• 폴리머
• /
• 제27권1호
• /
• pp.40-45
• /
• 2003

본 연구에서는 $Fe_3O_4$ (magnetite)의 함량 변화와 온도 변화가 NBR/$Fe_3O_4$ 혼합물의 전기걱도도 ($\sigma$)에 미치는 영향을 조사하였다. 최소 최적 혼합비 (percolation threshold, $P_c$) 개념이 본 연구에서 제조한 전도성 입자가 충전된 복합체에 적용되며, 혼합물내 $Fe_3O_4$의 농도가 22%를 초과할 때 $\sigma$가 급격히 증가함을 확인하였다. $\sigma$의 온도 의존성은 $P_c$ 또는 그 이하에서 열적으로 활성화되며, 마그네이트가 NBR 고무의 강화 및 전도성 충전제로서의 역할을 할 수 있음을 조사하였으며, 충전제 함량이 30 phr인 복합체는 실온에서 고전압을 걸어줄 경우 전류는 전압제곱에 비례한 것으로 나타났다. 또한, 50 pk의 마그네이트가 충전된 복합체가 최적의 물리적 가교점으로 인하여 가장 우수한 인장강도와 파단시 신장율을 보였으며 모듈러스가 마그네이트의 강화효과 및 혼합물의 토오크 곡선으로부터 얻은 점도와 관련이 있음을 확인하였다.

• Composites Research
• /
• 제31권6호
• /
• pp.355-364
• /
• 2018

Flexible energy-storage devices (FESDs) have been studied and developed extensively over the last few years because of demands in various fields. Since electrochemical performance and mechanical flexibility must be taken into account together, different framework from composition of conventional energy-storage devices (ESDs) is required. Numerous types of electrodes have been proposed to implement the FESDs. Herein, we review the works related to the FESDs so far and focus on free-standing electrodes and, especially substrate-based ones. The way to utilize carbon woven fabric (CF) or carbon cloth (CC) as flexible substrates is quite simple and intuitive. However, it is meaningful in the point of that the framework exploiting CF or CC can be extended to other applications resulting in multifunctional composites. Therefore, summary, which is on utilization of carbon-based material and conductive substrate containing CF and CC for ESDs, turns out to be helpful for other researchers to have crude concepts to get into energy-storage multi-functional composite. Moreover, polymer electrolytes are briefly explored as well because safety is one of the most important issues in FESDs and the electrolyte part mainly includes difficult obstacles to overcome. Lastly, we suggest some points that need to be further improved and studied for FESDs.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.9-15
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
• /
• 제7권1호
• /
• pp.41-49
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Elastomers and Composites
• /
• 제55권1호
• /
• pp.59-66
• /
• 2020

Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T₂) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

• 한국재료학회지
• /
• 제21권9호
• /
• pp.477-481
• /
• 2011

Composites of insulating polyethylene and carbon black are widely used in switching elements, conductive paint, and other applications due to the large gap of resistance value. This research addresses the critical exponent of dielectric breakdown strength of polymer matrix composites (PMC) made with carbon black and polyethylene below the percolation threshold (Pt) for the first time. Here, Pt means the volume fraction of carbon black of which the resistance of the PMC is transferred from its sharp decrease to gradual decrease in accordance with the increase of carbon-black-filled content. First, the Pt is determined based on the critical exponents of resistivity and relative permittivity. Although huge cohesive bodies of carbon black are formed in case of being less than the Pt, a percolation path connecting the conducting phases is not formed. The dielectric breakdown strength (Dbs) of the PMC below Pt is measured by using an impulse voltage in the range from 10 kV to 40 kV to avoid the effect of joule heating. Although the observed Dbs data seems to be well fitted to a straight line with a slope of 0.9 on a double logarithm of (Pt-$V_{CB}$) and Dbs, the least squares method gives a slope of 0.97 for the PMC. It has been found that finite carbon-black clusters play an important role in dielectric breakdown.

• 공업화학
• /
• 제23권4호
• /
• pp.372-376
• /
• 2012

탄소나노튜브는 좋은 전기 기계적 및 열적 특성을 가진 복합 재료 분야에서 가장 이상적인 나노 충전재이다. 따라서 탄소나노튜브의 복합 재료는 전도성 재료, 고강도를 가지면서 가벼운 무게를 가지는 재료에 이용된다. 탄소나노튜브 복합재료의 주요 문제점은 탄소나노튜브의 나쁜 분산에 있다. 본 연구에서는 다중벽 탄소나노튜브(MWNT)를 물리적 방법으로 전처리하였다. 전처리 후, 고분자/MWNT nanocomposites는 용해 공정에 의해 분산되었다. 물리적 방법은 고분자 wrapping 방법에 의해 준비되었다. ABS/MWNT 복합 재료의 기계적 및 전기적 특성을 SAN과 함께 wrapping된 MWNT와 미처리된 MWNT와 혼합된 ABS의 속성을 비교하여 연구하였다. MWNT가 wrapping된 복합체의 인장강도는 증가하였으나 충격강도는 감소한 수치를 보였다. 전기적 물성의 향상에는 미처리시료와 비교해 볼 때 큰 효과가 없었다.

• 폴리머
• /
• 제38권2호
• /
• pp.250-256
• /
• 2014

본 연구에서는 이축 스크류식 압출기를 이용하여 폴리프로필렌(PP)에 도전성 필러인 다중벽 탄소나노튜브 (MWNT)와 스테인레스강 단섬유(SSF)를 첨가하여 복합체를 제조하였으며, 이에 대한 표면저항 및 기계적 특성을 조사하였다. 표면저항을 측정한 결과 PP/MWNT에 소량의 SSF를 첨가하였을 때 더 낮은 MWNT 함량에서 percolation threshold가 나타났다. 그리고 제조된 복합체에 대한 인장시험 결과 순수 PP와 비교해서 파괴점 신장률은 감소하였으나 탄성률과 강도는 증가하였다. 또한 동역학분석을 통하여 MWNT와 SSF 복합체의 저장탄성률과 tan ${\delta}$에 미치는 영향을 조사하였으며, SEM을 이용하여 필러들의 모폴로지 및 복합체의 파단면을 관찰하였다.

• Composites Research
• /
• 제37권3호
• /
• pp.197-203
• /
• 2024

고분자 복합재료의 기계적 특성 향상에 유리한 탄소섬유(Carbon fiber, CF)와 전도 특성 향상에 유리한 다중벽 탄소나노튜브(Multi-walled carbon nanotube, MWCNT)의 동시 혼입을 통해 기계적, 전기적 및 열적 특성을 동시에 향상시킬 수 있다. 본 연구에서는 우수한 양산 가공성과 준수한 기계적 특성을 나타내는 탄소장섬유 열가소성플라스틱(Carbon long fiber thermoplastic, CLFT)에 MWCNT를 혼입하여 전기적 및 열적 특성 제어하였다. 제조된 복합재료의 기계적 및 전기적 특성은 필러의 혼입 양에 가장 크게 영향을 받았다. 반면, 열적 특성은 MWCNT의 혼입으로 연결된 필러 네트워크가 형성됨으로써 더 우수한 결과를 나타내었다. MWCNT 혼입 CLFT의 필러 혼입량, 필러 조성 및 필러 네트워크 구조를 조절함으로써 목적에 적합한 기계적, 전기적 및 열적 특성 제어할 수 있었다.

• Composites Research
• /
• 제32권3호
• /
• pp.127-133
• /
• 2019

탄소나노튜브는 이론적인 기계적, 전기적 물성이 우수함에도 불구하고 아직까지 그 수준에 도달하고 있지 않다. 특히나 인장 강도는 10% 미만의 수준 정도에 그치고 있어 이를 보안하기 위한 연구가 활발히 진행되고 있다. 기계적 강도를 향상하기 위한 방법으로는 긴 탄소나노튜브의 합성, 배향 외에 화학적 가교, 수소결합, 고분자 함침 등의 방법이 연구되고 있다. 본 총설 논문에서는 탄소소재의 전구체인 폴리아크릴로니트릴(PAN), 폴리도파민(PDA)을 탄소나노튜브 섬유에 코팅 또는 함침하여 탄화 공정을 거쳐 고강도 고전도성 탄소나노튜브 섬유/탄소 복합소재를 제조하는 연구를 소개하고자 한다.