer thickness. Moreover, the regression expressions indicate that magnitude of rate of change in effective skin friction coefficient and Nusselt number with respect to nanoparticles volume fraction is prominent when compared with the rate of change with variable viscosity parameter and modified Hartmann number.

• Journal of The Korean Society of Grassland and Forage Science
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• v.20 no.4
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• pp.259-264
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• 2000

This study was conducted to investigate the effects of copper in the efficiencies of callus formation and plant regeneration of orchardgrass (Dactylis glomarata L.). Seeds were cultured on MS medium containing $2\;mg/{\ell}$ 2,4-D and different concentrations ($0.1-100\;{\mu}mol$) of copper sulfate. Plant regeneration was achieved on N6 medium containing $1\;mg/{\ell}$ NAA, $5\;mg/{\ell}$ kinetin and $0.1-100\;{\mu}mol$ of copper sulfate. Callus formation was not affected by copper incorporation into MS medium. However, the efficiency of plant regeneration was promoted by copper and the maximum efficiency was obtained when $70\;{\mu}mol$ copper was incorporated in the culture medium. The average number of regenerated plants from the seed-derived callus was also increased by copper.

• Journal of Powder Materials
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• v.17 no.4
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• pp.276-280
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• 2010

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

• Journal of Electrical Engineering and Technology
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• v.12 no.2
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• pp.865-873
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• 2017

Converter transformer is the key equipment of high voltage direct current transmission system. The solid suspending particles originating from the process of installation and operation of converter transformer have significant influence on the insulation performance of transformer oil, especially in presence of DC component in applied voltage. Under high electric field, the particles easily lead to partial discharge and breakdown of insulating oil. This paper investigated copper particle effect on the breakdown voltage of transformer oil at combined AC and DC voltage. A simulation model with single copper particle was established to interpret the particle effect on the breakdown strength of insulating oil. The experimental and simulation results showed that the particles distort the electric field. The breakdown voltage of insulating oil contaminated with copper particle decreases with the increase of particle number, and the breakdown voltage and the logarithm of particle number approximately satisfy the linear relationship. With the increase of the DC component in applied voltage, the breakdown voltage of contaminated insulating oil decreases. The simulation results show that the particle collides with the electrode more frequently with more DC component contained in the applied voltage, which will trigger more discharge and decrease the breakdown voltage of insulating oil.

• Mycobiology
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• v.34 no.4
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• pp.214-218
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• 2006

Four copper(II) complexes have been prepared using macrocyclic ligands. The macrocyclic ligands have been synthesized by the condensation reaction of diethyl phthalate with Schiff bases derived from o-phenylene diamine and Knoevenagel condensed ${\beta}-ketoanilides$ (obtained by the condensation of acetoacetanilide and substituted benzaldehydes). The ligands and copper complexes have been characterized on the basis of Microanalytical, Mass, UV-Vis., IR and CV spectral studies, as well as conductivity data. On the basis of spectral studies, a square-planar geometry for the copper complexes has been proposed. The in vitro antifungal activities of the compounds were tested against fungi such as Aspergillus niger, Rhizopus stolonifer, Aspergillus flavus, Rhizoctonia bataicola and Candida albicans. All the synthesized copper complexes showed stronger antifungal activities than free ligands. The minimum inhibitory concentrations (MIC) of the copper complexes were found in the range of $8{\sim}28\;{\mu}g/ml$. These compounds represent a novel class of metal-based antifungal agents which provide opportunities for a large number of synthetic variations for modulation of the activities.