• Nuclear Engineering and Technology
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• v.54 no.8
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• pp.2989-2998
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• 2022

Line contact structures, such as the contact between graphite brick and graphite tenon, widely exist in high-temperature gas-cooled reactors. Due to the stress concentration effect, the line contact area is one of the dangerous positions prone to failure in the nuclear reactor core. In this paper, the failure mechanism of line contact structures composed of IG11 nuclear graphite column and brick were investigated by means of experiment and finite element simulation. It was found that the failure process mainly includes three stages: firstly, the damage accumulation in nuclear graphite material led to the characteristic yielding of the line contact structure, but no macroscopic failure can be observed at this stage; secondly, the stresses near the contact area met Mohr failure criterion, and a crack initiated and propagated laterally in the contact zone, that is, local macroscopic failure occurred at this stage; finally, a second crack initiated in the contact area and developed in to a Y-shape, resulting in the final failure of the structure. This study lays a foundation for the structural design and safety assessment of high-temperature gas-cooled reactors.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1068-1073
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• 2003

Method for contact failure mitigation is studied in this paper. The focus is laid on the contact shape that eventually influences the internal stresses. Contact mechanics is consulted within the frame of plane problem. Hertzian contact, rounded punch and uniform traction profiles are considered. Frictional as well as frictionless contact is also considered. As results, the higher traction profile induced by the rounded punch reveals the greatest among the considered shapes. Therefore, it is suggested to increase the edge radius as large as possible if a contact body of punch shape needs to be designed. It is also found that uniform traction cannot always provide the solution of contact failure mitigation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.34-40
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• 2012

We have developed a highly sensitive inspection technique based on an electron beam inspection for detecting the contact failure of a poly-Si plugged layer. It was difficult to distinguish the contact failure from normal landing plugs with high impedance. Normally, the thermal annealing method has been used to decrease the impedance of poly-Si plugs and this method increases the difference of charged characteristics and voltage contrast. However, the additional process made the loss of time and broke down the device characteristics. Here, the interval scanning method without thermal annealing was effectively applied to enhance the difference of surface voltage between well-contacted poly-Si plugs and incomplete contact plugs. It is extremely useful to detect the contact failures of non-annealed plug contacts with high impedance.

• KSTLE International Journal
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• v.2 no.2
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• pp.85-92
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• 2001

The variation of contact traction induced by different contact shapes is studied experimentally and theoretically. Considerations fer the contact shape are rounded, truncated and truncated with rounding punches. A fretting wear experiment is conducted with the contact configuration of the strip on the tube specimens. The strip specimen is pressed to form the end profile of a rounded and truncated with rounding punches shape. Wear on the tube is investigated, which is regarded as the slip region of the contact surface. Taken into consideration is the general solution of the normal traction in the case of the indentation by a punch with its end profile of the combination of parabolas. Then, partial slip solution is obtained numerically, which is compared with the wear on the tube. The radius of the rounding and the obliquity of the edge truncation affect the tractions considerably. It is found that the proper choice of the end profile can restrain the contact-induced failure such aswear.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.4
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• pp.191-201
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• 2014

The gear was made of SNC815 case-carburized, quench hardened and tempered steel. The gears were failed far earlier than the expected service life used in the industrial site. Causes of the failed gear were analyzed by microstructure observation. By the SEM and micro structure examinations, the damaged surfaces had been weared and failed by fatigue. Through microscope observation on the damaged surface, it was found that the cause of failure was determined by external overloading and the initial stage of the damage was closely related to complex contact fatigue failure. The overload and contact fatigue contributed to the early failure cause.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1361-1366
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• 2008

Failure mechanism of the poor contact is analyzed on the basis of used connectors and this poor contact of connectors is reappeared by the new forced fretting wear method. As the result of failure analysis and reappearance, fretting wear and corrosion of the contact interface causes the contact resistance degradation and the poor contact of connectors. The amount of degradation depends on the fretting stroke. Changes in contact resistance of static contacts are likely to be small and gradual, while motions of contact interface may result in larger and discontinuous changes in resistance and voltage. This voltage drop by fretting motions is large enough to cause the distortion of sensor signal and mis-working of electric components.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.195-202
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• 2003

In this study, failure mechanisms of Au stud bumps/ACF flip chip joints were investigated underhigh current stressing condition. For the determination of allowable currents, I-V tests were performed on flip chip joints, and applied currents were measured as high as almost 4.2Amps $(4.42\times10^4\;Amp/cm^2)$. Degradation of flip chip joints was observed by in-situ monitoring of Au stud bumps-Al pads contact resistance. All failures, defined at infinite resistance, occurred at upward electron flow (from PCB pads to chip pads) applied bumps (UEB). However, failure did not occur at downward electron flow applied bumps (DEB). Only several $m\Omega$ contact resistance increased because of Au-Al intermetallic compound (IMC) growth. This polarity effect of Au stud bumps was different from that of solder bumps, and the mechanism was investigated by the calculation of chemical and electrical atomic flux. According to SEM and EDS results, major IMC phase was $Au_5Al_2$, and crack propagated along the interface between Au stud bump and IMC resulting in electrical failures at UEB. Therefore. failure mechanisms at Au stud bump/ACF flip chip Joint undo high current density condition are: 1) crack propagation, accompanied with Au-Al IMC growth. reduces contact area resulting in contact resistance increase; and 2) the polarity effect, depending on the direction of electrons. induces and accelerates the interfacial failure at UEBs.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.18-18
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• 1997

• Asia Marketing Journal
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• v.20 no.3
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• pp.83-103
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• 2018

The purpose of this research is to investigate the effect of customer-contact employees support on service recovery efforts. Service companies should try to prevent the service failure situation from occurring, but it is realistic that the service failure occurs due to the characteristics of the service. Service recovery efforts of service providers are important because effective responses to service failures can enhance customer satisfaction despite service failures. Social support for customer-contact employees needs to improve service recovery efforts. Specifically, this study focuses on the mediation roles of job burnout and customer orientation in relationship between social support for customer-contact employees and service recovery efforts. Social exchange theory was used as the theoretical underpinning of the research model. Based on reciprocity principle, this paper suppose that support for customer-contact employees and service recovery effort are a kind of social exchange relationship. Social supports for customer-contact employees are categorized into internal and external organization. Internal organization is POS(perceived organizational support) and external organization is customer support. The research model was tested with the data gathered from the flight attendants whose emotional labor intensity was relatively high and the service failure frequently occurred. As a result of analysis, social supports for customer-contact employees classified into organizational support, supervisor support, and customer support are found to have differential impacts on job burnout and customer orientation. It has been found that job burnout of service providers is negatively affecting service recovery efforts. On the other hand, customer orientation of service providers has a positive influence on service recovery efforts. Based on the results of the analysis, we provide practical implications for effective service recovery efforts in service failure situations, and suggest the theoretical implications to explain the process of service recovery effort. Finally, limitations of the study and directions for future research are suggested.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.389-395
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• 2001

To restrain contact failure, present study investigates the influence of edge machining of an indenter (punch). As for the edge machining, rounding, chamfering, and chamfering and rounding are considered. Contact mechanics is consulted to examine the traction profile and the size of the contact region which are directly influenced by the end profile of the indenter. The effect of rounding size (i.e., radius) in the case of the chamfering and rounding edge-indenter is studied. Shear traction is also evaluated within the regime of partial slip. Size of slip region and its expansion rate due to the increase of shear force are considered to investigate the shape effect of the indenter on contact failure.