• Journal of Electrochemical Science and Technology
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• v.13 no.3
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• pp.362-368
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• 2022

The application of polymer composite electrolyte in all-solid-state lithium-sulfur battery (ASSLSBs) can guarantee high energy density and improve the interface contact between electrolyte and electrode, which has a broader application prospect. However, the inherent insulation of the sulfur-cathode leads to a low electron/ion transfer rate. Carbon materials with high electronic conductivity and electrolyte materials with high ionic conductivity are usually selected to improve the electron/ion conduction of the composite cathode. In this work, PEO-LiTFSI-LLZO composite polymer electrolyte (CPE) with high ionic conductivity was prepared. The ionic conductivity was 1.16×10^-4 and 7.26×10^-4 S cm^-1 at 20 and 60℃, respectively. Meanwhile, the composite sulfur cathode was prepared with Sulfur, reduced graphene oxide and composite polymer electrolyte slurry (S-rGO-CPEs). In addition to improving the ion conductivity in the cathode, CPEs also replaces the role of binder. The influence of different contents of CPEs in the cathode material on the performance of the constructed battery was investigated. The results show that the electrochemical performance of the all-solid-state lithium-sulfur battery is the best when the content of the composite electrolyte in the cathode is 40%. Under the condition of 0.2C and 45℃, the charging and discharging capacity of the first cycle is 923 mAh g^-1, and the retention capacity is 653 mAh g^-1 after 50 cycles.

• Advances in nano research
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• v.14 no.4
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• pp.363-373
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• 2023

A novel type of steel fiber with a rounded-end shape is presented to improve the bonding behavior of fibers with Carbon Nanotubes (CNT)-reinforced Ultra-High Performance Concrete (UHPC) matrix. For this purpose, by performing a parametric study and using the nonlinear finite element method, the impact of geometric characteristics of the fiber end on its bonding behavior with UHPC has been studied. The cohesive zone model investigates the interface between the fibers and the cement matrix. The mechanical properties of the cohesive zone model are determined by calibrating the finite element results and the experimental fiber pull-out test. Also, the results are evaluated with the straight steel fibers outcomes. Using the novel presented fibers, the bond strength has significantly improved compared to the straight steel fibers. The new proposed fibers increase bond strength by 1.1 times for the same diameter of fibers. By creating fillet at the contact area between the rounded end and the fiber, bond strength is significantly improved, the maximum fiber capacity is reachable, and the pull-out occurs in the form of fracture and tearing of the fibers, which is the most desirable bonding mode for fibers. This also improves the energy absorbed by the fibers and is 4.4 times more than the corresponding straight fibers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.3
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• pp.233-240
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• 2023

p-type Tunnel Oxide Passivating Contacts (TOPCon) solar cell is fabricated with a poly-Si/SiO_x structure. It simultaneously achieves surface passivation and enhances the carriers' selective collection, which is a promising technology for conventional solar cells. The quality of passivation is depended on the quality of the tunnel oxide layer at the interface with the c-Si wafer, which is affected by the bond of SiO formed during the subsequent annealing process. The highest cell efficiency reported to date for the laboratory scale has increased to 26.1%, fabricated by the Institute for Solar Energy Research. The cells used a p-type float zone silicon with an interdigitated back contact (IBC) structure that fabricates poly-Si and SiO_x layer achieves the highest implied open-circuit voltage (iV_oc) is 750 mV, and the highest level of edge passivation is 40%. This review presents an overview of p-type TOPCon technologies, including the ultra-thin silicon oxide layer (SiO_x) and poly-silicon layer (poly-Si), as well as the advancement of the SiO_x and poly-Si layers. Subsequently, the limitations of improving efficiency are discussed in detail. Consequently, it is expected to provide a basis for the simplification of industrial mass production.

• Computers and Concrete
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• v.31 no.5
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• pp.385-394
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• 2023

Displacement is an important element for evaluating the stability and failure mechanism of hydraulic structures. Digital image correlation (DIC) is a useful technique to measure a three-dimensional displacement field using two cameras without any contact with test material. The objective of this study is to evaluate the behavior of stacked geotextile tubes using the DIC technique. Geotextile tubes are stacked to build a small-scale temporary dam model to exclude water from a specific area. The horizontal and vertical displacements of four stacked geotextile tubes are monitored using a dual camera system according to the upstream water level. The geotextile tubes are prepared with two different fill materials. For each dam model, the interface layers between upper and lower geotextile tubes are either unreinforced or reinforced with a cementitious binder. The displacement of stacked geotextile tubes is measured to analyze the behavior of geotextile tubes. Experimental results show that as upstream water level increases, horizontal and vertical displacements at each layer of geotextile tubes initially increase with water level, and then remain almost constant until the subsequent water level. The displacement of stacked geotextile tubes depends on the type of fill material and interfacial reinforcement with a cementitious binder. Thus, the proposed DIC technique can be effectively used to evaluate the behavior of a hydraulic structure, which consists of geotextile tubes.

• Journal of Electrochemical Science and Technology
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• v.14 no.1
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• pp.85-95
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• 2023

In recent years, solid-state Li metal batteries (SSLBs) have attracted significant attention as the next-generation batteries with high energy and power densities. However, uncontrolled dendrite growth and the resulting pulverization of Li during repeated plating/stripping processes must be addressed for practical applications. Herein, we report a plastic-crystal-based polymer/ceramic composite solid electrolyte (PCCE) to resolve these issues. To fabricate the one-side ceramic-incorporated PCCE (CI-PCCE) film, a mixed precursor solution comprising plastic-crystal-based polymer (succinonitrile, SN) with garnet-structured ceramic (Li₇La₃Zr₂O₁₂, LLZO) particles was infused into a thin cellulose membrane, which was used as a mechanical framework, and subsequently solidified by using UV-irradiation. The CI-PCCE exhibited good flexibility and a high room-temperature ionic conductivity of over 10^-3 S cm^-1. The Li symmetric cell assembled with CI-PCCE provided enhanced durability against Li dendrite penetration through the solid electrolyte (SE) layer than those with LLZO-free PCCEs and exhibited long-term cycling stability (over 200 h) for Li plating/stripping. The enhanced Li⁺ transference number and lower interfacial resistance of CI-PCCE indicate that the ceramic-polymer composite layer in contact with the Li anode enabled the uniform distribution of Li⁺ flux at the interface between the Li metal and CI-PCCE, thereby promoting uniform Li plating/stripping. Consequently, the Li//LiFePO₄ (LFP) full cell constructed with CI-PCCE demonstrated superior rate capability (~120 mAh g^-1 at 2 C) and stable cycle performance (80% after 100 cycles) than those with ceramic-free PCCE.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Korean Journal of Optics and Photonics
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• v.18 no.6
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• pp.452-460
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• 2007

Ultra-low loss ZERODUR and fused silica mirrors were manufactured and their light scattering characteristics were investigated. For this purpose, ZERODUR and fused silica substrates were super-polished by the bowl feed method. The surface roughness were 0.292 ${\AA}$ and 0.326 ${\AA}$ in rms for ZERODUR and fused silica, respectively. To obtain the high reflectivity, 22 thin film layers of $SiO_2$ and $Ta_2O_5$ were deposited by Ion Beam Sputtering. The measured light scattering of ZERODUR and fused silica mirror were 30.9 ppm and 4.6 ppm, respectively. This shows that the substrate surface roughness is not the only parameter which determines the light scattering of the mirror. In order to investigate the mechanism for additional light scattering of the ZERODUR mirror, the surface roughness of the mirror was measured by AFM and was found to be 2.3 times higher than that of the fused silica mirror. It is believed that there is some mismatch at the interface between the substrate and the first thin film layer which leads to the increased mirror surface roughness. To clarify this, the contact angle measurements were performed by SEO 300A, based on the Giriflaco-Good-Fowkes-Young method. The fused silica substrates with 0.46 ${\AA}$ in its physical surface roughness shows lower contact angle than that of the ZERODUR substrate with 0.31 ${\AA}$. This indicates that the thin film surface roughness is determined by not only its surface roughness but also the surface energy of the substrate, which depends on the chemical composition or crystalline orientation of the materials. The surface energy of each substrate was calculated from a contact angle measurement, and it shows that the higher the surface energy of the substrate, the better the surface roughness of the thin film.

• The KIPS Transactions:PartB
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• v.18B no.6
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• pp.333-340
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• 2011

The Human-Computer Interaction(HCI) is a study of the method for interaction between human and computers that merges the ergonomics and the information technology. The intelligent space, which is a part of the HCI, is an important area to provide effective user interface for the disabled, who are alienated from the information-oriented society. In the intelligent space for the disabled, the method supporting information depends on types of disability. In this paper, we only support the hearing-impaired. It is material to the gaze direction detection method because it is very efficient information provide method to present information on gazing direction point, except for the information provide location perception method through directly contact with the hearing-impaired. We proposed the gaze direction detection method must be necessary in order to provide the residence life application to the hearing-impaired like this. The proposed method detects the region of the user from multi-view camera images, generates candidates for directions of gaze for horizontal and vertical from each camera, and calculates the gaze direction of the user through the comparison with the size of each candidate. In experimental results, the proposed method showed high detection rate with gaze direction and foot sensing rate with user's position, and showed the performance possibility of the scenario for the disabled.

• Journal of the Korean Electrochemical Society
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• v.13 no.4
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• pp.256-263
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• 2010

A Crofer 22 APU mesh coated with a conductive ceramic material was developed as an alternative cathode current collector to Ag-based materials for solid oxide fuel cells. $(La_{0.80}Sr_{0.20})_{0.98}MnO_3$ (LSM) layer was deposited onto the Crofer mesh using a spray-coating technique, in an attempt to mitigate the degradation of electrical properties due to surface oxidation at high temperatures. The oxidation experiments at $800^{\circ}C$ in air indicated that the areaspecific resistance (ASR) of the LSM-coated Crofer mesh was strongly dependent on the wire diameter and the contact morphology between mesh and cell. In addition, the post-heat-treatment in $H_2/N_2$ resulted in a reduced thickness of Cr-containing oxide scales at the interface between Crofer mesh and LSM layer, leading to a decreased ASR.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.