• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.85-85
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• 2010

Graphene, the building block of graphite, is one of the most promising materials due to their fascinating electronic transport properties. The pseudo-two-dimensional sp2 bonding in graphene layers yields one of the most effective solid lubricants. In this poster, we present the correlation between electrical and nanomechanical properties of graphene layer grown on Cu/Ni substrate with CVD (Chemical Vapor Deposition) method. The electrical (current and conductance) and nanomechanical (adhesion and friction) properties have been investigated by the combined apparatus of friction force microscopy/conductive probe atomic force microscopy (AFM). The experiment was carried out in a RHK AFM operating in ultrahigh vacuum using cantilevers with a conductive TiN coating. The current was measured as a function of the applied load between the AFM tip and the graphene layer. The contact area has been obtained with the continuum mechanical models. We will discuss the influence of mechanical deformation on the electrical transport mechanism on graphene layers.

• Tunnel and Underground Space
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• v.5 no.2
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• pp.114-122
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• 1995

The principle and applications of GPR(Ground Penetrating Radear) are familiar to engineering geologists and geophsicists as very attractive technique for continuous high resolution images of the subsurface. However, the main limitation of GPR is obviously related to presence of clayey or silty conductive soils, resulting in complete attenuation of radar signals. This difficulty gives hesitation for the exploration of the deeper targets for example detecting bedrock, particularly in Korean situation that most regions have conductive overburden. In order to prove usefulness of geological survey with GPR in that situation, the technique was tried to investigate depth of bedrock under thick conductive overburden and the other geolocgical informations for the constructionof foundation in the Dongbu apartment site, Kimhae. The reflection patterns on the processed GPR sections are well correlated with the geotechnical units-bedrock, alluvium, landfill unit and their internal layer-boundaries of boring data before GPR survey, except upper contact of bedrock. The isopach maps of the geotechnical units for the 3-D interpretations are made from GPR sections. The maps provided useful geological information that bedrock was distributed as plain and valley with 22~27m depth under alluvium unit (this depth is 5~8 m deeper than drill log) and sedimentary layers subsided and bended along growth fault with NNE strike/15$^{\circ}$SE dip in alluvium unit.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.4
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• pp.203-208
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• 2014

In this study, Sputtering method was used to grow Al-dopes ZnO films on a CIGS absorber layer, in order to examine the effect of TCO on properties of CIGS solar cell devices. Structural, electrical and optical properties were investigated by varied thickness of Al-dopes ZnO films. Also, relation to the application as a window layer in CIGS thin film solar cell were studied. It was found that the electrical and structural properties of ZnO:Al film improved with increasing its thickness. However, the optical properties degraded. Jsc of the fabricated CIGS based solar cells was significantly influenced by the variation of the ZnO:Al window layer thickness. Because ZnO:Al window layer is one of the Rs factors in CIGS solar cell. Rs has the biggest influence on efficiency characteristic. In order to obtain high efficiency of CIGS solar cell, ZnO:Al window layer should be fabricated with electrically and optically optimized.

• Journal of Adhesion and Interface
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• v.3 no.3
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• pp.22-29
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• 2002

UV curable coating system described here consists of double layers, namely under layer and top laser coatings. The former consists of organic-inorganic conductive materials and the latter consists of multifunctional acrylates. Transparent double layer coatings were prepared on the transparent substrates i.e. PMMA, PC, PET etc. by the wet and wet coating procedure. Their surface resistances and film properties were measured as a function of the top layer thickness and relative humidity. As the thickness of the top layer was less than $10{\mu}m$, the surface resistance in the range of $10^8{\sim}10^{10}{\Omega}/cm^2$ was obtained. The surface properties of the two-layer coating were remarkably improved compared with the single layer coating. The effects of migration of conducting materials on the film properties of multilayer coating were investigated by using contact angle and Fourier transform infrared/attenuated total reflection(FT-IR/ATR). It was found that the migration of dopant(dodecyl benzenesulfonic acid, DBSA) molecules were occurred from film-substrate interface to film-air interface in the organic conductive coating system but not in the inorganic one.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.336-340
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• 2012

Wide band gap p-type hydrogenated amorphous silicon oxide (a-SiO:H) buffer layer has been used at the interface of transparent conductive oxide (TCO) and hydrogenated amorphous silicon (a-Si:H) p-type layer of a p-i-n type a-Si:H solar cell. Introduction of 5 nm thick buffer layer improves in blue response of the cell along with 0.5% enhancement of photovoltaic conversion efficiency (η). The cells with buffer layer show higher open circuit voltage (Voc), fill factor (FF), short circuit current density (Jsc) and improved blue response with respect to the cell without buffer layer.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• Smart Structures and Systems
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• v.4 no.5
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• pp.531-548
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• 2008

Recently, dense sensor instrumentation for structural health monitoring has motivated the need for novel passive wireless sensors that do not require a portable power source, such as batteries. Using a layer-by-layer self-assembly process, nano-structured multifunctional carbon nanotube-based thin film sensors of controlled morphology are fabricated. Through judicious selection of polyelectrolytic constituents, specific sensing transduction mechanisms can be encoded within these homogenous thin films. In this study, the thin films are specifically designed to change electrical properties to strain and pH stimulus. Validation of wireless communications is performed using traditional magnetic coil antennas of various turns for passive RFID (radio frequency identification) applications. Preliminary experimental results shown in this study have identified characteristic frequency and bandwidth changes in tandem with varying strain and pH, respectively. Finally, ongoing research is presented on the use of gold nanocolloids and carbon nanotubes during layer-by-layer assembly to fabricate highly conductive coil antennas for wireless communications.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.300-301
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• 2003

As the demand for high frequency(bandwidth) optical module is increased, there is a need for fabricating silicon optical bench(SiOB) with low parasitic impedance. In this paper, we discuss multi-layer structure method for manufacturing SiOB with low capacitance. This structure method decreases the capacitance between the conductive patterns for about 94∼97％ compared to the conventional structure without raising the resistivity of silicon, or increasing the thickness of the dielectric film.

• New & Renewable Energy
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• v.3 no.1 s.9
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• pp.75-82
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• 2007

Aluminum was used as metallic bipolar plate material to reduce a stack weight. The functional materials such as conductive material, Au and nonconductive material, PTFE [polytetrafluoroethylene] were coated on the bipolar plate to enhance electrical contact and corrosion prevention in PEMFC. The active area of bipolar plate is divided into the top layer part that electric current mainly passes, and the bottom layer part that gas and water pass. The bottom layer part in the flow channel needs not to have electrical conductivity because it doesn't pass electric current directly. In this reason, Au on the top layer and PTFE on the bottom layer were coated to apply high electrical conductivity and/or good corrosion resistance. Although the single cell performance using Au-PTFE/Al bipolar plate was shown 78% in comparison with that of graphite, specific power of Au-PTFE/Al bipolar plate(0.4 W/g) was twice as much as graphite bipolar plate.